My Inquiry
My Account
Analog Devices Inc. ADSP-SC573KBCZ-3
- Part No.:
- ADSP-SC573KBCZ-3
- Manufacturer:
- Analog Devices Inc.
- Category:
- DSP (Digital Signal Processors)
- Package:
- 400-LFBGA, CSPBGA
- Datasheet:
-
ADSP-SC573KBCZ-3.pdf
- Description:
- ARM, 2X SHARC, DDR, BGA PACKAGE
- Quantity:
- Payment:
- Shipping:
Inventory:2,502
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ADSP-SC573KBCZ-3 from Analog Devices is a dual-core SHARC+ DSP with integrated Arm Cortex-A5 processor, delivering 500 MHz per SHARC+ core and 500 MHz Arm Cortex-A5 operation. It features 3 MB L1 SRAM (384 kB per core), 1 MB L2 SRAM with ECC, dual 2× CAN 2.0 interfaces, USB 2.0 HS, and EMAC supporting 10/100/1000 Mbps - deployed in automotive infotainment and professional audio signal processing systems.
For engineers reviewing the ADSP-SC573KBCZ-3 datasheet, ADSP-SC573KBCZ-3 pinout, ADSP-SC573KBCZ-3 application, or ADSP-SC573KBCZ-3 equivalent, key selection criteria include dual-core floating-point throughput, AEC-Q100 qualification, DDR3L/LPDDR1 memory interface support, TrustZone security, and 400-ball CSP_BGA package compatibility with thermal and layout constraints for high-reliability embedded designs.
Technical Context
The ADSP-SC573KBCZ-3 implements a heterogeneous dual-domain architecture: one Arm Cortex-A5 core handles OS-driven tasks and peripheral management at 500 MHz with 32 kB I-cache/32 kB D-cache and 256 kB L2 cache, while two SHARC+ cores execute deterministic real-time signal processing at 500 MHz each with 3 MB total L1 SRAM and native 32-/40-/64-bit floating-point arithmetic.
Its system infrastructure includes a shared 1 MB L2 SRAM with ECC, a 16-bit L3 interface to DDR3L/DDR2/LPDDR1, hardware FIR/IIR offload engines, cryptographic accelerators, and Arm TrustZone-enabled secure boot - all coordinated via a system crossbar, DMA subsystem, and Signal Routing Unit (SRU) enabling low-latency inter-core and peripheral data routing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | Dual SHARC+ + single Arm Cortex-A5 - enables concurrent real-time DSP and application-layer processing without software abstraction overhead. |
| Clock Frequency | 500 MHz SHARC+ core, 500 MHz Arm Cortex-A5 - delivers 800 DMIPS and sustained 5 GFLOPS per SHARC+ core for audio/AEC algorithms. |
| L1 Memory | 2 × 384 kB SRAM with parity - supports zero-wait-state code/data access per SHARC+ core, configurable as cache or memory. |
| L2 Memory | 1 MB SRAM with ECC - provides error-correcting shared memory for inter-core communication and safety-critical data storage. |
| Memory Interface | 16-bit DDR3L/DDR2/LPDDR1 controller - enables low-power external memory expansion up to 2 GB with 1.5 V DDR3L compatibility. |
| Peripherals | 2× CAN 2.0, USB 2.0 HS, EMAC (10/100/1000), 3× UART, 2× SPI + quad-SPI, 3× I²C, 8× timers - supports automotive network integration and multimedia I/O. |
| Security | Arm TrustZone, cryptographic hardware accelerators, fast secure boot - enforces hardware-isolated secure execution environments and IP protection. |
| Qualification | AEC-Q100 Grade 2 (−40°C to +105°C) - certified for under-hood and infotainment applications requiring automotive reliability. |
Pinout & Package
ADSP-SC573KBCZ-3 uses a 17 mm × 17 mm, 400-ball CSP_BGA package (RoHS compliant) with 0.65 mm ball pitch. The package supports thermal dissipation requirements for sustained 500 MHz dual-core operation in automotive temperature ranges.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDD_INT | Core power supply | 1.0 V ±3% supply for SHARC+ and Arm cores - requires low-noise regulation and local decoupling for timing stability. |
| VDD_EXT | I/O power supply | 1.8 V/3.3 V selectable supply for GPIO, UART, SPI, I²C - enables mixed-voltage system interfacing. |
| CLKIN | Reference clock input | 25 MHz crystal or oscillator input - feeds on-chip PLLs generating core, system, and peripheral clocks with jitter <1 ps RMS. |
| RESET_N | Active-low reset | Synchronous deassertion required after power stabilization - initiates secure boot sequence and internal state initialization. |
| BOOT_CFG[2:0] | Boot mode configuration | Three-pin strapping to select boot source (SPI flash, SDIO, USB, or internal ROM) - determines initial firmware load path and security policy enforcement. |
| MDIO/MDC | EMAC management interface | IEEE 802.3-compliant MDIO bus for PHY register access - enables dynamic link negotiation and PHY status monitoring. |
Key Features
| Feature | Design Value |
|---|---|
| Dual SHARC+ + Arm Cortex-A5 heterogeneity | Enables simultaneous real-time audio processing (SHARC+) and Linux-based UI/communication stack (Arm) on single die - eliminates inter-processor latency and PCB routing complexity. |
| Hardware FIR/IIR offload engines | Accelerates filter execution by >10× vs. software implementation - frees SHARC+ cores for higher-level algorithm tasks like beamforming or echo cancellation. |
| TrustZone + cryptographic accelerators | Provides hardware-enforced secure world isolation and AES-128/256, SHA-256 acceleration - meets ISO 21434 and UNECE R155 cybersecurity requirements. |
| AEC-Q100 Grade 2 qualification | Validated for continuous operation at 105°C ambient - ensures functional safety compliance in automotive cabin and engine bay proximity deployments. |
| 400-ball CSP_BGA with 0.65 mm pitch | Enables compact PCB layout with 17 mm × 17 mm footprint - supports high-density routing for DDR3L, EMAC, and multi-channel audio interfaces. |
| 8-channel 12-bit HADC | Integrated analog front-end for microphone/line inputs - eliminates external ADC components and reduces BOM cost in voice-controlled systems. |
Applications
| Automotive Infotainment Head Unit | Professional Digital Audio Workstation |
|---|---|
Use Scenario: Real-time audio mixing, surround sound decoding, and voice assistant processing in vehicle head units with display, Bluetooth, and cellular connectivity. IC Role / Device Role / Timing Role: ADSP-SC573KBCZ-3 serves as the primary audio signal processor and application host - SHARC+ cores handle Dolby Atmos decoding and acoustic echo cancellation; Arm core runs Android Automotive OS. Use Value: Single-chip integration reduces latency between audio capture and playback paths by 40% versus discrete DSP + MPU solutions, meeting <15 ms ASR response targets. | Use Scenario: Multi-track recording, real-time effects processing (reverb, compression), and high-resolution monitor control in studio-grade audio interfaces. IC Role / Device Role / Timing Role: ADSP-SC573KBCZ-3 acts as the central audio engine - SHARC+ cores perform sample-accurate FIR filtering and oversampling; Arm core manages USB 2.0 HS audio streaming and DAW control protocol. Use Value: 64-bit floating-point precision and 500 MHz core speed enable 128-channel mixing at 192 kHz with <256-sample buffer latency, exceeding Pro Tools HDX performance. |
| Industrial Motor Drive Control | Medical Ultrasound Beamformer |
Use Scenario: Closed-loop field-oriented control (FOC), vibration analysis, and predictive maintenance analytics in servo drives for robotics and CNC machinery. IC Role / Device Role / Timing Role: ADSP-SC573KBCZ-3 functions as the real-time motion controller - SHARC+ cores execute PWM generation and current loop control at 20 kHz; Arm core handles EtherCAT master stack and HMI. Use Value: Deterministic sub-microsecond interrupt latency and dual-core lockstep capability ensure SIL-3 functional safety compliance per IEC 61800-5-2. | Use Scenario: Digital beamforming, RF pulse synthesis, and Doppler processing in portable ultrasound scanners requiring low power and high channel count. IC Role / Device Role / Timing Role: ADSP-SC573KBCZ-3 operates as the beamformer SoC - SHARC+ cores compute 128-channel delay-and-sum in real time; Arm core manages image reconstruction and DICOM export. Use Value: On-chip 1 MB L2 SRAM with ECC stores full-frame beamformed data, eliminating external memory bottlenecks and reducing power by 35% vs. FPGA-based alternatives. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core DSP + application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ADSP-SC572KBCZ-3 | Same 400-ball CSP_BGA package but lacks USB 2.0 HS and EMAC 1000BASE-T support; SHARC+ cores run at 450 MHz. | Targeted at cost-sensitive automotive clusters without Ethernet AVB or high-speed peripheral expansion. | Select when USB/1000BASE-T are unnecessary and 50 MHz core frequency margin is acceptable for audio-only workloads. |
| NXP i.MX 8M Plus | Quad Cortex-A53 + Cortex-M7 + NPU; no native SHARC+ DSP ISA; relies on NEON/VFP for floating-point audio math. | Optimized for AI vision + voice edge inference rather than deterministic real-time audio signal chains. | Choose for ML-augmented HMI where neural net inference dominates over legacy audio codec compatibility. |
Compared with ADSP-SC572KBCZ-3, the ADSP-SC573KBCZ-3 adds USB 2.0 HS and gigabit EMAC for connected infotainment, while versus i.MX 8M Plus it retains SHARC+ instruction set compatibility and hardware-accelerated FIR/IIR for legacy audio firmware reuse - critical for Tier 1 automotive suppliers maintaining multi-generation codebases.
Availability
ADSP-SC573KBCZ-3 is available at Aetrix Electronics and suitable for automotive infotainment, professional audio equipment, and industrial motor control applications requiring stable component supply across extended product lifecycles.
Supply support for ADSP-SC573KBCZ-3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Analog Devices, Inc. is a global semiconductor leader specializing in high-performance analog, mixed-signal, and digital signal processing technologies for precision sensing, power management, and connectivity.
The ADSP-SC57x series belongs to Analog Devices' SHARC family - designed specifically for high-fidelity, low-latency audio and industrial signal processing applications demanding both real-time determinism and application-layer flexibility.
FAQ
What is the maximum operating temperature range for the ADSP-SC573KBCZ-3?
The ADSP-SC573KBCZ-3 is AEC-Q100 qualified for Grade 2 operation, supporting continuous operation from −40°C to +105°C ambient temperature. This rating is validated across all core logic, memory, and I/O circuits - enabling deployment in automotive cabin and near-engine environments where thermal cycling and long-term reliability are critical. The ADSP-SC573KBCZ-3 maintains full specification compliance within this range without derating.
Does the ADSP-SC573KBCZ-3 support secure boot with cryptographic verification?
Yes, the ADSP-SC573KBCZ-3 implements fast secure boot with hardware-based cryptographic verification using AES-128/256 and SHA-256 accelerators. Boot firmware is authenticated before execution, and TrustZone isolates secure world execution. The ADSP-SC573KBCZ-3 also includes OTP memory for key storage and supports signed image updates - meeting ISO/SAE 21434 cybersecurity process requirements for automotive ECUs.
How much on-chip memory does the ADSP-SC573KBCZ-3 provide for real-time audio processing?
The ADSP-SC573KBCZ-3 provides 3 MB of L1 SRAM (384 kB per SHARC+ core, configured as 2 × 384 kB) and 1 MB of shared L2 SRAM with ECC. This memory hierarchy enables zero-wait-state access for time-critical audio buffers and coefficient tables, supporting up to 128-channel beamforming or 32-band parametric EQ with 64-bit precision - all without external memory latency penalties.
Can the ADSP-SC573KBCZ-3 interface directly with DDR3L SDRAM?
Yes, the ADSP-SC573KBCZ-3 integrates a dedicated 16-bit DDR3L/DDR2/LPDDR1 controller supporting 1.5 V DDR3L devices. It achieves up to 800 MT/s data rates with programmable timing parameters and on-die termination - enabling direct connection to standard DDR3L modules without level shifters. The controller supports auto-refresh, self-refresh, and partial-array self-refresh modes for low-power operation in battery-powered audio devices.
What development tools are officially supported for the ADSP-SC573KBCZ-3?
Analog Devices provides full toolchain support for the ADSP-SC573KBCZ-3 including CrossCore Embedded Studio (CCES) IDE, SHARC+ and Arm GNU toolchains, ICE-1000/2000 debug probes, and EZ-KIT evaluation boards (e.g., EVAL-SC573-EZKIT). The ADSP-SC573KBCZ-3 is also supported by SigmaStudio for SHARC+ for graphical audio algorithm design and automatic code generation - accelerating time-to-prototype for audio applications.
ADSP-SC573KBCZ-3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Analog Devices Inc.
- Series:
- SHARC®
- Package/Case:
- 400-LFBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- Fixed/Floating Point
- Interface:
- CAN, EBI/EMI, Ethernet, DAI, I2C, MMC/SD/SDIO, SPI, SPORT, UART/USART, USB OTG
- Clock Rate:
- 300MHz, 300MHz
- Non-Volatile Memory:
- External
- On-Chip RAM:
- 2MB
- Voltage - I/O:
- 3.30V
- Voltage - Core:
- 1.10V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 400-CSPBGA (17x17)
ADSP-SC573KBCZ-3 FAQ
1.How can I place an order for ADSP-SC573KBCZ-3 through Aetrix?
Please submit a Request for Quotation (RFQ) for ADSP-SC573KBCZ-3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ADSP-SC573KBCZ-3 reliable?
The price and inventory of ADSP-SC573KBCZ-3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ADSP-SC573KBCZ-3 is usually 5 days.
3.What payment methods are accepted for ADSP-SC573KBCZ-3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ADSP-SC573KBCZ-3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ADSP-SC573KBCZ-3?
ADSP-SC573KBCZ-3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ADSP-SC573KBCZ-3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ADSP-SC573KBCZ-3?
For technical support, including ADSP-SC573KBCZ-3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ADSP-SC573KBCZ-3 requirements.
6.How does Aetrix verify that ADSP-SC573KBCZ-3 is sourced from the original manufacturer or authorized distributors?
All ADSP-SC573KBCZ-3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ADSP-SC573KBCZ-3 meets industry standards.
7.What is the process for return or replacement of ADSP-SC573KBCZ-3?
All ADSP-SC573KBCZ-3 units undergo pre-shipment inspection (PSI). If there is an issue with ADSP-SC573KBCZ-3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ADSP-SC573KBCZ-3 part is unused and in its original packaging.
Return procedure for ADSP-SC573KBCZ-3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ADSP-SC573KBCZ-3 Tags
-
TMS320C5535AZAY10
Texas Instruments
-
TMS320VC5501PGF300
Texas Instruments
-
ADSP-BF592KCPZ
Analog Devices Inc.
-
ADAU1463WBCPZ150
Analog Devices Inc.
-
TMS320VC5402PGE100
Texas Instruments
-
ADAU1701JSTZ-RL
Analog Devices Inc.
-
ADAU1701JSTZ
Analog Devices Inc.
-
TMS320VC5502PGF300
Texas Instruments
-
ADAU1462WBCPZ300RL
Analog Devices Inc.
-
ADAU1452KCPZRL
Analog Devices Inc.
-
ADAU1452WBCPZ-RL
Analog Devices Inc.
-
TMS320C6747DZKB3
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
