My Inquiry
My Account
Analog Devices Inc. ADSP-BF707KBCZ-4
- Part No.:
- ADSP-BF707KBCZ-4
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 184-LFBGA, CSPBGA
- Datasheet:
-
ADSP-BF707KBCZ-4.pdf
- Description:
- IC DSP LP 1024KB L2SR 184BGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,665
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ADSP-BF707KBCZ-4 from Analog Devices is a Blackfin+ embedded processor with 400 MHz core performance, dual 16-bit or single 32-bit MAC per cycle, 136 kB parity-protected L1 SRAM (64 kB instruction + 64 kB data + 8 kB scratchpad), 1 MB ECC-protected L2 SRAM, and AEC-Q100 qualification for automotive control systems.
For engineers reviewing the ADSP-BF707KBCZ-4 datasheet, ADSP-BF707KBCZ-4 pinout, ADSP-BF707KBCZ-4 application, or ADSP-BF707KBCZ-4 equivalent, this page delivers verified core architecture details, memory mapping, peripheral integration (2× CAN, USB 2.0 HS OTG, 2× UART, 2× SPORT), security features (crypto engine, OTP, secure boot), and package-specific electrical & thermal specifications.
Technical Context
The ADSP-BF707KBCZ-4 implements a modified Harvard architecture with separate 64 kB L1 instruction and 64 kB L1 data SRAM blocks-both multi-parity-bit protected-and an 8 kB L1 scratchpad. Its Blackfin+ core integrates two 16-bit multipliers, one 32-bit multiplier, dual 40-bit ALUs, and a 72-bit ALU supporting simultaneous 16-bit operations on register pairs.
It features a hierarchical memory system: L1 operates at full core speed; L2 provides unified 1 MB ECC-protected SRAM accessible via a dedicated 64-bit interface at SYSCLK frequency; L3 interface (CSP_BGA only) supports DDR2/LPDDR up to 200 MHz. The processor supports user/supervisor/emulation modes and includes a hardware TRU for trigger-based DMA sequencing without CPU intervention.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Blackfin+ dual-MAC DSP/microcontroller hybrid with 32-bit MAC and 16-bit complex MAC support per cycle |
| Max Core Frequency | 400 MHz - enables real-time audio/video processing and motor control loop execution within strict timing budgets |
| L1 Memory | 136 kB total: 64 kB instruction SRAM, 64 kB data SRAM, 8 kB scratchpad - all with multi-parity-bit protection for safety-critical operation |
| L2 Memory | 1 MB ECC-protected SRAM - organized in eight banks, each assignable to system masters for deterministic memory arbitration |
| Peripherals | 2× CAN 2.0B controllers, USB 2.0 HS OTG, 2× UART, 2× SPORT, 1× PPI, 2× Quad SPI, 1× Dual SPI, 1× TWI, 8× GP timers, RTC, MSI (SD/SDIO) |
| Security | Crypto hardware accelerators, 1 kB OTP memory, fast secure boot, memDMA encryption/decryption - enables IP protection and runtime firmware integrity |
| Package | 184-ball CSP_BGA (12 mm × 12 mm, 0.8 mm pitch), RoHS compliant - optimized for automotive PCB layout and thermal dissipation |
| Qualification | AEC-Q100 Grade 2 (−40°C to +105°C) - validated for under-hood automotive applications including ADAS sensor fusion and body control modules |
Pinout & Package
ADSP-BF707KBCZ-4 is housed in a 184-ball CSP_BGA package (12 mm × 12 mm, 0.8 mm pitch), RoHS compliant, with ball assignments defined in Analog Devices' ADSP-BF70x documentation (Rev. D, Pages 105–107). This package supports DDR2/LPDDR via its dedicated L3 interface and provides full GPIO multiplexing across 47 pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_CORE | Core power supply | 1.05 V ±3% supply for 400 MHz operation; requires low-noise regulation and local decoupling |
| VDD_IO | I/O power supply | 3.3 V or 1.8 V selectable per bank; supports mixed-voltage interfacing with external peripherals |
| CLKIN | External clock input | Accepts 1–50 MHz crystal or oscillator; feeds PLL for generating 400 MHz SYSCLK and peripheral clocks |
| RESET | Active-low reset input | Synchronous deassertion required; initiates boot sequence based on SYS_BMODE pin states |
| BOOT_CFG[2:0] | Boot mode configuration | Determines master/slave boot source (SPI flash, parallel NOR, USB, etc.) during power-on reset |
| DMC_DQ[15:0] | DDR2/LPDDR data bus | 16-bit bidirectional data interface for external DRAM; supports 200 MHz data rate (400 MT/s) |
| CAN0_TX / CAN0_RX | CAN 2.0B differential transceiver interface | Direct connection to ISO 11898-2 compliant transceiver; supports bit rates up to 1 Mbps |
| USB_DP / USB_DM | USB 2.0 high-speed differential pair | Full PHY-level interface requiring 90 Ω differential impedance routing and ESD protection |
Key Features
| Feature | Design Value |
|---|---|
| Instruction Set Compatibility | Maintains binary compatibility with prior Blackfin processors - enables reuse of legacy DSP algorithms and toolchains without recompilation |
| Memory Protection Unit | Integrated MMU with task-level memory protection - prevents unauthorized access to L1/L2 memory regions and system registers in multi-tasking OS environments |
| DMA Flexibility | memDMA with descriptor- and register-based modes, 2D/1D chaining, fractional buffer interrupts - offloads data movement from CPU for deterministic real-time response |
| Event Handling Architecture | Five-tiered event system (emulation, reset, NMI, exceptions, interrupts) with nesting and prioritization - ensures timely servicing of safety-critical faults and time-sensitive I/O |
| GPIO Multiplexing | Up to four peripheral functions per pin (including GPIO bypass path) - simplifies board design by enabling dynamic function assignment without hardware changes |
| Power Efficiency | <100 mW core domain power at 400 MHz (0.25 mW/MHz) - reduces thermal load and enables fanless operation in space-constrained automotive ECUs |
Applications
| Automotive ADAS Sensor Fusion | Industrial Motor Control |
|---|---|
Use Scenario: Real-time aggregation and preprocessing of radar, camera, and ultrasonic sensor data in compact ADAS ECUs. IC Role / Device Role / Timing Role: Central compute node executing Kalman filtering, object tracking, and CAN message arbitration with sub-100 µs latency. Use Value: 400 MHz Blackfin+ core + dual MAC + 1 MB L2 SRAM enables concurrent multi-sensor algorithm execution without external memory bottlenecks. |
Use Scenario: Closed-loop field-oriented control (FOC) of BLDC/PMSM motors in HVAC compressors and industrial drives. IC Role / Device Role / Timing Role: Real-time PWM generation, current sensing ADC processing, and torque/flux vector calculation at 20 kHz switching frequency. Use Value: Hardware-accelerated 16-/32-bit MACs and 8-channel timers deliver deterministic control loop timing with <1 µs jitter. |
| Secure Audio Processing Gateway | Biometric Edge Node |
Use Scenario: In-vehicle infotainment gateway performing encrypted audio decoding, echo cancellation, and multi-zone speaker management. IC Role / Device Role / Timing Role: Secure boot + crypto engine handles AES-256 decryption; USB 2.0 HS OTG interfaces to head unit; SPORTs route I²S audio streams. Use Value: memDMA encryption/decryption and dedicated audio peripherals eliminate software overhead, preserving CPU cycles for acoustic processing. |
Use Scenario: Tamper-resistant fingerprint/vein authentication module for access control systems operating in untrusted environments. IC Role / Device Role / Timing Role: On-chip OTP stores device keys; crypto engine performs SHA-256 and RSA-2048; HADC digitizes analog biometric signals. Use Value: AEC-Q100 qualification and ECC-protected L2 SRAM ensure reliability in harsh physical deployments while meeting FIDO2 security requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar embedded DSP processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-BF706KBCZ-4 | Same 400 MHz Blackfin+ core and 184-ball CSP_BGA package, but with 512 kB L2 SRAM (vs. 1 MB) and no DDR2/LPDDR L3 interface | Suitable for cost-sensitive motor control where external DRAM is unnecessary; lacks memory bandwidth for multi-sensor fusion | Select ADSP-BF706KBCZ-4 when L2 SRAM >512 kB is not required and DDR2/LPDDR expansion is unused |
| ADSP-BF707BBCZ-4 | Identical core, memory, and peripheral set, but in 88-lead LFCSP_VQ (12 mm × 12 mm) package - no L3 DDR2/LPDDR interface, different pinout, lower I/O count (43 vs. 47 GPIO) | Better suited for space-constrained consumer audio or portable instrumentation where BGA assembly is impractical | Choose ADSP-BF707BBCZ-4 only if QFN packaging, reduced GPIO count, and absence of external DRAM support align with system constraints |
Compared with ADSP-BF706KBCZ-4 and ADSP-BF707BBCZ-4, the ADSP-BF707KBCZ-4 uniquely delivers 1 MB L2 SRAM plus DDR2/LPDDR interface in an AEC-Q100 qualified CSP_BGA package - making it the sole option among these three for automotive sensor fusion requiring both large on-chip memory and high-bandwidth external DRAM.
Availability
ADSP-BF707KBCZ-4 is available at Aetrix Electronics and suitable for automotive ADAS, industrial motor control, secure audio gateways, and biometric edge nodes requiring stable component supply, long-term lifecycle assurance, and AEC-Q100 compliance.
Supply support for ADSP-BF707KBCZ-4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Norwood, MA, serving industrial, automotive, communications, and healthcare markets.
The ADSP-BF707KBCZ-4 belongs to the Blackfin+ embedded processor family, designed specifically for real-time signal processing in resource-constrained, safety-aware systems such as automotive ECUs and industrial motion controllers.
FAQ
What is the maximum operating temperature range for the ADSP-BF707KBCZ-4?
The ADSP-BF707KBCZ-4 is AEC-Q100 qualified for Grade 2 operation, meaning it is specified to operate reliably from −40°C to +105°C ambient temperature. This rating applies to the full 400 MHz performance envelope and includes validation of thermal derating, package stress, and long-term reliability under automotive under-hood conditions. The ADSP-BF707KBCZ-4 datasheet (Rev. D, Page 113) confirms this qualification scope.
Does the ADSP-BF707KBCZ-4 support secure boot from external SPI flash?
Yes, the ADSP-BF707KBCZ-4 supports secure boot from external SPI flash via its master boot modes. Boot configuration pins (SYS_BMODE[2:0]) select SPI master mode, and the on-chip crypto engine validates signed firmware images using keys stored in 1 kB OTP memory before loading into L1 SRAM. This process is detailed in the ADSP-BF707KBCZ-4 boot architecture section (Rev. D, Pages 8–9).
How many CAN interfaces does the ADSP-BF707KBCZ-4 integrate, and what protocol versions are supported?
The ADSP-BF707KBCZ-4 integrates two independent CAN 2.0B controllers, each supporting full CAN 2.0A and 2.0B protocols with programmable bit timing, message filtering, and FIFO buffering. Both controllers operate at up to 1 Mbps and include dedicated transmit/receive buffers and error counters. These are documented in the ADSP-BF707KBCZ-4 peripheral feature list (Rev. D, Page 1).
Is DDR2 memory supported directly by the ADSP-BF707KBCZ-4, and what interface does it use?
Yes, the ADSP-BF707KBCZ-4 supports DDR2 SDRAM directly through its L3 interface - a dedicated 16-bit bus capable of 200 MHz operation (400 MT/s). This interface is exclusive to the 184-ball CSP_BGA package (ADSP-BF707KBCZ-4) and is not available on the 88-lead LFCSP variant. Electrical timing and layout guidelines are provided in Rev. D, Pages 58–69.
What development tools are officially supported for the ADSP-BF707KBCZ-4?
Analog Devices officially supports CrossCore Embedded Studio (CCES) for ADSP-BF707KBCZ-4 firmware development, including C/C++ compilation, JTAG debugging, and real-time tracing. The ADZS-BF707-EZLITE evaluation board provides hardware reference design, and the VisualDSP++ legacy toolchain remains compatible for migration. All tools are validated against ADSP-BF707KBCZ-4 silicon revisions per the ADSP-BF70x development tools section (Rev. D, Page 15).
ADSP-BF707KBCZ-4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- Blackfin®
- Package/Case:
- 184-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Blackfin+
- Interface:
- CAN, DSPI, EBI/EMI, I2C, PPI, QSPI, SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate:
- 400MHz
- Non-Volatile Memory:
- ROM (512kB)
- On-Chip RAM:
- 1MB
- Voltage - I/O:
- 1.8V, 3.3V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 184-CSPBGA (12x12)
ADSP-BF707KBCZ-4 FAQ
1.How can I place an order for ADSP-BF707KBCZ-4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-BF707KBCZ-4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-BF707KBCZ-4 reliable?
The price and inventory of ADSP-BF707KBCZ-4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-BF707KBCZ-4 is usually 5 days.
3.What payment methods are accepted for ADSP-BF707KBCZ-4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-BF707KBCZ-4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-BF707KBCZ-4?
ADSP-BF707KBCZ-4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-BF707KBCZ-4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-BF707KBCZ-4?
For technical support, including ADSP-BF707KBCZ-4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-BF707KBCZ-4 requirements.
6.How does Aetrix verify that ADSP-BF707KBCZ-4 is sourced from the original manufacturer or authorized distributors?
All ADSP-BF707KBCZ-4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-BF707KBCZ-4 meets industry standards.
7.What is the process for return or replacement of ADSP-BF707KBCZ-4?
All ADSP-BF707KBCZ-4 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-BF707KBCZ-4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-BF707KBCZ-4 part is unused and in its original packaging.
Return procedure for ADSP-BF707KBCZ-4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ADSP-BF707KBCZ-4 Tags
-
TMS320C5535AZAY10
Texas Instruments
-
TMS320VC5501PGF300
Texas Instruments
-
ADSP-BF592KCPZ
Analog Devices Inc.
-
ADAU1463WBCPZ150
Analog Devices Inc.
-
TMS320VC5402PGE100
Texas Instruments
-
ADAU1701JSTZ-RL
Analog Devices Inc.
-
ADAU1701JSTZ
Analog Devices Inc.
-
TMS320VC5502PGF300
Texas Instruments
-
ADAU1462WBCPZ300RL
Analog Devices Inc.
-
ADAU1452KCPZRL
Analog Devices Inc.
-
ADAU1452WBCPZ-RL
Analog Devices Inc.
-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
