Analog Devices Inc. ADSP-SC571CSWZ-3

Overview

ADSP-SC571CSWZ-3 from Analog Devices is a dual-core SHARC+ DSP with integrated Arm Cortex-A5 processor, operating at 500 MHz per SHARC+ core and 500 MHz for the Arm core. It integrates 2 × 384 kB L1 SRAM with parity, 256 kB L2 cache with parity, 1 MB L2 SRAM with ECC, and supports 32-/40-/64-bit floating-point arithmetic. It targets high-performance automotive audio processing, real-time control, and industrial signal conditioning systems.

For engineers reviewing the ADSP-SC571CSWZ-3 datasheet, ADSP-SC571CSWZ-3 pinout, ADSP-SC571CSWZ-3 application, or ADSP-SC571CSWZ-3 equivalent, key selection criteria include dual-core SHARC+ clock speed, Arm Cortex-A5 integration, on-chip memory configuration (L1/L2), AEC-Q100 qualification, and peripheral set including dual CAN 2.0, USB 2.0 HS, EMAC, and 8-channel 12-bit HADC.

Technical Context

The ADSP-SC571CSWZ-3 implements a heterogeneous dual-processor architecture: one Arm Cortex-A5 core handling OS-level tasks and system management, and two SHARC+ cores executing deterministic, low-latency floating-point signal processing. Its system fabric enables cache-coherent data sharing between cores via a 64-bit completer port and supports full memory coherency across L1 and L2 domains.

It features a dedicated acceleration subsystem with hardware FIR/IIR offload engines, cryptographic accelerators supporting fast secure boot and Arm TrustZone, and a safety-critical infrastructure including dual CRC, watchdog timers, thermal monitor unit (TMU), and system protection unit (SPU). The device is AEC-Q100 Grade 2 qualified (−40°C to +105°C) and includes fault management and trigger routing units for automotive functional safety compliance.

Key Specifications

Pinout & Package

ADSP-SC571CSWZ-3 uses a 176-lead LQFP_EP (exposed pad) package, 24 mm × 24 mm, 0.5 mm pitch, with thermal pad for automotive-grade thermal dissipation. Pin assignments are defined in Analog Devices' ADSP-SC57x/ADSP-2157x 176-Lead LQFP Lead Assignments (Rev. C, pp. 134–137).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous DSP+Arm applications.

Compared with ADSP-SC571CSWZ-3, ADSP-SC572CSWZ-3 offers greater memory scalability at the cost of layout complexity, while ADSP-SC571WCSWZ-3 extends thermal range without altering functionality-making the base ADSP-SC571CSWZ-3 optimal for cabin-integrated automotive and industrial edge applications.

Availability

ADSP-SC571CSWZ-3 is available at Aetrix Electronics and suitable for automotive infotainment, industrial motor control, professional audio equipment, and medical imaging systems requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant silicon.

Supply support for ADSP-SC571CSWZ-3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and digital signal processing semiconductors, headquartered in Wilmington, MA.

The ADSP-SC57x family is designed specifically for safety-critical, high-fidelity signal processing in automotive and industrial environments - combining SHARC+ DSP performance with Arm application processing and integrated functional safety features.

FAQ

What is the maximum operating frequency of each SHARC+ core in the ADSP-SC571CSWZ-3?

The ADSP-SC571CSWZ-3 features two SHARC+ cores, each operating at a maximum frequency of 500 MHz. This is confirmed in Table 2 of the Rev. C datasheet, which specifies "SHARC+ Core1 (MHz, Max): 500" and "SHARC+ Core2 (MHz, Max): 500" for the ADSP-SC571 variant. This enables up to 6 GFLOPS peak performance per core for floating-point intensive tasks such as FFTs and FIR filtering.

Does the ADSP-SC571CSWZ-3 support external DDR memory?

No, the ADSP-SC571CSWZ-3 does not integrate a DDR memory controller. As shown in Table 2 of the Rev. C datasheet, the "DDR3/DDR2/LPDDR1 Controller (16-bit)" entry is marked "N/A" for ADSP-SC571. Only ADSP-SC572 and ADSP-SC573 variants include this controller. The ADSP-SC571CSWZ-3 relies on its 1 MB on-chip L2 SRAM with ECC and 2 × 384 kB L1 SRAM for all memory needs.

What package type and thermal characteristics does the ADSP-SC571CSWZ-3 use?

The ADSP-SC571CSWZ-3 uses a 176-lead LQFP_EP (exposed pad) package, measuring 24 mm × 24 mm with 0.5 mm lead pitch. It is RoHS compliant and rated for automotive temperature range (−40°C to +105°C). The exposed pad enhances thermal dissipation, supporting continuous operation at full speed in convection-cooled automotive ECUs without forced airflow.

Is the ADSP-SC571CSWZ-3 AEC-Q100 qualified, and what grade does it meet?

Yes, the ADSP-SC571CSWZ-3 is AEC-Q100 qualified and meets Grade 2 requirements (−40°C to +105°C ambient). This is explicitly stated in the "Additional Features" section and confirmed in Table 3 of the Rev. C datasheet under "ADSP-SC571W" - where the non-W suffix denotes commercial/industrial qualification, and the W suffix indicates extended Grade 1. The base ADSP-SC571CSWZ-3 is qualified to Grade 2 per AEC-Q100 Rev. H.

How many CAN interfaces does the ADSP-SC571CSWZ-3 support, and what version?

The ADSP-SC571CSWZ-3 supports two CAN 2.0 interfaces, as documented in the "PERIPHERALS" block diagram (page 2) and Table 1 ("CAN2.0: 2"). These are full CAN 2.0B controllers with message objects, FIFOs, and bit-rate programming - compatible with standard automotive CAN networks at up to 1 Mbps. They do not support CAN FD.