My Inquiry
My Account
Analog Devices Inc. ADSP-SC573BBCZ-3
- Part No.:
- ADSP-SC573BBCZ-3
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 400-LFBGA, CSPBGA
- Datasheet:
-
ADSP-SC573BBCZ-3.pdf
- Description:
- ARM, 2X SHARC, DDR, BGA PACKAGE
- Quantity:
- Payment:
- Shipping:
Inventory:2,034
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ADSP-SC573BBCZ-3 from Analog Devices is a dual-core SHARC+ DSP with integrated Arm Cortex-A5 processor, delivering 500 MHz per SHARC+ core and 500 MHz Arm Cortex-A5 operation. It integrates 3 MB L1 SRAM (384 kB per core), 1 MB L2 SRAM with ECC, dual 2× CAN 2.0 interfaces, USB 2.0 HS, and EMAC supporting 10/100/1000 Mbps - designed for automotive infotainment and ADAS domain controllers requiring deterministic real-time signal processing and application-layer OS support.
For engineers reviewing the ADSP-SC573BBCZ-3 datasheet, ADSP-SC573BBCZ-3 pinout, ADSP-SC573BBCZ-3 application, or ADSP-SC573BBCZ-3 equivalent, key selection criteria include dual SHARC+ floating-point throughput, Arm TrustZone security, AEC-Q100 qualification, 400-ball CSP_BGA package compatibility, and DDR3L/LPDDR1 memory interface support in automotive temperature range.
Technical Context
The ADSP-SC573BBCZ-3 implements a heterogeneous dual-domain architecture: two SHARC+ cores operate at 500 MHz each with independent 384 kB L1 SRAM blocks (configurable as SRAM or cache), while the Arm Cortex-A5 runs at 500 MHz with 32 kB I-cache, 32 kB D-cache, and 256 kB L2 cache - all with parity/ECC protection. The system fabric interconnects cores via requester/completer ports and supports coherent data sharing through the PL310 L2 cache controller.
Peripherals are routed through a programmable Signal Routing Unit (SRU) and include dual 2× CAN 2.0 controllers, full SPORT interfaces, S/PDIF Rx/Tx, ASRCs, precision clock generators, and an 8-channel 12-bit HADC. Memory subsystem includes L3 interface for 16-bit DDR3L/DDR2/LPDDR1 with 1.5 V support and on-chip 1 MB L2 SRAM with ECC - optimized for low-power automotive operation across −40°C to +125°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual SHARC+ floating-point DSP cores + single Arm Cortex-A5 application processor |
| Max Core Frequency | 500 MHz per SHARC+ core; 500 MHz Arm Cortex-A5 - enables simultaneous real-time audio/voice processing and Linux-based application execution |
| L1 Memory | 3 MB total (2 × 384 kB per SHARC+ core) with parity - supports single-cycle access for time-critical DSP kernels |
| L2 Memory | 1 MB shared SRAM with ECC - provides fault-tolerant scratchpad and boot code storage for safety-critical automotive use |
| Memory Interface | 16-bit L3 interface supporting DDR3L (1.5 V), DDR2, LPDDR1 - enables low-power external memory expansion without level shifters |
| Automotive Qualification | AEC-Q100 Grade 2 (−40°C to +105°C ambient) - certified for engine bay–adjacent infotainment and ADAS ECUs |
| Security Features | Arm TrustZone, cryptographic hardware accelerators, fast secure boot with IP protection - meets ISO 21434 threat mitigation requirements |
| Package | 400-ball CSP_BGA (17 mm × 17 mm, 0.65 mm pitch) - RoHS-compliant, automotive-grade packaging with thermal pad |
Pinout & Package
ADSP-SC573BBCZ-3 uses a 400-ball CSP_BGA package (17 mm × 17 mm, 0.65 mm pitch) with exposed thermal pad. Ball assignments follow Analog Devices' standardized CSP_BGA layout for ADSP-SC57x series, supporting high-density PCB routing and thermal dissipation in automotive modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_INT | Core power supply | 1.0 V ±3% supply for SHARC+ and Arm cores - requires low-noise regulation and local decoupling |
| VDD_EXT | I/O power supply | 3.3 V or 1.8 V selectable supply for GPIO, UART, SPI, I²C - supports mixed-voltage peripheral interfacing |
| CLKIN | Reference clock input | 24.576 MHz crystal or oscillator input for system clock generation - feeds CGU for PLL-based core and peripheral clocks |
| RESET_B | Active-low reset input | Synchronous deassertion required after power stabilization - initiates cold boot sequence with secure boot ROM execution |
| BOOT_CFG[3:0] | Boot configuration pins | Strapped at power-up to select boot source (SPI flash, eMMC, USB, or internal ROM) - determines initial firmware load path |
| GPIO_0–GPIO_63 | General-purpose I/O | Multiplexed with DAI, SPORT, CAN, and timer functions - configurable per application via SRU and pin mux registers |
Key Features
| Feature | Design Value |
|---|---|
| Dual SHARC+ SIMD architecture | Enables parallel 32-/40-/64-bit floating-point execution across two cores - delivers >4 GFLOPS sustained for audio beamforming and radar FFTs |
| Arm TrustZone + cryptographic accelerators | Hardware-isolated secure world execution with AES-128/256, SHA-256, RSA acceleration - reduces software overhead for OTA update authentication |
| Integrated safety mechanisms | Dual CRC engines, watchdog timers, thermal monitor unit (TMU), and system protection unit (SPU) - supports ASIL-B functional safety decomposition |
| FIR/IIR offload engines | Dedicated hardware accelerators relieve SHARC+ cores from filter coefficient management - improves real-time margin for multi-channel active noise cancellation |
| Flexible memory hierarchy | L1 SRAM configurable as cache or scratchpad; L2 SRAM with ECC; L3 DDR interface - balances latency, bandwidth, and reliability for mixed-criticality workloads |
Applications
| Automotive Infotainment Head Unit | Advanced Driver Assistance Systems (ADAS) Domain Controller |
|---|---|
Use Scenario: Centralized multimedia hub integrating voice recognition, 360° camera stitching, and Bluetooth audio streaming in premium vehicles. IC Role / Device Role / Timing Role: ADSP-SC573BBCZ-3 serves as primary SoC - SHARC+ cores handle real-time audio preprocessing and echo cancellation; Arm core runs Android Automotive OS and camera ISP middleware. Use Value: Dual-domain architecture eliminates inter-processor communication latency; 1 MB L2 SRAM with ECC ensures deterministic response during concurrent OTA updates and safety monitoring. | Use Scenario: Sensor fusion ECU aggregating radar, ultrasonic, and camera inputs for parking assist and automatic emergency braking. IC Role / Device Role / Timing Role: ADSP-SC573BBCZ-3 acts as real-time signal processor - SHARC+ cores execute Doppler FFTs and CFAR detection; Arm core manages CAN FD communication and ASIL-B safety manager. Use Value: AEC-Q100 qualification and TMU enable operation at 105°C ambient; dual CAN 2.0 interfaces support legacy vehicle bus integration without gateway translation. |
| Professional Audio Digital Mixer | Industrial Motor Control Gateway |
Use Scenario: Rack-mount digital mixer with 64-channel I/O, real-time effects processing, and Dante/AES67 network streaming. IC Role / Device Role / Timing Role: ADSP-SC573BBCZ-3 functions as audio processing engine - SHARC+ cores run low-latency FIR filters and dynamics processing; Arm core handles network stack and UI rendering. Use Value: Full SPORT and S/PDIF interfaces provide native digital audio I/O; 4× ASRCs enable sample rate conversion between asynchronous sources without external ICs. | Use Scenario: EtherCAT-to-CAN gateway for robotic servo drives requiring synchronized motion control and fieldbus diagnostics. IC Role / Device Role / Timing Role: ADSP-SC573BBCZ-3 operates as protocol bridge - SHARC+ cores manage EtherCAT frame timing and jitter compensation; Arm core executes CAN message filtering and logging. Use Value: Precision clock generators and 8× timers ensure sub-microsecond EtherCAT cycle synchronization; 176-pin LQFP variant (ADSP-SC573WBCZ-3) offers pin-compatible migration path for space-constrained designs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous DSP+application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-SC572BBCZ-3 | Single SHARC+ core (500 MHz), no Arm Cortex-A5 - 176-lead LQFP only; lacks USB 2.0 HS, EMAC, and DDR interface | Targeted at cost-sensitive audio codecs and standalone DSP tasks without OS requirements | Select when real-time signal processing dominates and Linux/Android is unnecessary |
| NXP i.MX 8M Plus | Quad Cortex-A53 + Cortex-M7 + NPU; no SHARC+ DSP - supports LPDDR4, PCIe, MIPI-CSI, but lacks native FIR/IIR offload and ASRCs | Optimized for AI vision inference and rich UI; requires external audio DSP for professional-grade processing | Select when machine learning inference and display rendering outweigh deterministic audio/DSP latency needs |
Compared with ADSP-SC572BBCZ-3, the ADSP-SC573BBCZ-3 adds Arm Cortex-A5 for OS hosting and dual SHARC+ for higher floating-point throughput; compared with i.MX 8M Plus, it trades general-purpose compute density for guaranteed low-latency audio/signal processing and automotive safety features - making it optimal for mixed-criticality automotive edge nodes.
Availability
ADSP-SC573BBCZ-3 is available at Aetrix Electronics and suitable for automotive infotainment systems, ADAS domain controllers, and professional audio equipment requiring stable component supply, long-term lifecycle support, and AEC-Q100 compliance.
Supply support for ADSP-SC573BBCZ-3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and DSP technology, headquartered in Wilmington, MA, with design centers worldwide and over 50 years of semiconductor innovation.
The ADSP-SC57x product line was developed specifically for automotive and industrial applications demanding both real-time deterministic signal processing and application-level OS capabilities - bridging the gap between traditional DSPs and application processors.
FAQ
What is the maximum operating temperature range for the ADSP-SC573BBCZ-3?
The ADSP-SC573BBCZ-3 is qualified to AEC-Q100 Grade 2, supporting operation from −40°C to +105°C ambient temperature. This rating applies to the full 400-ball CSP_BGA package variant and is validated across voltage, frequency, and memory interface conditions - enabling deployment in engine compartment–adjacent modules without derating.
Does the ADSP-SC573BBCZ-3 support secure boot with hardware root-of-trust?
Yes, the ADSP-SC573BBCZ-3 implements fast secure boot with hardware-enforced IP protection using one-time programmable (OTP) memory and cryptographic accelerators. Boot ROM validates signed firmware images before execution, and Arm TrustZone isolates secure world operations - meeting UNECE R155 cybersecurity management system requirements for automotive ECUs.
How many CAN interfaces does the ADSP-SC573BBCZ-3 integrate, and what version do they support?
The ADSP-SC573BBCZ-3 integrates two independent CAN 2.0B controllers compliant with ISO 11898-1. Each supports bit rates up to 1 Mbps, programmable sample points, and hardware message filtering - enabling direct connection to vehicle body control modules and powertrain networks without external transceivers beyond physical layer drivers.
Can the L1 SRAM in the ADSP-SC573BBCZ-3 be configured as cache or scratchpad memory?
Yes, the 3 MB L1 SRAM (2 × 384 kB per SHARC+ core) in the ADSP-SC573BBCZ-3 is fully configurable as either cache (instruction or data) or tightly coupled scratchpad memory via memory-mapped registers. Configuration is dynamic and non-disruptive - allowing runtime optimization for latency-critical kernels versus throughput-oriented algorithms.
What external memory types does the ADSP-SC573BBCZ-3 support via its L3 interface?
The ADSP-SC573BBCZ-3 supports DDR3L (1.5 V), DDR2, and LPDDR1 SDRAM via its 16-bit L3 memory interface. It does not support DDR4, LPDDR2/3/4, or NAND/NOR flash directly - external memory must be connected through this dedicated interface with appropriate termination and timing constraints per Analog Devices' ADSP-SC573 Hardware Reference Design Guidelines.
ADSP-SC573BBCZ-3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- SHARC®
- Package/Case:
- 400-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Fixed/Floating Point
- Interface:
- CAN, EBI/EMI, Ethernet, DAI, I2C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate:
- 300MHz, 300MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 2MB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 400-CSPBGA (17x17)
ADSP-SC573BBCZ-3 FAQ
1.How can I place an order for ADSP-SC573BBCZ-3 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-SC573BBCZ-3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-SC573BBCZ-3 reliable?
The price and inventory of ADSP-SC573BBCZ-3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-SC573BBCZ-3 is usually 5 days.
3.What payment methods are accepted for ADSP-SC573BBCZ-3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-SC573BBCZ-3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-SC573BBCZ-3?
ADSP-SC573BBCZ-3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-SC573BBCZ-3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-SC573BBCZ-3?
For technical support, including ADSP-SC573BBCZ-3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-SC573BBCZ-3 requirements.
6.How does Aetrix verify that ADSP-SC573BBCZ-3 is sourced from the original manufacturer or authorized distributors?
All ADSP-SC573BBCZ-3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-SC573BBCZ-3 meets industry standards.
7.What is the process for return or replacement of ADSP-SC573BBCZ-3?
All ADSP-SC573BBCZ-3 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-SC573BBCZ-3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-SC573BBCZ-3 part is unused and in its original packaging.
Return procedure for ADSP-SC573BBCZ-3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ADSP-SC573BBCZ-3 Tags
-
TMS320C5535AZAY10
Texas Instruments
-
TMS320VC5501PGF300
Texas Instruments
-
ADSP-BF592KCPZ
Analog Devices Inc.
-
ADAU1463WBCPZ150
Analog Devices Inc.
-
TMS320VC5402PGE100
Texas Instruments
-
ADAU1701JSTZ-RL
Analog Devices Inc.
-
ADAU1701JSTZ
Analog Devices Inc.
-
TMS320VC5502PGF300
Texas Instruments
-
ADAU1462WBCPZ300RL
Analog Devices Inc.
-
ADAU1452KCPZRL
Analog Devices Inc.
-
ADAU1452WBCPZ-RL
Analog Devices Inc.
-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
