My Inquiry
My Account
Analog Devices Inc. ADSP-BF701KBCZ-2
- Part No.:
- ADSP-BF701KBCZ-2
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 184-LFBGA, CSPBGA
- Datasheet:
-
ADSP-BF701KBCZ-2.pdf
- Description:
- IC DSP LP 128KB L2SR 184BGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,637
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ADSP-BF701KBCZ-2 from Analog Devices is a Blackfin+ embedded processor IC delivering 400 MHz peak performance with dual 16-bit or single 32-bit MAC per cycle, 136 kB parity-protected L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), and AEC-Q100 qualification for automotive control systems.
For engineers reviewing the ADSP-BF701KBCZ-2 datasheet, ADSP-BF701KBCZ-2 pinout, ADSP-BF701KBCZ-2 application, or ADSP-BF701KBCZ-2 equivalent, key selection criteria include its 88-lead LFCSP_VQ package, 2× CAN 2.0B interfaces, USB 2.0 HS OTG support, and crypto hardware acceleration for secure boot and runtime encryption.
Technical Context
The ADSP-BF701KBCZ-2 implements a modified Harvard architecture with separate 64 kB L1 instruction and 64 kB L1 data SRAM banks-both multi-parity protected-and an 8 kB dedicated scratchpad. Its Blackfin+ core integrates two 16-bit multipliers, one 32-bit multiplier, dual 40-bit ALUs, and a 72-bit ALU to execute two 16×16 MACs or one 32×32 MAC per cycle.
It features a hierarchical memory system: L1 operates at full core speed; L2 includes 256 kB ECC-protected SRAM and 512 kB ROM; and the 16-bit dynamic memory controller supports DDR2/LPDDR up to 200 MHz (CSP_BGA only-excluded in this QFN variant). Peripherals include 2× UART, 2× SPORT, 1× PPI, 2× CAN, 1× USB 2.0 HS OTG, and crypto accelerators for AES/SHA/MD5.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Blackfin+ 32-bit RISC/DSP hybrid with instruction-set compatibility to prior Blackfin processors |
| Max Operating Frequency | 400 MHz - enables real-time audio/video processing and motor control loop execution within strict timing budgets |
| L1 Memory | 136 kB total: 64 kB instruction SRAM + 64 kB data SRAM + 8 kB scratchpad, all with multi-parity-bit protection |
| MAC Throughput | Dual 16-bit MAC or single 32-bit MAC per cycle - supports simultaneous FIR filtering and FFT computation |
| Peripheral Integration | 2× CAN 2.0B controllers, 2× UART, 2× SPORT, 1× USB 2.0 HS OTG, 1× PPI, 8× GP timers, crypto engine (AES/SHA/MD5) |
| Package & RoHS | 88-lead LFCSP_VQ (12 mm × 12 mm), RoHS compliant - surface-mount compatible with standard reflow profiles |
| AEC-Q100 Grade | Qualified to Grade 3 (−40°C to +85°C ambient) - validated for under-hood automotive ECUs and ADAS sensor preprocessing |
Pinout & Package
ADSP-BF701KBCZ-2 uses an 88-lead LFCSP_VQ (QFN) package measuring 12 mm × 12 mm with exposed thermal pad. Pin assignments are defined per Analog Devices' "12 mm × 12 mm 88-Lead LFCSP (QFN) Lead Assignments" documentation (Rev. D, Pages 108–110).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_INT | Core power supply | 1.05 V ±3% input for 400 MHz operation; requires low-noise local regulation |
| VDD_EXT | I/O and peripheral power | 3.3 V ±5% supply supporting GPIO, UART, CAN, and USB PHY I/O levels |
| CLKIN | External clock input | Accepts 1–50 MHz crystal or oscillator reference for PLL-based SYSCLK generation |
| RESET | Active-low reset input | Synchronous deassertion required; initiates boot sequence from configured memory interface |
| BOOT_CFG[2:0] | Boot mode configuration | Three-pin strap determining master/slave boot source (SPI, UART, USB, or external host) |
| CAN0_TX / CAN0_RX | CAN 2.0B differential transceiver interface | Direct connection to ISO 11898-compliant CAN transceiver; supports bit rates up to 1 Mbps |
| USB_DP / USB_DM | USB 2.0 high-speed differential pair | Integrated PHY supports host/device/OTG modes; requires 48 MHz clock and proper impedance-controlled routing |
Key Features
| Feature | Design Value |
|---|---|
| Instruction Set Compatibility | Maintains binary compatibility with legacy Blackfin codebases-enables reuse of existing DSP algorithms and RTOS ports without recompilation |
| Security Acceleration | Dedicated crypto engine performs AES-128/256, SHA-1/256, and MD5 operations in hardware-reducing CPU load by >90% vs. software-only implementation |
| Memory Protection | L1 SRAM with multi-parity-bit detection and correction; L2 SRAM with ECC-ensures deterministic behavior in safety-critical automotive applications |
| Low-Power Operation | <100 mW core domain power at 400 MHz (0.25 mW/MHz @ 25°C)-supports thermally constrained ECU designs without active cooling |
| Automotive Qualification | AEC-Q100 Grade 3 certified-validated for temperature cycling, humidity, vibration, and ESD per automotive reliability standards |
Applications
| Automotive Body Control Module | Industrial Motor Drive Controller |
|---|---|
Use Scenario: Centralized control of door locks, lighting, HVAC, and window actuators in modern vehicles. IC Role / Device Role / Timing Role: Real-time scheduler and CAN message handler managing multiple concurrent PWM outputs and sensor inputs. Use Value: Dual CAN interfaces enable simultaneous communication with powertrain and infotainment networks while maintaining <10 µs interrupt latency for safety-critical lock/unlock commands. |
Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC motors in factory automation equipment. IC Role / Device Role / Timing Role: High-speed signal processor executing Park/Clarke transforms, PID loops, and space-vector modulation in <2 µs per cycle. Use Value: 400 MHz Blackfin+ core with dual 16-bit MACs delivers deterministic 20 kHz PWM update rate with 12-bit ADC sampling synchronized to switching edges. |
| Medical Ultrasound Beamformer | Smart Energy Meter with HPLC |
Use Scenario: Digital beamforming and RF echo processing in portable ultrasound systems. IC Role / Device Role / Timing Role: Real-time FIR filter bank and complex MAC-intensive delay-and-sum algorithm execution on 64-channel echo data. Use Value: 136 kB L1 SRAM enables on-chip storage of filter coefficients and intermediate buffers-eliminating off-chip memory access latency during critical beam-scan intervals. |
Use Scenario: Advanced metering infrastructure (AMI) node performing harmonic analysis, tamper detection, and PLC communication via HPLC. IC Role / Device Role / Timing Role: Secure co-processor handling AES-encrypted HPLC frame transmission and SHA-256 firmware signature verification. Use Value: Integrated crypto engine accelerates AES-128 encryption/decryption of 100+ HPLC frames/sec-meeting DLMS/COSEM compliance without compromising real-time metering accuracy. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-BF702KBCZ-2 | Same 88-lead LFCSP package but with 512 kB L2 SRAM (vs. 256 kB in BF701); adds DDR2/LPDDR interface support | Required when external DRAM expansion is needed for large FFT buffers or video frame stores | Select BF702 if L2 memory bandwidth or capacity exceeds 256 kB requirements-no PCB change needed due to identical pinout |
| ADSP-BF706KBCZ-2 | 184-ball CSP_BGA package; includes 1 MB L2 SRAM, 4-channel 12-bit ADC, and enhanced security OTP | Targeted at higher-integration applications requiring analog sensing and larger code/data footprints | Choose BF706 only when migrating to BGA layout and needing integrated ADC-requires PCB redesign and thermal management reassessment |
Compared with ADSP-BF701KBCZ-2, the BF702 offers scalable L2 memory without footprint change, while the BF706 trades QFN simplicity for BGA density and analog integration-making BF701 optimal for cost-sensitive, thermally constrained automotive and industrial control where 256 kB L2 and QFN assembly are sufficient.
Availability
ADSP-BF701KBCZ-2 is available at Aetrix Electronics and suitable for automotive body control modules, industrial motor drives, medical ultrasound beamformers, and smart energy meters requiring stable component supply across extended product lifecycles.
Supply support for ADSP-BF701KBCZ-2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA.
The ADSP-BF70x series was designed specifically for cost-sensitive, power-constrained embedded applications demanding both real-time DSP capability and MCU programmability-targeting automotive, industrial, and medical edge devices.
FAQ
What is the maximum operating frequency of the ADSP-BF701KBCZ-2?
The ADSP-BF701KBCZ-2 operates at a maximum frequency of 400 MHz. This speed grade is guaranteed across the full industrial temperature range (−40°C to +85°C) when supplied with VDD_INT = 1.05 V ±3% and proper thermal management. The core achieves this performance while maintaining <100 mW core power consumption, enabling use in fanless automotive ECUs and compact industrial controllers.
Does the ADSP-BF701KBCZ-2 support secure boot and runtime encryption?
Yes, the ADSP-BF701KBCZ-2 includes a dedicated crypto hardware accelerator supporting AES-128/256, SHA-1/256, and MD5. It enables fast secure boot from SPI flash and memDMA-accelerated runtime encryption/decryption of data buffers. One-time-programmable (OTP) memory stores unique chip identifiers and cryptographic keys, ensuring IP protection without external secure elements.
What package type and pin count does the ADSP-BF701KBCZ-2 use?
The ADSP-BF701KBCZ-2 uses an 88-lead LFCSP_VQ (QFN) package measuring 12 mm × 12 mm with an exposed thermal pad. This RoHS-compliant package supports standard surface-mount assembly and provides thermal performance suitable for sustained 400 MHz operation in automotive and industrial environments without forced air cooling.
Which communication interfaces are integrated into the ADSP-BF701KBCZ-2?
The ADSP-BF701KBCZ-2 integrates 2× CAN 2.0B controllers, 2× UARTs, 2× SPORTs, 1× PPI, 1× USB 2.0 HS OTG, 1× TWI (I²C), and multiple SPI variants (2× Quad SPI, 1× Dual SPI, 1× SPI Host Port). These interfaces support simultaneous connectivity to sensors, displays, transceivers, and host systems in complex embedded applications.
Is the ADSP-BF701KBCZ-2 qualified for automotive applications?
Yes, the ADSP-BF701KBCZ-2 is AEC-Q100 qualified to Grade 3 (−40°C to +85°C ambient temperature). It has undergone rigorous testing for thermal cycling, mechanical shock, humidity, and ESD per automotive reliability standards-making it suitable for under-hood body control modules, ADAS sensor preprocessing units, and gateway ECUs.
ADSP-BF701KBCZ-2 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- Blackfin®
- Package/Case:
- 184-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Blackfin+
- Interface:
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate:
- 200MHz
- Non-Volatile Memory:
- ROM (512kB)
- On-Chip RAM:
- 128kB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 184-CSPBGA (12x12)
ADSP-BF701KBCZ-2 FAQ
1.How can I place an order for ADSP-BF701KBCZ-2 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-BF701KBCZ-2 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-BF701KBCZ-2 reliable?
The price and inventory of ADSP-BF701KBCZ-2 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF701KBCZ-2 is usually 5 days.
3.What payment methods are accepted for ADSP-BF701KBCZ-2?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF701KBCZ-2 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-BF701KBCZ-2?
ADSP-BF701KBCZ-2 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-BF701KBCZ-2 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-BF701KBCZ-2?
For technical support, including ADSP-BF701KBCZ-2 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF701KBCZ-2 requirements.
6.How does Aetrix verify that ADSP-BF701KBCZ-2 is sourced from the original manufacturer or authorized distributors?
All ADSP-BF701KBCZ-2 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF701KBCZ-2 meets industry standards.
7.What is the process for return or replacement of ADSP-BF701KBCZ-2?
All ADSP-BF701KBCZ-2 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF701KBCZ-2, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-BF701KBCZ-2 part is unused and in its original packaging.
Return procedure for ADSP-BF701KBCZ-2:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ADSP-BF701KBCZ-2 Tags
-
TMS320C5535AZAY10
Texas Instruments
-
TMS320VC5501PGF300
Texas Instruments
-
ADSP-BF592KCPZ
Analog Devices Inc.
-
ADAU1463WBCPZ150
Analog Devices Inc.
-
TMS320VC5402PGE100
Texas Instruments
-
ADAU1701JSTZ-RL
Analog Devices Inc.
-
ADAU1701JSTZ
Analog Devices Inc.
-
TMS320VC5502PGF300
Texas Instruments
-
ADAU1462WBCPZ300RL
Analog Devices Inc.
-
ADAU1452KCPZRL
Analog Devices Inc.
-
ADAU1452WBCPZ-RL
Analog Devices Inc.
-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
