Analog Devices Inc. ADSP-SC573CBCZ-5
- Part No.:
- ADSP-SC573CBCZ-5
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 400-LFBGA, CSPBGA
- Datasheet:
-
ADSP-SC573CBCZ-5.pdf
- Description:
- ARM, 2X SHARC, DDR, BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,312
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ADSP-SC573CBCZ-5 from Analog Devices is a dual-core SHARC+ DSP with integrated Arm Cortex-A5 application processor, delivering 500 MHz per SHARC+ core and 500 MHz Arm Cortex-A5 operation. It integrates 2 × 384 kB L1 SRAM (parity), 256 kB L2 cache (parity), 1 MB L2 SRAM (ECC), dual CAN 2.0 interfaces, USB 2.0 HS, EMAC 10/100/1000, and SDIO/eMMC support - designed for real-time audio processing, automotive infotainment, and industrial control systems requiring deterministic floating-point performance and Linux-capable application processing.
For engineers reviewing the ADSP-SC573CBCZ-5 datasheet, ADSP-SC573CBCZ-5 pinout, ADSP-SC573CBCZ-5 application, or ADSP-SC573CBCZ-5 equivalent, key selection considerations include dual SHARC+ core clock speed (500 MHz), Arm Cortex-A5 frequency (500 MHz), 400-ball CSP_BGA package compatibility, AEC-Q100 qualification, and integrated FIR/IIR offload accelerators for low-latency signal path execution.
Technical Context
The ADSP-SC573CBCZ-5 implements a heterogeneous dual-domain architecture: two SHARC+ SIMD cores handle high-throughput, low-latency floating-point signal processing (32-/40-/64-bit) with dedicated L1 SRAM and hardware-accelerated FIR/IIR engines, while the Arm Cortex-A5 core runs rich OS environments (e.g., Linux) and manages system-level tasks including USB, Ethernet, and SDIO. The cores share coherent memory via a system crossbar and L2 cache controller (PL310).
Its system infrastructure includes a safety-aware design with on-chip memory protection, dual CRC units, watchdog timers, thermal monitoring unit (TMU), and Arm TrustZone security extensions. Peripherals are routed through a Signal Routing Unit (SRU) and multiplexed GPIOs, supporting simultaneous high-bandwidth audio (S/PDIF, ASRC, DAI), timing-critical control (CAN, EPPI), and connectivity (USB, EMAC, MLB).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual SHARC+ SIMD + single Arm Cortex-A5 (heterogeneous multicore) |
| SHARC+ Core Speed | 500 MHz - enables real-time execution of complex 64-bit floating-point FFTs and filter banks in audio beamforming |
| Arm Cortex-A5 Speed | 500 MHz / 800 DMIPS - supports Linux kernel boot, GUI frameworks, and network stack without external host processor |
| L1 Memory per SHARC+ | 2 × 384 kB SRAM with parity - provides zero-wait-state access for time-critical DSP code and data buffers |
| L2 Cache & SRAM | 256 kB L2 cache (parity) + 1 MB L2 SRAM (ECC) - ensures data integrity and reduces DDR bandwidth pressure in safety-critical applications |
| Package & Pin Count | 400-ball CSP_BGA (17 mm × 17 mm, 0.65 mm pitch) - supports high I/O density for multi-interface automotive ECUs |
| AEC-Q100 Grade | Grade 2 (−40°C to +105°C) - qualified for under-hood and dashboard-mounted automotive electronics |
| Integrated Peripherals | 2× CAN 2.0, 1× USB 2.0 HS, 1× EMAC (10/100/1000), SDIO/eMMC, 3× UART, 2× SPI + Quad-SPI, 3× I²C - eliminates need for companion interface ICs |
Pinout & Package
ADSP-SC573CBCZ-5 is housed in a 17 mm × 17 mm, 400-ball CSP_BGA package (RoHS compliant) with 0.65 mm ball pitch and standard BGA land pattern. Ball assignments follow JEDEC MO-275AC, with power/ground distribution optimized for low-noise analog/digital partitioning and thermal dissipation across automotive temperature range.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_INT | Core supply (1.0 V ± 3%) | Power domain for SHARC+ and Arm cores; requires low-noise regulation and local decoupling for jitter-sensitive audio processing |
| VDD_DDR | DDR I/O supply (1.35 V or 1.5 V) | Configurable for DDR3L/DDR2/LPDDR1; enables direct connection to low-power mobile DRAM in head-unit designs |
| CLKIN | Differential clock input (1–50 MHz) | Accepts crystal or LVDS reference; feeds CGU for generating core, peripheral, and audio clocks with programmable PLL dividers |
| BOOT_CFG[3:0] | Strap pins for boot mode selection | Determines boot source (SPI flash, eMMC, USB, or UART) at power-up; latched during reset and non-volatile in OTP |
| CAN0_TX / CAN0_RX | Differential CAN transceiver interface | Direct connection to ISO 11898-2 PHY; supports CAN FD framing when paired with external transceiver |
| USB_DP / USB_DM | USB 2.0 HS differential pair | Integrated PHY supports host/device/OTG modes; no external transceiver required for basic USB audio or firmware update |
| EMAC_MDIO / EMAC_MDC | IEEE 802.3 management interface | Controls external Ethernet PHY registers (e.g., link status, speed negotiation); supports IEEE 1588 timestamping via EMAC |
| SDIO_CMD / SDIO_CLK / SDIO_D[0:3] | eMMC/SDIO bus signals | Supports UHS-I SDR50 mode (50 MB/s); enables embedded storage for firmware, audio assets, and log data without NAND controller |
Key Features
| Feature | Design Value |
|---|---|
| SHARC+ SIMD dual-core execution | Enables parallel 64-bit floating-point operations across both cores - critical for real-time acoustic echo cancellation and multi-channel active noise control |
| FIR/IIR hardware offload engines | Dedicated accelerators execute up to 256-tap FIR filters at full core clock rate without consuming SHARC+ instruction cycles - preserves CPU bandwidth for control logic |
| Arm TrustZone security | Hardware-enforced isolation between secure world (firmware updates, crypto keys) and normal world (Linux OS, apps) - meets ISO/SAE 21434 threat mitigation requirements |
| ASRC with 4 channel pairs | Asynchronous sample rate conversion between independent audio domains (e.g., Bluetooth A2DP, USB audio, analog ADC) with <±10 ppm accuracy - eliminates audible clicks/pops |
| Thermal Monitor Unit (TMU) | On-die temperature sensor with programmable thresholds and interrupt generation - enables dynamic frequency scaling or graceful shutdown before junction exceeds 125°C |
| GPIO multiplexing (92 + 20 DAI pins) | Configurable pin functions allow reuse of same physical balls for UART, SPI, I²C, or custom digital I/O - reduces PCB layer count in space-constrained automotive modules |
Applications
| Automotive Infotainment Head Unit | Professional Audio Digital Mixer |
|---|---|
|
Use Scenario: Central multimedia hub integrating navigation, voice assistant, Bluetooth streaming, and rear-seat entertainment in premium vehicles. IC Role / Device Role / Timing Role: ADSP-SC573CBCZ-5 serves as main application processor (Arm) and real-time audio engine (SHARC+), synchronizing multiple audio sources via ASRC and routing through DAI to DACs and amplifiers. Use Value: Eliminates need for separate DSP and application SoC, reducing BOM cost and board area while enabling sub-50 µs latency for voice wake-word detection and acoustic beamforming. |
Use Scenario: 32-channel live sound console with parametric EQ, dynamics processing, and effects rendering for studio and stage use. IC Role / Device Role / Timing Role: ADSP-SC573CBCZ-5 executes low-latency FIR-based speaker correction, IIR-based compression, and floating-point reverb algorithms across dual SHARC+ cores, while Arm handles touchscreen UI and network control (AES67, Dante). Use Value: Delivers >1 GigaMACs of sustained floating-point throughput with deterministic jitter-free audio I/O - meeting AES17-2015 measurement standards for professional gear. |
| Industrial Motor Drive Controller | Medical Ultrasound Beamformer |
|
Use Scenario: Closed-loop servo drive for robotics and CNC systems requiring synchronized PWM generation, current sensing, and field-oriented control (FOC). IC Role / Device Role / Timing Role: ADSP-SC573CBCZ-5 runs FOC algorithm on SHARC+ cores with cycle-accurate PWM output via EPPI and captures ADC samples via HADC; Arm manages EtherCAT master stack and HMI. Use Value: Achieves <1 µs current loop update time using hardware-accelerated trigonometric and matrix math - enabling 20 kHz switching frequencies in SiC-based inverters. |
Use Scenario: Portable ultrasound device performing real-time beamforming, RF demodulation, and image reconstruction at point-of-care. IC Role / Device Role / Timing Role: ADSP-SC573CBCZ-5 processes raw channel data from 128-element transducer array using SHARC+ SIMD for delay-and-sum beamforming, while Arm renders B-mode images and handles DICOM export over WiFi. Use Value: Leverages 64-bit floating-point precision and L1 SRAM bandwidth to sustain >1.2 GOPS of beamforming compute - achieving 30 fps imaging at 15 MHz center frequency with <1% SNR degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar heterogeneous DSP + application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-SC572BCBZ-4 | Same dual SHARC+/Arm architecture but lower Arm clock (450 MHz), no DDR controller, and 176-lead LQFP package (vs. 400-ball BGA) | Targeted at cost-sensitive, lower-bandwidth applications (e.g., entry-tier audio processors) without external DRAM or high-speed connectivity | Select ADSP-SC572BCBZ-4 only if DDR3 interface, USB 2.0 HS, and EMAC 1000BASE-T are unnecessary and LQFP assembly is preferred. |
| NXP i.MX 8M Plus | Quad Cortex-A53 + Cortex-M7 + NPU; lacks native SHARC+ floating-point SIMD, no integrated FIR/IIR accelerators, and no ASRC or DAI | Better suited for AI inference and video processing; requires external audio DSP for professional-grade real-time audio paths | Choose i.MX 8M Plus when vision/AI workloads dominate and audio processing can be offloaded - not a functional replacement for ADSP-SC573CBCZ-5's deterministic DSP capabilities. |
Compared with ADSP-SC572BCBZ-4, ADSP-SC573CBCZ-5 delivers higher compute density, DDR3 support, and automotive-grade BGA packaging; versus i.MX 8M Plus, it provides guaranteed sub-microsecond audio latency and hardware-accelerated signal processing unavailable in general-purpose application processors.
Availability
ADSP-SC573CBCZ-5 is available at Aetrix Electronics and suitable for automotive infotainment, professional audio equipment, and industrial motor control applications requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.
Supply support for ADSP-SC573CBCZ-5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global leader in high-performance analog, mixed-signal, and DSP technology, headquartered in Wilmington, MA, with design centers worldwide and manufacturing in the U.S., Ireland, and the Philippines.
The ADSP-SC57x series belongs to Analog Devices' SHARC+ family - engineered specifically for applications demanding both high-fidelity real-time signal processing and rich operating system support in a single chip, targeting automotive, pro-audio, and industrial markets.
FAQ
What is the maximum operating temperature rating for ADSP-SC573CBCZ-5?
ADSP-SC573CBCZ-5 is AEC-Q100 Grade 2 qualified, rated for continuous operation from −40°C to +105°C ambient temperature. Its Thermal Monitor Unit (TMU) provides on-die temperature sensing with programmable interrupts, enabling thermal throttling or safe shutdown before junction temperature exceeds 125°C - essential for under-hood automotive deployment.
Does ADSP-SC573CBCZ-5 support boot from eMMC?
Yes, ADSP-SC573CBCZ-5 supports boot directly from eMMC via its integrated SDIO controller. Boot mode is selected using BOOT_CFG[3:0] strap pins, and the ROM bootloader initializes the eMMC interface, loads the first-stage bootloader (e.g., SPL), and executes it - enabling secure, high-reliability firmware storage without external SPI flash.
How many independent audio sample rate domains does ADSP-SC573CBCZ-5 support?
ADSP-SC573CBCZ-5 supports four independent asynchronous sample rate conversion (ASRC) channel pairs, allowing simultaneous bridging between up to eight different audio clock domains (e.g., 44.1 kHz Bluetooth stream, 48 kHz USB audio, 96 kHz ADC capture, and 192 kHz DAC playback). Each ASRC operates with <±10 ppm accuracy and configurable interpolation filters.
Is the Arm Cortex-A5 core in ADSP-SC573CBCZ-5 cache-coherent with the SHARC+ cores?
No - the Arm Cortex-A5 and SHARC+ cores are not cache-coherent by default. Coherency is maintained through software-managed memory barriers and explicit cache maintenance operations (e.g., Clean/Invalidate by VA), or via the L2 cache controller (PL310) which provides a shared coherent view for data accessed through its requester ports. Shared memory regions must be explicitly allocated and managed.
Can ADSP-SC573CBCZ-5 run Linux on the Arm core while executing real-time audio on SHARC+ cores?
Yes, ADSP-SC573CBCZ-5 is architected for concurrent operation: the Arm Cortex-A5 core runs Linux (Yocto or Buildroot) handling UI, networking, and file I/O, while the dual SHARC+ cores execute hard real-time audio processing (e.g., ASRC, FIR, beamforming) with guaranteed latency - enabled by inter-core messaging via shared memory and CoreSight debug infrastructure.
ADSP-SC573CBCZ-5 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- SHARC®
- Package/Case:
- 400-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Fixed/Floating Point
- Interface:
- CAN, EBI/EMI, Ethernet, DAI, I2C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate:
- 500MHz, 500MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 2MB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- -40°C ~ 95°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 400-CSPBGA (17x17)
ADSP-SC573CBCZ-5 FAQ
1.How can I place an order for ADSP-SC573CBCZ-5 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-SC573CBCZ-5 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-SC573CBCZ-5 reliable?
The price and inventory of ADSP-SC573CBCZ-5 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-SC573CBCZ-5 is usually 5 days.
3.What payment methods are accepted for ADSP-SC573CBCZ-5?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-SC573CBCZ-5 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-SC573CBCZ-5?
ADSP-SC573CBCZ-5 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-SC573CBCZ-5 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-SC573CBCZ-5?
For technical support, including ADSP-SC573CBCZ-5 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-SC573CBCZ-5 requirements.
6.How does Aetrix verify that ADSP-SC573CBCZ-5 is sourced from the original manufacturer or authorized distributors?
All ADSP-SC573CBCZ-5 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-SC573CBCZ-5 meets industry standards.
7.What is the process for return or replacement of ADSP-SC573CBCZ-5?
All ADSP-SC573CBCZ-5 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-SC573CBCZ-5, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-SC573CBCZ-5 part is unused and in its original packaging.
Return procedure for ADSP-SC573CBCZ-5:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ADSP-SC573CBCZ-5 Tags
-
TMS320C5535AZAY10
Texas Instruments

-
TMS320VC5501PGF300
Texas Instruments

-
ADSP-BF592KCPZ
Analog Devices Inc.

-
ADAU1463WBCPZ150
Analog Devices Inc.

-
TMS320VC5402PGE100
Texas Instruments

-
ADAU1701JSTZ-RL
Analog Devices Inc.

-
ADAU1701JSTZ
Analog Devices Inc.

-
TMS320VC5502PGF300
Texas Instruments

-
ADAU1462WBCPZ300RL
Analog Devices Inc.

-
ADAU1452KCPZRL
Analog Devices Inc.

-
ADAU1452WBCPZ-RL
Analog Devices Inc.

-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

