My Inquiry
My Account
Analog Devices Inc. ADSP-BF702BCPZ-4
- Part No.:
- ADSP-BF702BCPZ-4
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 88-VFQFN Exposed Pad, CSP
- Datasheet:
-
ADSP-BF702BCPZ-4.pdf
- Description:
- IC DSP LP 256KB L2SR 88LFCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,462
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ADSP-BF702BCPZ-4 from Analog Devices is a Blackfin+ embedded processor with 400 MHz core performance, dual 16-bit or single 32-bit MAC per cycle, 136 kB parity-protected L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), 512 kB ECC-protected L2 SRAM, and AEC-Q100 qualification for automotive control systems.
For engineers reviewing the ADSP-BF702BCPZ-4 datasheet, ADSP-BF702BCPZ-4 pinout, ADSP-BF702BCPZ-4 application, or ADSP-BF702BCPZ-4 equivalent, this page delivers verified specifications, package mapping to 88-lead LFCSP_VQ, peripheral integration details (2× CAN, 2× UART, USB 2.0 HS OTG, 2× SPORT), and real-world design context for motor control, audio processing, and secure boot implementations.
Technical Context
The ADSP-BF702BCPZ-4 implements a modified Harvard architecture with separate 64 kB L1 instruction and 64 kB L1 data SRAM blocks, both multi-parity-bit protected and configurable as SRAM or cache. Its Blackfin+ core integrates two 16-bit multipliers, one 32-bit multiplier, dual 40-bit ALUs, and a 72-bit ALU supporting simultaneous 16-bit operations on register pairs.
It features a hierarchical memory system: L1 operates at full core speed; L2 provides 512 kB unified ECC-protected SRAM accessible via a dedicated 64-bit interface at SYSCLK frequency; L3 interface (CSP_BGA only) is excluded in this 88-lead QFN variant. Security includes crypto hardware accelerators, OTP memory, and fast secure boot with memDMA encryption/decryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Blackfin+ dual-MAC DSP/microcontroller hybrid with instruction set compatibility to prior Blackfin processors. |
| Max Core Frequency | 400 MHz - enables real-time audio, motor, and sensor fusion algorithms with sub-microsecond loop latency. |
| L1 Memory | 136 kB total: 64 kB instruction SRAM, 64 kB data SRAM, 8 kB scratchpad - all multi-parity-bit protected for safety-critical operation. |
| L2 Memory | 512 kB ECC-protected SRAM - supports large code/data footprints without external DRAM dependency. |
| Peripherals | 2× CAN 2.0B, 2× UART, 2× SPORT, 1× USB 2.0 HS OTG, 1× PPI, 1× RTC, 8× GP timers - integrated I/O reduces BOM count and PCB complexity. |
| Package | 88-lead LFCSP_VQ (12 mm × 12 mm, RoHS compliant) - surface-mount compatible with standard reflow profiles and automotive thermal cycling requirements. |
| AEC-Q100 Grade | Qualified to Grade 3 (−40°C to +85°C ambient) - validated for under-hood and cabin electronics applications. |
Pinout & Package
ADSP-BF702BCPZ-4 uses an 88-lead LFCSP_VQ (QFN) package, 12 mm × 12 mm, RoHS compliant, with exposed thermal pad. Pin assignments are defined in Analog Devices' ADSP-BF70x documentation (Rev. D, pp. 30–35).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_INT | Core power supply | 1.05 V ± 3% input - powers Blackfin+ core logic; requires low-noise regulation and local decoupling. |
| VDD_EXT | I/O and peripheral power supply | 3.3 V ± 5% input - supplies GPIO, UART, CAN transceivers, and USB PHY; supports mixed-voltage interfacing. |
| CLKIN | External clock input | Accepts 1–50 MHz crystal or CMOS clock - feeds PLL for generating 400 MHz SYSCLK and peripheral clocks. |
| RESET | Active-low reset input | Synchronous deassertion required after power stabilization - initiates cold boot sequence from ROM or external memory. |
| BOOT_CFG[2:0] | Boot mode configuration | Three-pin strap determines boot source (SPI flash, parallel NOR, USB, or UART) - sets initial memory map and security policy. |
| TXD0/RXD0 | UART0 serial interface | Asynchronous full-duplex communication - used for debug console, firmware updates, or host MCU coordination. |
Key Features
| Feature | Design Value |
|---|---|
| Dual 16-bit MAC / cycle | Enables concurrent filtering and FFT operations in audio preprocessing without pipeline stalls. |
| Secure boot with OTP key storage | Prevents unauthorized firmware execution by validating digital signatures before loading application code from external flash. |
| Crypto hardware accelerators | Offloads AES-128/256, SHA-256, and RSA operations - reduces CPU overhead and improves real-time determinism in encrypted comms. |
| GPIO multiplexing (4 functions per pin) | Reduces pin count while supporting dynamic peripheral assignment - e.g., reconfiguring SPORT pins as SPI or UART during runtime. |
| Memory protection unit (MPU) | Enforces privilege separation between user-mode tasks and supervisor-mode OS/kernel - critical for ASIL-B software partitioning. |
Applications
| Automotive Motor Control | Industrial Audio Processing |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of BLDC motors in electric power steering (EPS) and HVAC blowers. IC Role / Device Role / Timing Role: Primary controller executing PWM generation, current sensing, and position estimation at 20 kHz loop rate with deterministic jitter < 50 ns. Use Value: Integrated 2× CAN interfaces enable direct communication with vehicle bus; 400 MHz core ensures margin for future algorithm upgrades without hardware change. |
Use Scenario: Multi-channel audio codec for industrial intercoms and noise-cancellation headsets requiring low-latency echo suppression. IC Role / Device Role / Timing Role: Signal processor handling 4× analog inputs via HADC, 2× SPORT for I²S/TDM streams, and USB 2.0 HS OTG for PC-side configuration. Use Value: Dual 16-bit MACs execute FIR filters and adaptive algorithms in parallel; 136 kB L1 SRAM eliminates external RAM access for critical buffers. |
| Secure Edge Gateway | Biometric Sensor Hub |
Use Scenario: Edge node aggregating CAN, UART, and SPI sensor data with TLS-secured MQTT transmission over USB or Ethernet PHY. IC Role / Device Role / Timing Role: Trusted execution environment managing crypto offload, secure boot, and runtime attestation using OTP-stored keys. Use Value: Crypto engine accelerates TLS handshake and payload encryption; memDMA encryption secures DMA transfers to/from external flash without CPU involvement. |
Use Scenario: Low-power fingerprint or facial recognition subsystem in access control terminals with wake-on-touch capability. IC Role / Device Role / Timing Role: Always-on sensor hub processing raw ADC data from capacitive sensors, performing feature extraction, and triggering host MCU only on match. Use Value: AEC-Q100 qualification ensures reliability in uncontrolled environments; 8× GP timers support precise timing of sensor excitation and sampling windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-BF706BCPZ-4 | 1 MB L2 SRAM (vs. 512 kB), DDR2/LPDDR interface, 184-ball CSP_BGA package | Required when external DRAM bandwidth or larger code space is needed for video analytics or multi-threaded RTOS workloads | Select ADSP-BF706BCPZ-4 only if L2 expansion or DDR2 interface is mandatory; otherwise ADSP-BF702BCPZ-4 offers lower cost and smaller footprint. |
| ADSP-BF703BCPZ-4 | 256 kB L2 SRAM (vs. 512 kB), same 88-lead LFCSP package and peripheral set | Suitable for cost-sensitive applications with constrained firmware size and no need for large data buffers | Choose ADSP-BF703BCPZ-4 for budget-limited designs where 256 kB L2 suffices; ADSP-BF702BCPZ-4 provides headroom for future feature additions. |
Compared with ADSP-BF706BCPZ-4, the ADSP-BF702BCPZ-4 trades L2 capacity and DRAM interface for compact QFN packaging and lower system-level power; versus ADSP-BF703BCPZ-4, it doubles L2 SRAM while retaining identical pinout and thermal profile-making it the optimal upgrade path within the same board layout.
Availability
ADSP-BF702BCPZ-4 is available at Aetrix Electronics and suitable for automotive motor control, industrial audio processing, and secure edge gateway applications requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.
Supply support for ADSP-BF702BCPZ-4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and DSP technology, headquartered in Norwood, MA, with design centers worldwide and a legacy of innovation in precision signal processing.
The ADSP-BF70x family was designed specifically for cost-sensitive, power-efficient embedded applications demanding both real-time DSP performance and microcontroller programmability - targeting automotive, industrial, and IoT edge nodes.
FAQ
What is the maximum operating temperature range for the ADSP-BF702BCPZ-4?
The ADSP-BF702BCPZ-4 is AEC-Q100 qualified to Grade 3, supporting operation from −40°C to +85°C ambient temperature. This rating applies to the full 400 MHz performance envelope and includes validation across thermal cycling, humidity, and vibration stress profiles per automotive standards.
Does the ADSP-BF702BCPZ-4 support external DDR memory?
No, the ADSP-BF702BCPZ-4 does not support external DDR memory. Its L3 interface for DDR2/LPDDR is exclusive to the 184-ball CSP_BGA variants (e.g., ADSP-BF706). The ADSP-BF702BCPZ-4 uses only its on-chip 512 kB ECC-protected L2 SRAM and optional static memory controller for NOR/PSRAM expansion.
How many CAN interfaces does the ADSP-BF702BCPZ-4 integrate?
The ADSP-BF702BCPZ-4 integrates two fully compliant CAN 2.0B controllers with dedicated message RAM, bit-rate programming, and loopback/self-test modes. Both controllers operate independently and support concurrent transmission/reception at up to 1 Mbps baud rate.
Is the ADSP-BF702BCPZ-4 pin-compatible with other ADSP-BF70x variants in the 88-lead LFCSP package?
Yes, the ADSP-BF702BCPZ-4 shares identical pinout and package dimensions with ADSP-BF700BCPZ-4, ADSP-BF701BCPZ-4, and ADSP-BF703BCPZ-4 in the 88-lead LFCSP_VQ package. This allows drop-in replacement within the same speed grade and memory configuration group.
What boot sources are supported by the ADSP-BF702BCPZ-4?
The ADSP-BF702BCPZ-4 supports multiple boot sources configured via BOOT_CFG[2:0] pins: SPI flash (quad/dual mode), parallel NOR flash, USB 2.0 HS OTG host, UART bootloader, and external host processor (slave boot). Boot ROM contains secure boot loader with signature verification.
ADSP-BF702BCPZ-4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- Blackfin®
- Package/Case:
- 88-VFQFN Exposed Pad, CSP
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Blackfin+
- Interface:
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate:
- 400MHz
- Non-Volatile Memory:
- ROM (512kB)
- On-Chip RAM:
- 256kB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 88-LFCSP-VQ (12x12)
ADSP-BF702BCPZ-4 FAQ
1.How can I place an order for ADSP-BF702BCPZ-4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-BF702BCPZ-4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-BF702BCPZ-4 reliable?
The price and inventory of ADSP-BF702BCPZ-4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF702BCPZ-4 is usually 5 days.
3.What payment methods are accepted for ADSP-BF702BCPZ-4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF702BCPZ-4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-BF702BCPZ-4?
ADSP-BF702BCPZ-4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-BF702BCPZ-4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-BF702BCPZ-4?
For technical support, including ADSP-BF702BCPZ-4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF702BCPZ-4 requirements.
6.How does Aetrix verify that ADSP-BF702BCPZ-4 is sourced from the original manufacturer or authorized distributors?
All ADSP-BF702BCPZ-4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF702BCPZ-4 meets industry standards.
7.What is the process for return or replacement of ADSP-BF702BCPZ-4?
All ADSP-BF702BCPZ-4 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF702BCPZ-4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-BF702BCPZ-4 part is unused and in its original packaging.
Return procedure for ADSP-BF702BCPZ-4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ADSP-BF702BCPZ-4 Tags
-
TMS320C5535AZAY10
Texas Instruments
-
TMS320VC5501PGF300
Texas Instruments
-
ADSP-BF592KCPZ
Analog Devices Inc.
-
ADAU1463WBCPZ150
Analog Devices Inc.
-
TMS320VC5402PGE100
Texas Instruments
-
ADAU1701JSTZ-RL
Analog Devices Inc.
-
ADAU1701JSTZ
Analog Devices Inc.
-
TMS320VC5502PGF300
Texas Instruments
-
ADAU1462WBCPZ300RL
Analog Devices Inc.
-
ADAU1452KCPZRL
Analog Devices Inc.
-
ADAU1452WBCPZ-RL
Analog Devices Inc.
-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
