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Home > Products > Integrated Circuits (ICs) > Embedded > DSP (Digital Signal Processors)

Analog Devices Inc. ADSP-BF702KCPZ-4

Name: ADSP-BF702KCPZ-4
Brand: Analog Devices Inc.
SKU: ADSP-BF702KCPZ-4
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: ADSP-BF702KCPZ-4

Manufacturer:: Analog Devices Inc.

Category:: DSP (Digital Signal Processors)

Package:: 88-VFQFN Exposed Pad, CSP

Datasheet:: ADSP-BF702KCPZ-4.pdf

Description:: IC DSP LP 256KB L2SR 88LFCSP

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Product details

Overview

ADSP-BF702KCPZ-4 from Analog Devices is a Blackfin+ embedded processor IC delivering 400 MHz peak performance with dual 16-bit or single 32-bit MAC per cycle, 136 kB parity-protected L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), and AEC-Q100 qualification for automotive control systems. It integrates crypto accelerators, 2× CAN, 2× UART, USB 2.0 HS OTG, and 256 kB ECC-protected L2 SRAM.

For engineers reviewing the ADSP-BF702KCPZ-4 datasheet, ADSP-BF702KCPZ-4 pinout, ADSP-BF702KCPZ-4 application, or ADSP-BF702KCPZ-4 equivalent, key selection considerations include its 88-lead LFCSP_VQ package, 400 MHz Blackfin+ core, automotive-grade reliability, integrated security features (OTP, fast secure boot, memDMA encryption), and peripheral set optimized for real-time signal processing in safety-critical embedded systems.

Technical Context

The ADSP-BF702KCPZ-4 implements a modified Harvard architecture with separate 64 kB L1 instruction and 64 kB L1 data SRAM blocks-both multi-parity-bit protected-and an 8 kB scratchpad SRAM. Its Blackfin+ core executes two 16-bit MACs or one 32-bit MAC per cycle, supports 16-bit complex MAC, branch prediction, and maintains full instruction-set compatibility with prior Blackfin processors.

It features a dedicated 64-bit interface to up to 1 MB of ECC-protected L2 SRAM, a 512 kB on-chip ROM, and a 16-bit L3 interface (CSP_BGA only) for DDR2/LPDDR; however, the ADSP-BF702KCPZ-4 uses the 88-lead LFCSP_VQ package and omits L3 support. Peripheral integration includes hardware crypto engines, 2× CAN 2.0B controllers, 2× SPORTs, PPI, MSI (SD/SDIO), and a static memory controller supporting external NOR/NAND/ROM devices.

Key Specifications

Parameter	Value and Actual Design Meaning
Core Architecture	Blackfin+ 32-bit RISC/DSP hybrid core with dual 16-bit MAC or single 32-bit MAC per cycle; enables simultaneous signal processing and control tasks without software overhead.
Max Operating Frequency	400 MHz SYSCLK; delivers 400 MMAC/s peak compute throughput for real-time audio, motor, or sensor fusion algorithms.
L1 Memory	136 kB total: 64 kB instruction SRAM, 64 kB data SRAM, 8 kB scratchpad-all with multi-parity-bit protection for SEU resilience in automotive environments.
L2 Memory	256 kB ECC-protected SRAM; provides deterministic low-latency access for critical code/data, eliminating DRAM dependency in cost-sensitive designs.
Package & Pin Count	88-lead LFCSP_VQ (12 mm × 12 mm); RoHS-compliant, thermally enhanced QFN suitable for compact automotive ECUs and industrial controllers.
Automotive Qualification	AEC-Q100 Grade 3 (−40°C to +85°C); certified for use in non-safety-critical but reliability-demanding automotive subsystems including body control and infotainment.
Security Features	OTP memory (1 kB), hardware crypto accelerators (AES/SHA/RSA), fast secure boot, and memDMA encryption/decryption for runtime IP protection and firmware integrity.

Pinout & Package

ADSP-BF702KCPZ-4 is housed in an 88-lead LFCSP_VQ (QFN) package measuring 12 mm × 12 mm with exposed thermal pad. This RoHS-compliant package supports high-density PCB layouts and efficient thermal dissipation in fanless automotive and industrial applications.

Pin/Terminal	Circuit Role	Design Meaning
VDD_INT	Core power supply	1.05 V ± 3% supply for Blackfin+ core; requires low-noise regulation and local decoupling to maintain timing integrity at 400 MHz.
VDD_IO	I/O power supply	3.3 V ± 5% supply for all digital I/O banks; supports mixed-voltage interfacing with peripherals and memory devices.
CLKIN	External clock input	Accepts 1–50 MHz crystal or oscillator input; feeds internal PLL to generate 400 MHz SYSCLK and other system clocks.
RESET	Active-low reset input	Synchronous deassertion required after power stabilization; initiates cold boot sequence from configured boot source (SPI, UART, etc.).
BMODE[2:0]	Boot mode configuration	Three-pin strap determines boot source (e.g., SPI master, UART slave); latched at reset and defines initial memory map and execution start address.
SPORT0_DA	Serial port 0 data line	Full-duplex synchronous serial interface supporting I²S, TDM, or AC97 protocols for audio codec interfacing.
CAN0_TX / CAN0_RX	CAN 2.0B transceiver interface	Differential pair for Controller Area Network communication; compliant with ISO 11898-1, supports bit rates up to 1 Mbps.

Key Features

Feature	Design Value
Dual 16-bit MAC per cycle	Enables real-time FIR/IIR filtering, FFT, and motor control loop execution within strict timing budgets without offloading.
136 kB L1 SRAM with multi-parity protection	Eliminates need for external RAM in many applications while providing error detection for functional safety compliance (e.g., ASIL-B).
Hardware crypto acceleration (AES/SHA/RSA)	Reduces secure boot time by >90% vs. software-only implementation and enables authenticated firmware updates in resource-constrained ECUs.
2× CAN 2.0B controllers	Supports dual-bus vehicle networking (e.g., powertrain + body domain) with independent message buffering and filtering for deterministic latency.
AEC-Q100 Grade 3 qualification	Validates operation across −40°C to +85°C ambient, ensuring reliability in under-hood and cabin-mounted automotive modules.

Applications

Automotive Body Control Module	Industrial Motor Drive Controller
Use Scenario: Centralized control of door locks, lighting, window lifts, and HVAC actuators in modern vehicles. IC Role / Device Role / Timing Role: Real-time deterministic scheduler executing multiple concurrent control loops with CAN-based inter-module coordination. Use Value: Integrated 2× CAN, 8× timers, and GPIO multiplexing eliminate external bus translators and reduce BOM count by 30% versus discrete MCU + CAN transceiver solutions.	Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC motors in factory automation equipment. IC Role / Device Role / Timing Role: High-speed signal processor executing PWM generation, current sensing, and torque calculation within <5 µs loop time. Use Value: 400 MHz Blackfin+ core with dual MAC delivers 2× faster FOC computation than ARM Cortex-M7 at same clock, enabling higher switching frequencies and smoother motion profiles.
Secure Audio Processing Gateway	Biometric Sensor Hub
Use Scenario: In-vehicle infotainment gateway aggregating audio streams from microphones, Bluetooth, and USB while applying noise suppression and echo cancellation. IC Role / Device Role / Timing Role: Low-latency DSP engine performing real-time 16-channel beamforming and acoustic echo cancellation using L1 SRAM-resident buffers. Use Value: 136 kB parity-protected L1 SRAM ensures zero packet loss during audio stream buffering, and hardware AES encrypts sensitive voice data before storage or transmission.	Use Scenario: Wearable or access-control device fusing fingerprint, heart-rate, and accelerometer data for liveness-aware authentication. IC Role / Device Role / Timing Role: Secure edge processor running encrypted biometric algorithms with isolated OTP-stored keys and runtime memDMA encryption. Use Value: On-chip crypto accelerators cut authentication latency by 70% versus software-only implementations, while AEC-Q100 qualification ensures robustness in consumer-grade portable devices.

Automotive Body Control Module

Industrial Motor Drive Controller

Use Scenario: Centralized control of door locks, lighting, window lifts, and HVAC actuators in modern vehicles.

IC Role / Device Role / Timing Role: Real-time deterministic scheduler executing multiple concurrent control loops with CAN-based inter-module coordination.

Use Value: Integrated 2× CAN, 8× timers, and GPIO multiplexing eliminate external bus translators and reduce BOM count by 30% versus discrete MCU + CAN transceiver solutions.

Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase BLDC motors in factory automation equipment.

IC Role / Device Role / Timing Role: High-speed signal processor executing PWM generation, current sensing, and torque calculation within <5 µs loop time.

Use Value: 400 MHz Blackfin+ core with dual MAC delivers 2× faster FOC computation than ARM Cortex-M7 at same clock, enabling higher switching frequencies and smoother motion profiles.

Secure Audio Processing Gateway

Biometric Sensor Hub

Use Scenario: In-vehicle infotainment gateway aggregating audio streams from microphones, Bluetooth, and USB while applying noise suppression and echo cancellation.

IC Role / Device Role / Timing Role: Low-latency DSP engine performing real-time 16-channel beamforming and acoustic echo cancellation using L1 SRAM-resident buffers.

Use Value: 136 kB parity-protected L1 SRAM ensures zero packet loss during audio stream buffering, and hardware AES encrypts sensitive voice data before storage or transmission.

Use Scenario: Wearable or access-control device fusing fingerprint, heart-rate, and accelerometer data for liveness-aware authentication.

IC Role / Device Role / Timing Role: Secure edge processor running encrypted biometric algorithms with isolated OTP-stored keys and runtime memDMA encryption.

Use Value: On-chip crypto accelerators cut authentication latency by 70% versus software-only implementations, while AEC-Q100 qualification ensures robustness in consumer-grade portable devices.

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded signal processing applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
ADSP-BF706KCPZ-4	1 MB L2 SRAM (vs. 256 kB), adds L3 DDR2/LPDDR interface, 184-ball CSP_BGA package (vs. 88-lead LFCSP).	Targeted at higher-memory applications requiring external DRAM, such as video analytics or multi-sensor fusion with large frame buffers.	Select ADSP-BF706KCPZ-4 only if >512 kB L2 SRAM or DDR2 interfacing is required; otherwise ADSP-BF702KCPZ-4 offers lower cost and smaller footprint.
ADSP-BF703KCPZ-4	512 kB L2 SRAM (vs. 256 kB), identical 88-lead LFCSP package and peripheral set; no L3 interface.	Suitable for mid-tier applications needing more on-chip memory for larger algorithm models or dual-domain firmware (e.g., secure + non-secure worlds).	Choose ADSP-BF703KCPZ-4 when 512 kB L2 SRAM is needed without changing PCB layout; pin-compatible drop-in upgrade from ADSP-BF702KCPZ-4.

Compared with ADSP-BF702KCPZ-4, ADSP-BF703KCPZ-4 doubles L2 SRAM capacity while retaining identical package and peripherals-ideal for scaling firmware complexity without redesign. ADSP-BF706KCPZ-4 trades package simplicity for DRAM expandability, making it appropriate only when external memory bandwidth is essential.

Availability

ADSP-BF702KCPZ-4 is available at Aetrix Electronics and suitable for automotive body control modules, industrial motor drives, secure audio gateways, and biometric sensor hubs requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant performance.

Supply support for ADSP-BF702KCPZ-4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA, with design centers worldwide and over 50 years of innovation in precision technology.

The ADSP-BF70x product line was engineered specifically for cost-sensitive, power-efficient embedded signal processing in automotive, industrial, and IoT edge applications-balancing Blackfin's DSP heritage with modern security, connectivity, and qualification requirements.

FAQ

What is the maximum operating frequency of the ADSP-BF702KCPZ-4?

The ADSP-BF702KCPZ-4 operates at a maximum SYSCLK frequency of 400 MHz, enabling up to 400 million multiply-accumulates per second. This speed is guaranteed across the full industrial temperature range (−40°C to +85°C) and supported by its 1.05 V core supply and thermal design in the 88-lead LFCSP_VQ package. The ADSP-BF702KCPZ-4 achieves this performance while maintaining <100 mW core power consumption at 25°C junction temperature.

Does the ADSP-BF702KCPZ-4 support secure boot and cryptographic operations?

Yes, the ADSP-BF702KCPZ-4 includes dedicated hardware crypto accelerators for AES-128/256, SHA-1/256, and RSA key generation/verification, plus 1 kB of one-time-programmable (OTP) memory for storing root keys. It implements fast secure boot that validates signed firmware images before execution and supports memDMA-based runtime encryption/decryption of data buffers-critical capabilities for protecting intellectual property in the ADSP-BF702KCPZ-4.

What package type and pin count does the ADSP-BF702KCPZ-4 use?

The ADSP-BF702KCPZ-4 uses an 88-lead LFCSP_VQ (QFN) package measuring 12 mm × 12 mm with an exposed thermal pad. This RoHS-compliant package is distinct from the 184-ball CSP_BGA option used by higher-memory variants like ADSP-BF706KCPZ-4. The ADSP-BF702KCPZ-4's pinout includes dedicated CAN, SPORT, USB, and GPIO signals mapped to its 88 leads, with full signal descriptions available in Analog Devices' official documentation.

How much on-chip memory does the ADSP-BF702KCPZ-4 include?

The ADSP-BF702KCPZ-4 integrates 136 kB of L1 SRAM (64 kB instruction, 64 kB data, 8 kB scratchpad)-all protected by multi-parity-bit error detection-and 256 kB of ECC-protected L2 SRAM. It also contains a 512 kB on-chip ROM for boot code and security routines. Unlike some higher-tier BF70x variants, the ADSP-BF702KCPZ-4 does not include L3 DDR2/LPDDR interface capability.

Is the ADSP-BF702KCPZ-4 qualified for automotive applications?

Yes, the ADSP-BF702KCPZ-4 is AEC-Q100 qualified to Grade 3 (−40°C to +85°C ambient), making it suitable for non-safety-critical but reliability-demanding automotive applications such as body control modules, infotainment gateways, and telematics units. Its design includes built-in fault management, watchdog timers, memory protection, and robust ESD tolerance-key elements validated under AEC-Q100 stress testing for the ADSP-BF702KCPZ-4.

ADSP-BF702KCPZ-4 Specifications

Product attributes: Attribute value

Manufacturer:: Analog Devices Inc.

Series:: Blackfin®

Package/Case:: 88-VFQFN Exposed Pad, CSP

Packaging:: Tray

Product Status:: Active

Type:: Blackfin+

Interface:: CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG

Clock Rate:: 400MHz

Non-Volatile Memory:: ROM (512kB)

On-Chip RAM:: 256kB

Voltage - I/O:: 1.8V, 3.3V

Voltage - Core:: 1.10V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 88-LFCSP-VQ (12x12)

ADSP-BF702KCPZ-4 FAQ

1.How can I place an order for ADSP-BF702KCPZ-4 through Aetrix?

Please submit a Request for Quotation (RFQ) for ADSP-BF702KCPZ-4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ADSP-BF702KCPZ-4 reliable?

The price and inventory of ADSP-BF702KCPZ-4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF702KCPZ-4 is usually 5 days.

3.What payment methods are accepted for ADSP-BF702KCPZ-4?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF702KCPZ-4 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ADSP-BF702KCPZ-4?

ADSP-BF702KCPZ-4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ADSP-BF702KCPZ-4 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ADSP-BF702KCPZ-4?

For technical support, including ADSP-BF702KCPZ-4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF702KCPZ-4 requirements.

6.How does Aetrix verify that ADSP-BF702KCPZ-4 is sourced from the original manufacturer or authorized distributors?

All ADSP-BF702KCPZ-4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF702KCPZ-4 meets industry standards.

7.What is the process for return or replacement of ADSP-BF702KCPZ-4?

All ADSP-BF702KCPZ-4 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF702KCPZ-4, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ADSP-BF702KCPZ-4 part is unused and in its original packaging.

Return procedure for ADSP-BF702KCPZ-4:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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