Analog Devices Inc. ADTF3175BMLZ

Overview

ADTF3175BMLZ from Analog Devices is a fully calibrated 1 MP (1024 × 1024) indirect Time-of-Flight (iToF) depth sensing module with integrated 940 nm illumination, 75° × 75° FoV lens subassembly, and MIPI CSI-2 (4-lane, 1.5 Gbps/lane) output interface. It delivers depth accuracy of ±5 mm across 0.4–4 m range and supports calibrated 512 × 512 mode for lower bandwidth applications in robotics and AR systems.

For engineers reviewing the ADTF3175BMLZ datasheet, ADTF3175BMLZ pinout, ADTF3175BMLZ application, or ADTF3175BMLZ equivalent, key selection considerations include its integrated illumination safety compliance, on-module NVM boot sequence, dual serial control (SPI/I²C), and fixed ML-50-1 mechanical form factor requiring host ISP processing of raw depth data.

Technical Context

The ADTF3175BMLZ implements an indirect ToF architecture based on the ADSD3100 imager, using modulated 940 nm illumination and phase-shift measurement to compute per-pixel depth. Its optical path integrates a band-pass filter and collimating optics to suppress ambient light up to 3 klux.

Depth data is streamed via MIPI CSI-2 at up to 6 Gbps aggregate bandwidth (4 lanes × 1.5 Gbps), while configuration and calibration metadata are accessed via dedicated 4-wire SPI and 2-wire I²C interfaces. All power regulation for imager and illumination subsystems is performed on-module.

Key Specifications

Pinout & Package

ADTF3175BMLZ is housed in a 50-lead MODULE package designated ML-50-1, measuring 42 mm × 31 mm × 15.1 mm. The module uses a rigid-flex interconnect with surface-mount land pattern optimized for thermal and EMI performance in embedded vision systems.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar time-of-flight depth sensing applications.

Compared with ST VL53L5CX and Infineon IRS2877A, the ADTF3175BMLZ provides higher resolution, wider FoV, and full factory calibration - making it optimal for machine vision and robotics where scene fidelity and out-of-box accuracy outweigh size or power constraints.

Availability

ADTF3175BMLZ is available at Aetrix Electronics and suitable for robotics, augmented reality systems, and smart building automation requiring stable component supply and long-term design-in support.

Supply support for ADTF3175BMLZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Analog Devices, Inc. is a global semiconductor company specializing in high-performance analog, mixed-signal, and digital signal processing technologies for precision sensing and connectivity.

The ADTF3175BMLZ belongs to Analog Devices' Time-of-Flight product line, engineered for turnkey 3D depth perception in industrial and consumer vision systems where integration, calibration, and optical performance are critical.

FAQ

What is the operating temperature range for the ADTF3175BMLZ?

The ADTF3175BMLZ is specified to operate from −20°C to +65°C. This range supports deployment in uncontrolled indoor environments such as warehouses, retail spaces, and office buildings. The module's internal thermal design and factory calibration compensate for drift across this span, ensuring consistent depth accuracy without user recalibration. All performance specifications - including depth noise and accuracy - are guaranteed within this envelope.

Does the ADTF3175BMLZ include a built-in laser driver and safety features?

Yes, the ADTF3175BMLZ integrates a 940 nm VCSEL illumination subassembly with laser diode driver and photodetector feedback loop. It complies with IEC 60825-1 Class 1 eye safety requirements under all operating conditions. No external safety circuitry or optical filters are needed - the safety functionality is implemented at the module level and verified during production test.

What interfaces does the ADTF3175BMLZ use for depth data and configuration?

The ADTF3175BMLZ uses a 4-lane MIPI CSI-2 interface (1.5 Gbps per lane) for high-speed depth image streaming and separate 4-wire SPI and 2-wire I²C interfaces for configuration, calibration access, and firmware updates. SPI handles boot sequence and NVM operations, while I²C supports runtime parameter adjustments - both are electrically isolated from the high-speed data path to prevent interference.

Is the ADTF3175BMLZ calibrated out-of-the-box?

Yes, the ADTF3175BMLZ ships with full factory calibration for both 1024 × 1024 and 512 × 512 modes, including per-pixel gain/offset, lens distortion correction, and temperature compensation tables stored in on-module Flash. No user-performed calibration is required for standard operation, though optional host-side refinement is supported via exported calibration metadata.

What is the depth noise specification of the ADTF3175BMLZ and under what conditions?

The ADTF3175BMLZ specifies depth noise ≤15 mm (1σ) at 19% target reflectance and ≤3 klux ambient illumination. This value is measured at mid-range (2 m) under controlled lab conditions using the default 1024 × 1024 calibrated mode. Noise increases slightly at near (<0.6 m) and far (>3.5 m) extremes but remains within system-level usability thresholds for robotics and AR applications.