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Analog Devices Inc. ADSP-BF707BBCZ-3
- Part No.:
- ADSP-BF707BBCZ-3
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 184-LFBGA, CSPBGA
- Datasheet:
-
ADSP-BF707BBCZ-3.pdf
- Description:
- IC DSP LP 1024KB L2SR 184BGA
- Quantity:
- Payment:
- Shipping:
Inventory:103
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Product details
Overview
ADSP-BF707BBCZ-3 from Analog Devices is a Blackfin+ embedded processor IC delivering up to 400 MHz core performance with dual 16-bit or single 32-bit MAC per cycle, 136 kB parity-protected L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), and 1 MB ECC-protected L2 SRAM. It integrates two CAN 2.0B controllers, USB 2.0 HS OTG, dual UARTs, and AEC-Q100 qualification for automotive control units.
For engineers reviewing the ADSP-BF707BBCZ-3 datasheet, ADSP-BF707BBCZ-3 pinout, ADSP-BF707BBCZ-3 application, or ADSP-BF707BBCZ-3 equivalent, key selection criteria include L2 SRAM size (1 MB), 184-ball CSP_BGA RoHS-compliant package, 2× CAN + USB 2.0 HS OTG peripheral set, crypto hardware acceleration, and secure boot support for safety-critical firmware deployment.
Technical Context
The ADSP-BF707BBCZ-3 implements a modified Harvard architecture with separate 64 kB L1 instruction and 64 kB L1 data SRAM banks, both multi-parity-bit protected, and a unified 1 MB L2 SRAM with ECC-accessible via a dedicated 64-bit interface at SYSCLK frequency. Its Blackfin+ core executes two 16-bit MACs or one 32-bit MAC per cycle, supports 16-bit complex MAC, and maintains full instruction-set compatibility with prior Blackfin processors.
Peripherals include a dynamic memory controller supporting DDR2/LPDDR (16-bit, up to 200 MHz), static memory controller for NOR/PSRAM, 2× SPORT, 2× CAN, USB 2.0 HS OTG with integrated PHY, and crypto accelerators enabling fast memDMA encryption/decryption. The device uses a hierarchical memory map with OTP (1 kB) for secure boot and chip ID storage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Blackfin+ 32-bit RISC/DSP hybrid with dual 16-bit MAC or single 32-bit MAC per cycle |
| Max Core Frequency | 400 MHz - enables real-time audio/video processing and motor control loop execution |
| L1 Memory | 136 kB total: 64 kB instruction SRAM + 64 kB data SRAM + 8 kB scratchpad, all multi-parity-bit protected |
| L2 Memory | 1 MB ECC-protected SRAM - provides deterministic latency for safety-critical code/data storage |
| Package | 184-ball CSP_BGA, 12 mm × 12 mm × 0.8 mm pitch, RoHS compliant - supports high-density automotive PCB layouts |
| Automotive Qualification | AEC-Q100 Grade 3 (−40°C to +85°C) - validated for under-hood and infotainment ECU use |
| Crypto Acceleration | Dedicated crypto engine with memDMA encryption/decryption - offloads AES/SHA operations from CPU |
| Peripheral Interface | 2× CAN 2.0B, USB 2.0 HS OTG, 2× UART, 2× SPORT, PPI, MSI (SD/SDIO), TWI, RTC, 8× GP timers |
Pinout & Package
ADSP-BF707BBCZ-3 is housed in an 184-ball CSP_BGA package (12 mm × 12 mm, 0.8 mm pitch), RoHS compliant. Ball assignments follow Analog Devices' ADSP-BF70x 184-Ball CSP_BGA signal descriptions (Rev. D, Pages 105–107), with dedicated power, ground, I/O, and high-speed interface balls including DDR2/LPDDR DQ/DQS, USB DP/DM, CANH/CANL, and JTAG debug pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_INT | Core power supply | 1.05 V ±3% input for 400 MHz operation; requires low-noise regulation and local decoupling |
| VDD_IO | I/O power supply | 3.3 V or 1.8 V selectable; powers GPIO, UART, SPI, and peripheral I/O banks independently |
| VBAT | RTC backup supply | Connects to coin cell or supercap for persistent real-time clock operation during main power loss |
| USB_DP / USB_DM | USB 2.0 HS differential pair | Integrated PHY supports host/device/OTG modes; requires 90 Ω differential impedance routing |
| CAN0H / CAN0L | CAN 2.0B differential transceiver interface | Direct connection to external CAN bus transceiver; supports 1 Mbps baud rate with built-in filtering |
| TDI / TDO / TCK / TMS | JTAG boundary-scan/debug interface | Enables ICE-based debugging, flash programming, and structural test without CPU intervention |
Key Features
| Feature | Design Value |
|---|---|
| Secure Boot with OTP | 1 kB one-time-programmable memory stores unique chip ID and cryptographic keys for authenticated firmware loading |
| Hardware Crypto Engine | Accelerates AES-128/256, SHA-1/256, and RSA operations - reduces CPU load by >90% vs. software-only implementation |
| Dual CAN 2.0B Controllers | Independent message buffers, FIFOs, and error counters - enables concurrent vehicle network diagnostics and actuator control |
| L2 Memory with ECC | 1 MB SRAM with single-bit error correction/detection - prevents silent data corruption in safety-critical applications |
| Dynamic Memory Controller | Supports DDR2/LPDDR up to 200 MHz (16-bit bus) - delivers >300 MB/s bandwidth for video buffer or large dataset access |
| GPIO Multiplexing | Each pin supports up to 4 peripheral functions plus GPIO - simplifies board layout and enables flexible signal routing |
Applications
| Automotive ADAS Sensor Fusion | Industrial Motor Control Gateway |
|---|---|
|
Use Scenario: Real-time fusion of radar, camera, and ultrasonic sensor data in compact ADAS ECUs. IC Role / Device Role / Timing Role: Primary compute engine executing Kalman filters, object tracking, and CAN message arbitration at ≤100 µs latency. Use Value: 400 MHz Blackfin+ core + 1 MB L2 SRAM enables deterministic execution of multi-sensor algorithms without external DRAM. |
Use Scenario: Central gateway managing fieldbus communication (CANopen, Modbus RTU) and closed-loop motor control in PLC-based systems. IC Role / Device Role / Timing Role: Dual-CAN interface coordinator with real-time PWM generation and encoder feedback processing. Use Value: Integrated 2× CAN + 8× timers + crypto engine eliminates need for discrete protocol translators and security co-processors. |
| Medical Imaging Front-End | Secure IoT Edge Node |
|
Use Scenario: Portable ultrasound or digital X-ray front-end requiring low-power, high-precision signal processing and DICOM export. IC Role / Device Role / Timing Role: Signal acquisition processor handling ADC streaming, beamforming, and JPEG2000 compression before USB 2.0 HS transmission. Use Value: 136 kB L1 SRAM + hardware crypto ensures zero-copy DMA transfers and encrypted DICOM file generation. |
Use Scenario: Tamper-resistant edge node for smart grid monitoring, performing sensor analytics and TLS-secured telemetry upload. IC Role / Device Role / Timing Role: Secure runtime environment with memDMA-encrypted data paths and secure boot enforcing signed firmware updates. Use Value: OTP + crypto engine + AEC-Q100 qualification enables certified deployment in utility-grade outdoor enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-BF706BBCZ-3 | Same 184-ball CSP_BGA package and Blackfin+ core, but 512 kB L2 SRAM (vs. 1 MB) and no DDR2/LPDDR interface | Suitable for cost-sensitive motor control where external DRAM not required | Select ADSP-BF706BBCZ-3 when L2 SRAM ≥512 kB suffices and DDR2/LPDDR connectivity is unnecessary |
| NXP i.MX RT1064 | ARM Cortex-M7 @ 600 MHz, 1 MB on-chip SRAM, no native CAN FD, USB HS OTG only (no device mode) | Better for Linux-capable HMI or AI inference; lacks AEC-Q100 and dual CAN 2.0B hardware support | Choose i.MX RT1064 for higher general-purpose throughput and ecosystem tooling; retain ADSP-BF707BBCZ-3 for CAN-rich automotive safety stacks |
Compared with ADSP-BF706BBCZ-3, the ADSP-BF707BBCZ-3 adds 512 kB L2 SRAM and DDR2/LPDDR support for larger datasets and streaming workloads; versus i.MX RT1064, it trades raw ARM M7 speed for deterministic dual-CAN timing, AEC-Q100 validation, and integrated crypto acceleration optimized for real-time signal processing.
Availability
ADSP-BF707BBCZ-3 is available at Aetrix Electronics and suitable for automotive ADAS modules, industrial motor gateways, medical imaging front-ends, and secure IoT edge nodes requiring stable component supply across extended product lifecycles.
Supply support for ADSP-BF707BBCZ-3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and DSP technology, headquartered in Norwood, MA, with design centers and manufacturing facilities worldwide.
The ADSP-BF707BBCZ-3 belongs to the Blackfin+ processor family, engineered for deterministic real-time signal processing in resource-constrained, safety-aware environments such as automotive control, industrial automation, and portable medical devices.
FAQ
What is the maximum operating temperature range for the ADSP-BF707BBCZ-3?
The ADSP-BF707BBCZ-3 is AEC-Q100 qualified for Grade 3 operation, supporting continuous operation from −40°C to +85°C ambient temperature. This rating is validated across the full 184-ball CSP_BGA package and applies to all core, memory, and peripheral functions under specified voltage and clock conditions per Analog Devices' Rev. D datasheet.
Does the ADSP-BF707BBCZ-3 support DDR2 or LPDDR memory interfaces?
Yes, the ADSP-BF707BBCZ-3 includes a Dynamic Memory Controller (DMC) supporting JESD79-2E DDR2 and JESD209A LPDDR SDRAM devices at up to 200 MHz on a 16-bit bus. This interface is exclusive to the 184-ball CSP_BGA package variant and is not available on the 88-lead LFCSP option.
How much on-chip SRAM does the ADSP-BF707BBCZ-3 provide, and how is it protected?
The ADSP-BF707BBCZ-3 provides 136 kB of L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), all protected by multi-parity-bit detection, and 1 MB of L2 SRAM with full ECC protection. The L2 SRAM is organized in eight banks, each individually configurable for master access control and error correction.
Is the ADSP-BF707BBCZ-3 pin-compatible with other ADSP-BF70x variants?
No, the ADSP-BF707BBCZ-3 is not pin-compatible with lower-pin-count variants like the 88-lead LFCSP ADSP-BF707BCPZ-3. It uses the 184-ball CSP_BGA package exclusively, and ball assignments differ significantly from QFN variants due to added DDR2/LPDDR, USB, and enhanced power delivery requirements.
What security features are implemented in hardware on the ADSP-BF707BBCZ-3?
The ADSP-BF707BBCZ-3 integrates a dedicated crypto engine supporting AES-128/256, SHA-1/256, and RSA acceleration; 1 kB OTP memory for secure boot keys and chip ID; memDMA encryption/decryption; and L1/L2 memory parity/ECC protection. These features enable FIPS 140-2 Level 1–compliant secure firmware execution without external security ICs.
ADSP-BF707BBCZ-3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- Blackfin®
- Package/Case:
- 184-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Blackfin+
- Interface:
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate:
- 300MHz
- Non-Volatile Memory:
- ROM (512kB)
- On-Chip RAM:
- 1MB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 184-CSPBGA (12x12)
ADSP-BF707BBCZ-3 FAQ
1.How can I place an order for ADSP-BF707BBCZ-3 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-BF707BBCZ-3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-BF707BBCZ-3 reliable?
The price and inventory of ADSP-BF707BBCZ-3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF707BBCZ-3 is usually 5 days.
3.What payment methods are accepted for ADSP-BF707BBCZ-3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF707BBCZ-3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-BF707BBCZ-3?
ADSP-BF707BBCZ-3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-BF707BBCZ-3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-BF707BBCZ-3?
For technical support, including ADSP-BF707BBCZ-3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF707BBCZ-3 requirements.
6.How does Aetrix verify that ADSP-BF707BBCZ-3 is sourced from the original manufacturer or authorized distributors?
All ADSP-BF707BBCZ-3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF707BBCZ-3 meets industry standards.
7.What is the process for return or replacement of ADSP-BF707BBCZ-3?
All ADSP-BF707BBCZ-3 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF707BBCZ-3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-BF707BBCZ-3 part is unused and in its original packaging.
Return procedure for ADSP-BF707BBCZ-3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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