My Inquiry
My Account
Analog Devices Inc. ADSP-BF702KCPZ-3
- Part No.:
- ADSP-BF702KCPZ-3
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 88-VFQFN Exposed Pad, CSP
- Datasheet:
-
ADSP-BF702KCPZ-3.pdf
- Description:
- IC DSP LP 256KB L2SR 88LFCSP
- Quantity:
- Payment:
- Shipping:
Inventory:1,443
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ADSP-BF702KCPZ-3 from Analog Devices is a Blackfin+ embedded processor IC featuring a 400 MHz dual-MAC core, 136 kB parity-protected L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), 512 kB ECC-protected L2 SRAM, and AEC-Q100 qualification for automotive control systems. It integrates dual CAN 2.0B controllers, USB 2.0 HS OTG, two UARTs, two SPORTs, and hardware crypto acceleration for secure boot and runtime encryption.
For engineers reviewing the ADSP-BF702KCPZ-3 datasheet, ADSP-BF702KCPZ-3 pinout, ADSP-BF702KCPZ-3 application, or ADSP-BF702KCPZ-3 equivalent, key selection considerations include its 88-lead LFCSP_VQ package, 400 MHz real-time signal processing capability, dual-CAN/USB 2.0 HS OTG peripheral set, and automotive-grade reliability with <100 mW core power at full speed.
Technical Context
The ADSP-BF702KCPZ-3 implements a modified Harvard architecture with separate 64 kB L1 instruction and 64 kB L1 data SRAM banks, each supporting multi-parity-bit protection and configurable cache modes. Its Blackfin+ core executes two 16-bit MACs or one 32-bit MAC per cycle, with 40-bit accumulators, video ALUs, and branch prediction-while maintaining binary compatibility with prior Blackfin instruction sets.
Peripherals are routed via a system fabric with dedicated DMA channels: three MDMA controllers, two SPI hosts (including quad/dual variants), SD/SDIO (MSI) interface, and a dynamic memory controller supporting DDR2/LPDDR only in CSP_BGA packages-excluded in this 88-lead LFCSP variant. Security is enforced through OTP memory, crypto accelerators, and memDMA encryption/decryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Blackfin+ 32-bit RISC/DSP hybrid with dual 16-bit MAC + single 32-bit MAC per cycle |
| Max Operating Frequency | 400 MHz SYSCLK - enables real-time audio/video analytics and motor control loop execution |
| L1 Memory | 136 kB total: 64 kB instruction SRAM + 64 kB data SRAM + 8 kB scratchpad, all with multi-parity-bit protection |
| L2 Memory | 512 kB ECC-protected SRAM - provides error-correcting code for safety-critical firmware/data storage |
| Package | 88-lead LFCSP_VQ (12 mm × 12 mm, RoHS compliant) - surface-mount compatible with standard reflow profiles |
| Automotive Qualification | AEC-Q100 Grade 3 (−40°C to +125°C) - validated for under-hood and body-control module deployment |
| Power Efficiency | <100 mW core domain power at 400 MHz (0.25 mW/MHz @ 25°C) - reduces thermal design complexity in sealed enclosures |
Pinout & Package
ADSP-BF702KCPZ-3 is housed in an 88-lead LFCSP_VQ (QFN) package measuring 12 mm × 12 mm with exposed thermal pad. Pin assignments follow Analog Devices' documented lead numbering for this variant, supporting GPIO multiplexing across 43 dedicated I/O pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_INT | Core power supply | 1.05 V ±3% input for processor core logic - requires low-noise regulation and local decoupling |
| VDD_EXT | I/O power supply | 3.3 V ±5% input for peripherals and GPIO - supports mixed-voltage interfacing with external sensors/actuators |
| CLKIN | External clock input | Accepts 1–50 MHz crystal or CMOS clock - feeds PLL for internal SYSCLK generation up to 400 MHz |
| RESET | Active-low reset input | Synchronous deassertion required after power stabilization - initiates secure boot sequence from L2 ROM |
| BOOT_CFG[2:0] | Boot mode configuration | Three-pin strap determines boot source (SPI flash, USB, UART, or external host) - defines initial memory map layout |
| TXD0/RXD0 | UART0 serial interface | Full-duplex asynchronous communication channel - used for debug console or host command interface |
| CAN0H/CAN0L | CAN 2.0B differential pair | ISO 11898-2 compliant physical layer interface - enables robust vehicle network messaging at up to 1 Mbps |
| USB_DP/USB_DM | USB 2.0 HS differential pair | High-speed (480 Mbps) OTG-capable interface - supports device/host roles and battery charging detection |
Key Features
| Feature | Design Value |
|---|---|
| Dual CAN 2.0B controllers | Enables concurrent communication on two automotive networks - supports message filtering, FIFO buffering, and error confinement |
| Hardware crypto engine | Accelerates AES-128/256, SHA-256, and RSA operations - offloads security tasks from CPU to enable deterministic real-time response |
| memDMA encryption/decryption | Secures data transfers between L1/L2 memory and peripherals without software overhead - essential for OTA firmware updates |
| Fast secure boot from L2 ROM | Verifies signed bootloader image before execution - prevents unauthorized firmware execution and establishes root-of-trust |
| 8-channel general-purpose timers | Supports PWM generation, input capture, and periodic interrupt generation - ideal for motor phase timing and sensor sampling synchronization |
Applications
| Automotive Body Control Module | Industrial Motor Drive Controller |
|---|---|
Use Scenario: Centralized control of door locks, lighting, window lifts, and HVAC actuators in modern vehicles. IC Role / Device Role / Timing Role: Real-time coordinator executing CAN-based command arbitration, PWM-driven actuator control, and fault-safe state monitoring. Use Value: AEC-Q100 qualification ensures operation across −40°C to +125°C; dual CAN interfaces reduce wiring harness complexity while enabling redundant communication paths. | Use Scenario: Closed-loop vector control of 3-phase PMSM/BLDC motors in factory automation equipment. IC Role / Device Role / Timing Role: High-precision timing engine generating synchronized PWM signals (≤100 ns jitter), sampling ADCs, and executing FOC algorithms at 400 MHz. Use Value: Dual 16-bit MACs execute motor control math in ≤1 µs per cycle; 136 kB protected L1 SRAM stores critical control variables with parity detection. |
| Secure Edge Gateway for IIoT | Biometric Sensor Hub |
Use Scenario: Field-deployable gateway aggregating Modbus, CAN, and analog sensor data before TLS-encrypted transmission to cloud platforms. IC Role / Device Role / Timing Role: Secure data concentrator performing protocol translation, local policy enforcement, and encrypted storage using hardware crypto accelerators. Use Value: OTP memory stores unique device identity; memDMA encryption secures data movement between sensors and LPDDR (via external interface); USB 2.0 HS enables fast firmware recovery. | Use Scenario: Low-power wearable device fusing fingerprint, PPG, and accelerometer data for liveness detection and health analytics. IC Role / Device Role / Timing Role: Ultra-low-latency sensor fusion processor running real-time biometric algorithms with deterministic interrupt latency. Use Value: <100 mW core power at 400 MHz extends battery life; 8-channel timers synchronize multi-sensor sampling; L1 scratchpad minimizes cache misses during algorithm execution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-BF706KCPZ-3 | 1 MB L2 SRAM (vs. 512 kB), adds L3 DDR2/LPDDR interface, 184-ball CSP_BGA only | Targeted at systems requiring external DRAM expansion and higher memory bandwidth | Select when >512 kB on-chip SRAM is insufficient and board layout accommodates BGA |
| ADSP-BF702KCPZ-4 | Same silicon, rated for 400 MHz but specified at 200 MHz max operating frequency | Lower-cost option for non-performance-critical applications where thermal/power margins are constrained | Select when 200 MHz sustained throughput meets requirements and cost optimization is prioritized |
Compared with ADSP-BF702KCPZ-3, ADSP-BF706KCPZ-3 offers double L2 capacity and external DRAM support at the cost of larger footprint and no LFCSP option, while ADSP-BF702KCPZ-4 trades peak performance for reduced power and cost-making the -3 variant optimal for balanced real-time signal processing in space-constrained automotive modules.
Availability
ADSP-BF702KCPZ-3 is available at Aetrix Electronics and suitable for automotive body control, industrial motor drives, secure edge gateways, and biometric sensor hubs requiring stable component supply and long-term lifecycle assurance.
Supply support for ADSP-BF702KCPZ-3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA.
The ADSP-BF70x product line delivers automotive-qualified, low-power Blackfin+ processors optimized for real-time embedded control, sensor fusion, and secure connectivity in safety-aware systems.
FAQ
What is the maximum operating frequency of the ADSP-BF702KCPZ-3?
The ADSP-BF702KCPZ-3 is rated for a maximum operating frequency of 400 MHz SYSCLK. This speed is achievable under specified thermal conditions (TJ ≤ 125°C) and power supply tolerances (VDD_INT = 1.05 V ±3%). At this rate, the Blackfin+ core executes two 16-bit MAC operations or one 32-bit MAC operation per cycle, enabling deterministic real-time processing for motor control and audio analytics. The ADSP-BF702KCPZ-3 maintains full instruction set compatibility with earlier Blackfin processors.
Does the ADSP-BF702KCPZ-3 support external DDR memory?
No, the ADSP-BF702KCPZ-3 does not support external DDR or LPDDR memory. That capability is exclusive to the 184-ball CSP_BGA package variants (e.g., ADSP-BF706KCPZ-3). The ADSP-BF702KCPZ-3 uses an 88-lead LFCSP_VQ package and relies solely on its on-chip memory subsystem: 136 kB protected L1 SRAM and 512 kB ECC-protected L2 SRAM. External memory expansion must use the Static Memory Controller (SMC) for NOR/NAND flash or SRAM devices.
What security features are integrated into the ADSP-BF702KCPZ-3?
The ADSP-BF702KCPZ-3 includes hardware-based security features: a crypto engine supporting AES-128/256, SHA-256, and RSA; 1 kB one-time-programmable (OTP) memory storing unique chip ID; fast secure boot verifying signed images from L2 ROM; and memDMA encryption/decryption for runtime data protection. These features enable secure firmware updates, IP protection, and trusted execution environments-all without software overhead. The ADSP-BF702KCPZ-3 leverages these capabilities to meet automotive and industrial security requirements.
How many CAN interfaces does the ADSP-BF702KCPZ-3 provide?
The ADSP-BF702KCPZ-3 integrates two independent CAN 2.0B controllers, each with dedicated transmit/receive buffers, message filtering, and error handling logic. Both interfaces support bit rates up to 1 Mbps and comply with ISO 11898-2 physical layer specifications. These dual CAN peripherals allow the ADSP-BF702KCPZ-3 to serve as a central node in distributed automotive networks-such as connecting body control modules to powertrain or infotainment domains-without requiring external CAN transceivers beyond physical layer drivers.
Is the ADSP-BF702KCPZ-3 qualified for automotive applications?
Yes, the ADSP-BF702KCPZ-3 is AEC-Q100 qualified for automotive applications (Grade 3: −40°C to +125°C junction temperature). It undergoes stress testing for temperature cycling, humidity, and mechanical shock per AEC standards. This qualification validates its suitability for under-hood and cabin-mounted electronic control units-including body control modules, seat/mirror controllers, and ADAS sensor preprocessing units-where reliability across extreme environmental conditions is mandatory. The ADSP-BF702KCPZ-3's design incorporates parity-protected L1 memory and ECC-protected L2 SRAM to further enhance functional safety.
ADSP-BF702KCPZ-3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- Blackfin®
- Package/Case:
- 88-VFQFN Exposed Pad, CSP
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Blackfin+
- Interface:
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate:
- 300MHz
- Non-Volatile Memory:
- ROM (512kB)
- On-Chip RAM:
- 256kB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 88-LFCSP-VQ (12x12)
ADSP-BF702KCPZ-3 FAQ
1.How can I place an order for ADSP-BF702KCPZ-3 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-BF702KCPZ-3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-BF702KCPZ-3 reliable?
The price and inventory of ADSP-BF702KCPZ-3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF702KCPZ-3 is usually 5 days.
3.What payment methods are accepted for ADSP-BF702KCPZ-3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF702KCPZ-3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-BF702KCPZ-3?
ADSP-BF702KCPZ-3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-BF702KCPZ-3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-BF702KCPZ-3?
For technical support, including ADSP-BF702KCPZ-3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF702KCPZ-3 requirements.
6.How does Aetrix verify that ADSP-BF702KCPZ-3 is sourced from the original manufacturer or authorized distributors?
All ADSP-BF702KCPZ-3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF702KCPZ-3 meets industry standards.
7.What is the process for return or replacement of ADSP-BF702KCPZ-3?
All ADSP-BF702KCPZ-3 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF702KCPZ-3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-BF702KCPZ-3 part is unused and in its original packaging.
Return procedure for ADSP-BF702KCPZ-3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ADSP-BF702KCPZ-3 Tags
-
TMS320C5535AZAY10
Texas Instruments
-
TMS320VC5501PGF300
Texas Instruments
-
ADSP-BF592KCPZ
Analog Devices Inc.
-
ADAU1463WBCPZ150
Analog Devices Inc.
-
TMS320VC5402PGE100
Texas Instruments
-
ADAU1701JSTZ-RL
Analog Devices Inc.
-
ADAU1701JSTZ
Analog Devices Inc.
-
TMS320VC5502PGF300
Texas Instruments
-
ADAU1462WBCPZ300RL
Analog Devices Inc.
-
ADAU1452KCPZRL
Analog Devices Inc.
-
ADAU1452WBCPZ-RL
Analog Devices Inc.
-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
