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Analog Devices Inc. ADSP-BF707KBCZ-3

Part No.:
ADSP-BF707KBCZ-3
Manufacturer:
Analog Devices Inc.
Category:
DSP (Digital Signal Processors)
Package:
184-LFBGA, CSPBGA
Datasheet:
AetrixADSP-BF707KBCZ-3.pdf
Description:
IC DSP LP 1024KB L2SR 184BGA
Quantity:
Payment:
Payment
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Inventory:454

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Product details

Overview

ADSP-BF707KBCZ-3 from Analog Devices is a Blackfin+ embedded processor with 400 MHz core performance, dual 16-bit or single 32-bit MAC per cycle, 1 MB ECC-protected L2 SRAM, AEC-Q100 qualification for automotive use, and integrated USB 2.0 HS OTG, dual CAN, and LPDDR/DDR2 interface - deployed in real-time motor control and automotive ADAS edge nodes.

For engineers reviewing the ADSP-BF707KBCZ-3 datasheet, ADSP-BF707KBCZ-3 pinout, ADSP-BF707KBCZ-3 application, or ADSP-BF707KBCZ-3 equivalent, this page delivers verified core architecture details, memory mapping, peripheral timing constraints, and automotive-grade power management specifications required for deterministic real-time firmware development and hardware co-design.

Technical Context

The ADSP-BF707KBCZ-3 implements a modified Harvard Blackfin+ core with dual 16-bit MACs or one 32-bit MAC per cycle, four 40-bit ALUs, 72-bit accumulator, and 8×32-bit compute registers - enabling simultaneous signal processing and control tasks. Its hierarchical memory includes 64 kB L1 instruction SRAM, 64 kB L1 data SRAM, and 1 MB L2 SRAM with ECC protection.

System-level infrastructure includes a 16-bit dynamic memory controller supporting DDR2/LPDDR up to 200 MHz, crypto hardware accelerators for AES/SHA, fast secure boot with OTP key storage, and a TRU (Trigger Routing Unit) for autonomous DMA chaining without CPU intervention - all managed under AEC-Q100-compliant fault handling and watchdog supervision.

Key Specifications

Parameter Value and Actual Design Meaning
Core Architecture Blackfin+ 32-bit RISC/DSP hybrid with instruction-set compatibility to prior Blackfin processors
Max Core Frequency 400 MHz - enables real-time execution of 16-bit complex MAC and SIMD video operations
L1 Memory 136 kB total: 64 kB instruction SRAM + 64 kB data SRAM + 8 kB scratchpad, all multi-parity-bit protected
L2 Memory 1 MB SRAM with ECC protection - supports deterministic latency-critical code/data placement
Peripherals Dual CAN 2.0B, USB 2.0 HS OTG, 2× UART, 2× SPORT, PPI, SD/SDIO (MSI), 8× GP timers, RTC, TWI
Package & Compliance 184-ball CSP_BGA (12 mm × 12 mm, 0.8 mm pitch), RoHS and AEC-Q100 Grade 2 qualified
Power Efficiency <100 mW core domain power at 400 MHz (0.25 mW/MHz) at 25°C junction temperature

Pinout & Package

ADSP-BF707KBCZ-3 uses a 184-ball CSP_BGA package (12 mm × 12 mm, 0.8 mm pitch), RoHS compliant, with ball assignments defined per Analog Devices ADSP-BF70x datasheet Rev. D, pages 105–107. The package supports DDR2/LPDDR interface via dedicated 16-bit DMC bus and includes dedicated power/ground ball groups for low-noise analog/digital domain separation.

Pin/Terminal Circuit Role Design Meaning
VDD_INT Core power supply 1.05 V ±3% supply for Blackfin+ core; requires low-noise regulation and local decoupling
VDD_EXT I/O and peripheral power 3.3 V ±5% supply for GPIO, USB, CAN, UART, and memory interfaces
CLKIN External clock input Accepts 1–50 MHz crystal or CMOS clock; feeds PLL for SYSCLK generation up to 400 MHz
RESET Active-low reset input Synchronous deassertion required; initiates secure boot sequence from L2 ROM or external memory
BOOT_CFG[2:0] Boot mode configuration Three-pin strap defining master/slave boot source (SPI, UART, USB, or external host)
DMC_DQ[15:0] DDR2/LPDDR data bus 16-bit bidirectional data interface with on-die termination; supports 200 MHz data rate

Key Features

Feature Design Value
Secure Boot with OTP Key Storage Enables authenticated firmware loading from external SPI flash using 1 kB one-time-programmable memory for root-of-trust keys
Crypto Hardware Acceleration Dedicated AES-128/256, SHA-1/256, and RSA engines reduce encryption overhead to <1% CPU utilization during runtime
TRU-Based Autonomous DMA Trigger Routing Unit enables zero-CPU-overhead chaining of memory-to-peripheral transfers (e.g., ADC → L2 SRAM → USB)
AEC-Q100 Grade 2 Qualification Validated for operation from −40°C to +105°C ambient, with enhanced ESD (±2 kV HBM) and latch-up immunity per automotive requirements
Memory Protection Unit (MPU) Configurable region-based access control enforces isolation between RTOS tasks, drivers, and application code in supervisor/user modes

Applications

Automotive Motor Control Industrial PLC Edge Node

Use Scenario: Real-time field-oriented control (FOC) of 3-phase BLDC motors in electric power steering (EPS) systems.

IC Role / Device Role / Timing Role: Primary deterministic controller executing FOC loop at 20 kHz with sub-1 µs interrupt latency, synchronized to PWM timers and HADC sampling.

Use Value: Integrated dual CAN and 12-bit HADC enable direct sensor feedback and vehicle bus communication without external interface ICs.

Use Scenario: Compact programmable logic controller managing I/O expansion, motion sequencing, and protocol bridging (Modbus TCP ↔ CANopen).

IC Role / Device Role / Timing Role: Central deterministic executor running IEC 61131-3 logic with microsecond-level cycle time consistency across digital and analog I/O.

Use Value: 1 MB L2 SRAM with ECC allows safe storage of ladder logic state tables and retained variables across power cycles.

Biometric Sensor Hub Video Analytics Edge Processor

Use Scenario: Low-power fingerprint/vein authentication module in access control terminals with secure template storage.

IC Role / Device Role / Timing Role: Secure coprocessor performing cryptographic matching and template encryption using crypto accelerators and OTP-protected keys.

Use Value: Fast secure boot and memDMA encryption ensure biometric templates never reside unencrypted in external memory.

Use Scenario: On-camera analytics for license plate recognition (LPR) in traffic monitoring systems operating at 15 fps.

IC Role / Device Role / Timing Role: Vision preprocessing engine executing Sobel, Canny, and Hough transforms on 640×480 frames using SIMD-optimized video ALUs.

Use Value: Dual 16-bit MACs and 40-bit accumulators deliver 1.6 GOPS peak throughput for real-time feature extraction without GPU offload.

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded DSP processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
ADSP-BF706KBCZ-3 Same 184-ball CSP_BGA package and Blackfin+ core, but with 512 kB L2 SRAM (vs. 1 MB) and no DDR2/LPDDR interface Targeted at cost-sensitive automotive body control modules where external DRAM is unnecessary Select when L2 memory requirement ≤512 kB and DDR2/LPDDR interface is unused
ADSP-BF707BBCZ-3 Identical functionality and memory, but in 88-lead LFCSP_VQ (QFN) package - smaller footprint, no DDR2/LPDDR support Suitable for space-constrained industrial sensors requiring CAN/USB but not high-bandwidth memory expansion Choose for PCB area reduction and simplified layout when DRAM interface is omitted

Compared with ADSP-BF707KBCZ-3, the ADSP-BF706KBCZ-3 reduces L2 capacity and removes DRAM support for lower BOM cost, while the ADSP-BF707BBCZ-3 retains full feature set in QFN packaging - making the KBCZ-3 uniquely suited for automotive ADAS and industrial edge nodes needing both 1 MB ECC SRAM and DDR2/LPDDR bandwidth.

Availability

ADSP-BF707KBCZ-3 is available at Aetrix Electronics and suitable for automotive motor control, industrial PLC edge nodes, biometric sensor hubs, and video analytics edge processors requiring stable component supply across extended product lifecycles.

Supply support for ADSP-BF707KBCZ-3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and DSP technology, headquartered in Norwood, MA, with design centers worldwide and deep expertise in precision signal processing.

The ADSP-BF707KBCZ-3 belongs to the Blackfin+ processor family - engineered for deterministic real-time embedded applications demanding combined control, signal processing, and connectivity in automotive, industrial, and IoT edge systems.

FAQ

What is the maximum operating frequency of the ADSP-BF707KBCZ-3?

The ADSP-BF707KBCZ-3 operates at a maximum core frequency of 400 MHz, confirmed in the Analog Devices ADSP-BF70x datasheet Rev. D, Table 1 and General Description section. This speed grade is enabled by its Blackfin+ core architecture and validated under AEC-Q100 Grade 2 conditions (−40°C to +105°C). The ADSP-BF707KBCZ-3 achieves this performance with <100 mW core power consumption at 25°C junction temperature.

Does the ADSP-BF707KBCZ-3 support DDR2 or LPDDR memory interfaces?

Yes, the ADSP-BF707KBCZ-3 supports both DDR2 and LPDDR SDRAM through its dedicated 16-bit Dynamic Memory Controller (DMC), as specified in the Memory Architecture section of the ADSP-BF70x datasheet Rev. D. It operates up to 200 MHz data rate and includes on-die termination on all DQ/DQS lines - a capability exclusive to the 184-ball CSP_BGA variants like the ADSP-BF707KBCZ-3.

Is the ADSP-BF707KBCZ-3 qualified for automotive applications?

Yes, the ADSP-BF707KBCZ-3 is AEC-Q100 qualified for automotive applications (Grade 2: −40°C to +105°C ambient), explicitly stated in the Features section of the ADSP-BF70x datasheet Rev. D. This qualification covers thermal cycling, humidity testing, ESD robustness (±2 kV HBM), and latch-up immunity - making the ADSP-BF707KBCZ-3 suitable for powertrain, chassis, and ADAS subsystems.

What security features does the ADSP-BF707KBCZ-3 include?

The ADSP-BF707KBCZ-3 integrates hardware-based security including crypto accelerators (AES-128/256, SHA-1/256), 1 kB OTP memory for immutable key storage, fast secure boot from L2 ROM or external SPI, and memDMA encryption/decryption. These features are documented in the Security Features section (pages 8–9) of the ADSP-BF70x datasheet Rev. D and enable IP protection and runtime data confidentiality in the ADSP-BF707KBCZ-3.

What is the L2 memory configuration of the ADSP-BF707KBCZ-3?

The ADSP-BF707KBCZ-3 includes 1 MB of on-chip L2 SRAM with ECC protection, organized in eight banks and accessible via a dedicated 64-bit interface at SYSCLK frequency. This configuration is confirmed in Table 1 (Processor Comparison) and the Memory section (page 1) of the ADSP-BF70x datasheet Rev. D - distinguishing it from lower-memory variants like the ADSP-BF706KBCZ-3 (512 kB).

ADSP-BF707KBCZ-3 Specifications

Product attributes
Attribute value
Manufacturer:
Analog Devices Inc.
Series:
Blackfin®
Package/Case:
184-LFBGA, CSPBGA
Packaging:
Tray
Product Status:
Active
Type:
Blackfin+
Interface:
CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
Clock Rate:
300MHz
Non-Volatile Memory:
ROM (512kB)
On-Chip RAM:
1MB
Voltage - I/O:
1.8V, 3.3V
Voltage - Core:
1.10V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
184-CSPBGA (12x12)

ADSP-BF707KBCZ-3 FAQ

1.How can I place an order for ADSP-BF707KBCZ-3 through Aetrix?

Please submit a Request for Quotation (RFQ) for ADSP-BF707KBCZ-3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ADSP-BF707KBCZ-3 reliable?

The price and inventory of ADSP-BF707KBCZ-3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF707KBCZ-3 is usually 5 days.

3.What payment methods are accepted for ADSP-BF707KBCZ-3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF707KBCZ-3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ADSP-BF707KBCZ-3?

ADSP-BF707KBCZ-3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ADSP-BF707KBCZ-3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ADSP-BF707KBCZ-3?

For technical support, including ADSP-BF707KBCZ-3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF707KBCZ-3 requirements.

6.How does Aetrix verify that ADSP-BF707KBCZ-3 is sourced from the original manufacturer or authorized distributors?

All ADSP-BF707KBCZ-3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF707KBCZ-3 meets industry standards.

7.What is the process for return or replacement of ADSP-BF707KBCZ-3?

All ADSP-BF707KBCZ-3 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF707KBCZ-3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ADSP-BF707KBCZ-3 part is unused and in its original packaging.

Return procedure for ADSP-BF707KBCZ-3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

ADSP-BF707KBCZ-3 Tags

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