Analog Devices Inc. ADSP-SC572CBCZ-4

Overview

ADSP-SC572CBCZ-4 from Analog Devices is a dual-core SHARC+ DSP with integrated Arm Cortex-A5 processor, delivering 500 MHz per SHARC+ core and 500 MHz Arm Cortex-A5 operation. It features 384 kB L1 SRAM per SHARC+ core, 256 kB L2 cache with parity, and supports 32-/40-/64-bit floating-point arithmetic. Designed for automotive audio processing, it integrates dual CAN 2.0 controllers, USB 2.0 HS, EMAC (10/100/1000), and SDIO/eMMC interfaces.

For engineers reviewing the ADSP-SC572CBCZ-4 datasheet, ADSP-SC572CBCZ-4 pinout, ADSP-SC572CBCZ-4 application, or ADSP-SC572CBCZ-4 equivalent, key selection criteria include dual-core SHARC+ clock speed, L2 SRAM ECC protection, AEC-Q100 qualification, 400-ball CSP_BGA package compatibility, and real-time deterministic signal processing capability in safety-critical automotive domains.

Technical Context

The ADSP-SC572CBCZ-4 implements a heterogeneous dual-processor architecture: one Arm Cortex-A5 core handling high-level OS tasks and system control, and two SHARC+ cores executing time-critical floating-point signal processing. Its memory subsystem includes 3 Mb L1 SRAM (1.5 Mb per core) with parity, 1 MB L2 SRAM with ECC, and a 16-bit DDR3/DDR2/LPDDR1 interface via L3.

Peripherals are routed through a configurable Signal Routing Unit (SRU), supporting simultaneous use of full SPORTs, S/PDIF, ASRCs, and DAI. Safety features include dual CRC engines, watchdog timers, thermal monitoring unit (TMU), and Arm TrustZone security extensions-enabling secure boot and cryptographic acceleration for automotive functional safety compliance.

Key Specifications

Pinout & Package

ADSP-SC572CBCZ-4 uses a 400-ball CSP_BGA package (17 mm × 17 mm, 0.65 mm pitch, RoHS compliant). Ball assignments follow Analog Devices' standardized 400-ball CSP_BGA layout with dedicated power, ground, I/O banks, and differential clock pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous DSP+application processor applications.

Compared with ADSP-SC573CBCZ-4, the ADSP-SC572CBCZ-4 omits USB PHY and eMMC controller to reduce power and cost - ideal for audio-only automotive modules. Against i.MX8M Plus, ADSP-SC572CBCZ-4 delivers superior floating-point determinism and legacy SHARC software compatibility, but lacks AI acceleration and advanced graphics support.

Availability

ADSP-SC572CBCZ-4 is available at Aetrix Electronics and suitable for automotive infotainment systems, professional audio equipment, and industrial audio analytics gateways requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for ADSP-SC572CBCZ-4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global semiconductor leader specializing in high-performance analog, mixed-signal, and digital signal processing technologies for precision, power, and connectivity applications.

The ADSP-SC57x product line was designed specifically for automotive and professional audio systems requiring deterministic real-time processing, functional safety compliance, and heterogeneous compute - combining SHARC+ DSP performance with Arm application-layer flexibility.

FAQ

What is the maximum operating frequency of each SHARC+ core in the ADSP-SC572CBCZ-4?

The ADSP-SC572CBCZ-4 operates each SHARC+ core at up to 500 MHz, as confirmed in Table 2 of the Rev. C datasheet. This frequency is supported across the full automotive temperature range (−40°C to +105°C) and enables 2× 500 MMACS of sustained floating-point performance. The ADSP-SC572CBCZ-4 achieves this without requiring external cooling beyond standard PCB thermal vias and copper pour.

Does the ADSP-SC572CBCZ-4 support AEC-Q100 qualification, and what grade is it rated for?

Yes, the ADSP-SC572CBCZ-4 is AEC-Q100 qualified for Grade 2 (−40°C to +105°C), as stated in the "Additional Features" section and confirmed in Table 3 of the Rev. C datasheet. This qualification covers thermal cycling, humidity testing, and ESD robustness required for under-dash automotive applications. The ADSP-SC572CBCZ-4 meets these requirements with its integrated TMU and safety monitors.

How much on-chip SRAM does the ADSP-SC572CBCZ-4 provide, and how is it allocated?

The ADSP-SC572CBCZ-4 provides 3 Mb (384 kB) of L1 SRAM per SHARC+ core - totaling 768 kB - plus 1 MB of shared L2 SRAM with ECC protection. L1 SRAM is partitioned into program memory (PM), data memory (DM), and instruction cache blocks, configurable per core. The ADSP-SC572CBCZ-4 also includes 256 kB L2 cache with parity for the Arm Cortex-A5 core.

Which package type is used by the ADSP-SC572CBCZ-4, and what are its key mechanical characteristics?

The ADSP-SC572CBCZ-4 uses a 400-ball CSP_BGA package measuring 17 mm × 17 mm with 0.65 mm ball pitch and RoHS compliance. Its ball map includes dedicated power/ground arrays, differential clock inputs, and banked I/O supporting 1.8 V or 3.3 V signaling. The ADSP-SC572CBCZ-4 package is optimized for automotive thermal dissipation and high-speed signal integrity per IPC-7351B standards.

What peripheral interfaces are integrated into the ADSP-SC572CBCZ-4 for automotive networking?

The ADSP-SC572CBCZ-4 integrates two CAN 2.0 controllers, an EMAC supporting 10/100/1000 Mbps with IEEE 1588 timestamping, and MLB 3-pin/6-pin interfaces - all explicitly listed in Table 1 and Figure 1 of the Rev. C datasheet. These interfaces enable direct connection to vehicle networks without external transceivers or bridge ICs, reducing bill-of-materials and board space in ADSP-SC572CBCZ-4-based ECUs.