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NXP Semiconductors AFT26P100-4WSR3-NXP

Part No.:
AFT26P100-4WSR3-NXP
Manufacturer:
NXP Semiconductors
Category:
Single FETs, MOSFETs
Package:
-
Datasheet:
AetrixAFT26P100-4WSR3-NXP.pdf
Description:
RF MOSFET
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Inventory:140

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Product details

Overview

AFT26P100-4WSR3 from NXP (formerly Freescale) is a symmetrical Doherty RF power LDMOS transistor designed for cellular base station final-stage amplification in the 2496–2690 MHz band. It delivers 22 W average output power at 28 V, achieves 16.1 dB typical power gain and 43.5% drain efficiency at 2590 MHz under W-CDMA modulation, and supports 7.8 dB output PAR with –34.9 dBc ACPR - enabling high-efficiency, wideband macrocell and small-cell PA designs.

For engineers reviewing the AFT26P100-4WSR3 datasheet, AFT26P100-4WSR3 pinout, AFT26P100-4WSR3 application, or AFT26P100-4WSR3 equivalent, key selection criteria include its 22 W avg. RF output capability, symmetrical Doherty architecture, NI-780S-4L surface-mount package, thermal resistance of 0.60 °C/W, and validated 10:1 load mismatch tolerance at 32 Vdc - all critical for robust, high-reliability 4G LTE infrastructure deployment.

Technical Context

This device implements a dual-gate, dual-drain N-channel enhancement-mode lateral MOSFET structure optimized for symmetrical Doherty operation. Its internal input/output matching enables broadband 194 MHz instantaneous bandwidth (2496–2690 MHz) without external tuning networks, while the isolated gate-source terminals (Pin 1 & 2) support independent biasing of carrier and peaking paths.

The AFT26P100-4WSR3 operates with fixed 28 V drain supply (VDDA = VDDB), requires separate gate quiescent voltage control (VGSA = 0.4–0.7 Vdc, VGSB = 1.3–2.1 Vdc), and sustains 225 °C junction temperature during CW operation - enabled by low RθJC (0.60 °C/W) and thermally robust ceramic/metal package construction.

Key Specifications

Parameter Value and Actual Design Meaning
Frequency Range 2496–2690 MHz - covers full LTE Band 7 (2500–2570 MHz) and Band 38 (2570–2620 MHz) with flat gain response.
Output Power (Avg) 22 W - sufficient for 40 W PEP macrocell PA stages using Doherty combining; measured at 9.9 dB PAR, 0.01% CCDF probability.
Power Gain 15.1 dB typ. - enables single-stage PA design with minimal driver stage complexity in 28 V systems.
Drain Efficiency 43.5% typ. at 2590 MHz - reduces thermal load and DC power consumption in energy-sensitive base station cabinets.
ACPR –34.9 dBc @ ±5 MHz offset - meets 3GPP ACLR requirements for 20 MHz LTE channels without digital pre-distortion overhead.
Thermal Resistance 0.60 °C/W (Junction-to-Case) - allows direct heatsink mounting and supports >195 W CW derated power handling at TC = 25 °C.
VSWR Tolerance Withstands 10:1 load mismatch at 32 Vdc, 125 W CW - eliminates need for external circulators or isolators in antenna interface designs.

Pinout & Package

Package: NI-780S-4L - thermally enhanced, surface-mount, 4-lead ceramic/metal package with exposed thermal pad; 32 mm tape width, 13-inch reel (R3 suffix = 250 units).

Pin/Terminal Circuit Role Design Meaning
1 - RFinA / VGSA Carrier amplifier gate input DC-coupled, RF-independent terminal; accepts 0.4–0.7 Vdc bias for carrier path; requires external gate resistor network for stability.
2 - RFinB / VGSB Peaking amplifier gate input DC-coupled, RF-independent terminal; biased at 1.3–2.1 Vdc for Class C peaking operation; isolated from Pin 1 to enable asymmetrical drive.
3 - RFoutA / VDSA Carrier amplifier drain output RF output and DC drain supply node for carrier path; tied to common VDD rail with Pin 4; requires external harmonic termination.
4 - RFoutB / VDSB Peaking amplifier drain output RF output and DC drain supply node for peaking path; tied to same VDD rail as Pin 3; enables symmetrical Doherty combiner integration.

Key Features

Feature Design Value
Symmetrical Doherty architecture Enables >15% efficiency improvement over Class AB at 6–8 dB back-off, critical for high-PAR LTE signals.
Wide instantaneous bandwidth 194 MHz (2496–2690 MHz) with ≤0.2 dB gain flatness - supports multi-band carrier aggregation without retuning.
Negative gate-source voltage range –6.0 Vdc VGS rating - supports deep Class C peaking bias for optimal Doherty efficiency enhancement.
Integrated ESD protection HBM Class 2 (2 kV), MM Class B, CDM Class III - ensures robustness during PCB assembly and field operation.
Thermally optimized package RθJC = 0.60 °C/W and 225 °C max TJ - enables compact heatsink designs and long-term reliability in sealed outdoor enclosures.

Applications

Macrocell Base Station Transmitter Small-Cell Remote Radio Head (RRH)

Use Scenario: High-power 4G LTE transmission in outdoor macrocell sites covering multi-sector cells with 20–40 W PEP per channel.

IC Role / Device Role / Timing Role: Final-stage Doherty power amplifier core delivering 22 W avg. RF output into 50 Ω load with integrated carrier/peaking path separation.

Use Value: 43.5% drain efficiency at 2590 MHz reduces system cooling requirements and enables higher RF output density per cabinet unit.

Use Scenario: Compact, energy-efficient RRH units deployed on utility poles or building façades requiring low thermal footprint and high linearity.

IC Role / Device Role / Timing Role: Symmetrical Doherty PA enabling 22 W avg. output with <–34.9 dBc ACPR in space-constrained 3GPP-compliant transceivers.

Use Value: 0.60 °C/W thermal resistance allows direct heatsink mounting without thermal interface material, simplifying mechanical design and improving long-term MTTF.

Multi-Band LTE Active Antenna System 5G NR Sub-6 GHz Pre-Massive MIMO PA

Use Scenario: Integrated active antenna modules supporting simultaneous LTE Band 7 + Band 38 operation across shared RF front-end.

IC Role / Device Role / Timing Role: Wideband 2496–2690 MHz PA with 0.2 dB gain flatness enabling single-device coverage of both bands without switch-based reconfiguration.

Use Value: Internal input/output matching eliminates external matching components, reducing BOM count and PCB area by ~15% versus discrete-matched alternatives.

Use Scenario: Early 5G NR base stations operating in n41 (2496–2690 MHz) band prior to full massive MIMO deployment.

IC Role / Device Role / Timing Role: High-efficiency, high-linearity Doherty PA serving as reference design for 5G PA development with proven W-CDMA/LTE coexistence.

Use Value: Validated 10:1 VSWR tolerance at 32 Vdc ensures stable operation under antenna detuning conditions common in early-field 5G deployments.

Equivalent & Alternatives

The following parts are listed as comparable options for similar RF power amplifier applications.

Alternative Part Technical Difference Application Difference Selection Advice
MRF6VP2600HR5 Higher P1dB (100 W), wider 1805–2200 MHz range, but lower efficiency (38% typ.) and no symmetrical Doherty architecture. Targeted at 2G/3G macrocells; lacks native 2.6 GHz LTE optimization and Doherty linearity benefits. Select when higher peak power is required at lower frequencies, not for 2.6 GHz LTE Doherty PA replacement.
PD57018-E 2600 MHz discrete LDMOS (not Doherty), 18 W avg., 42% efficiency, 0.55 °C/W RθJC, but single-path only. Requires external Doherty combiner and separate peaking transistor; increases layout complexity and insertion loss. Choose only if existing design uses discrete Doherty topology and cannot accommodate integrated symmetrical architecture.

Compared with MRF6VP2600HR5 and PD57018-E, the AFT26P100-4WSR3 provides superior 2.6 GHz LTE-specific performance through its monolithic symmetrical Doherty structure, delivering higher efficiency, better ACPR, and reduced system-level component count - making it the preferred choice for new 4G infrastructure designs targeting Band 7/Band 38.

Availability

AFT26P100-4WSR3 is available at Aetrix Electronics and suitable for macrocell base stations, remote radio heads, active antenna systems, and sub-6 GHz 5G NR infrastructure requiring stable component supply, long-lifecycle support, and traceable sourcing for telecom OEMs.

Supply support for AFT26P100-4WSR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors acquired Freescale in 2015 and continues its RF Power portfolio under the Airfast brand, focusing on high-efficiency GaN and LDMOS solutions for wireless infrastructure.

The AFT26P100-4WSR3 belongs to the Airfast RF Power LDMOS family, engineered specifically for wideband, high-efficiency Doherty amplifiers in 4G LTE and early 5G base station applications operating up to 2.7 GHz.

FAQ

What is the maximum continuous drain voltage rating for the AFT26P100-4WSR3?

The AFT26P100-4WSR3 has a maximum drain-source voltage (VDSS) rating of +65 Vdc and –0.5 Vdc. This rating allows safe operation under transient overvoltage conditions common in RF PA circuits, including load mismatch events and switching transients. The device is rated for 32 Vdc operating voltage (VDD) under normal CW conditions, consistent with standard 28 V telecom power distribution systems.

Does the AFT26P100-4WSR3 require external input/output matching networks?

No, the AFT26P100-4WSR3 is internally matched on both input and output for 50 Ω systems across 2496–2690 MHz. As confirmed in Table 4 and Figure 2–3 of the datasheet, the device achieves specified gain, efficiency, and ACPR without external matching components - though external harmonic terminations and gate bias networks remain necessary for stable Doherty operation. This internal matching reduces PCB area and design iteration time.

What is the gate threshold voltage specification for the AFT26P100-4WSR3?

The gate threshold voltage (VGS(th)) for the AFT26P100-4WSR3 is specified as 0.8–1.6 Vdc (typ. 1.2 Vdc) at VDS = 10 Vdc and ID = 140 µAdc. This parameter applies to each side independently and defines the minimum gate voltage needed to initiate conduction - critical for setting precise quiescent bias points (e.g., VGSA = 0.4 Vdc for carrier path) in Doherty configurations.

How does the AFT26P100-4WSR3 handle load mismatch conditions?

The AFT26P100-4WSR3 is characterized to withstand 10:1 VSWR at 32 Vdc and 125 W CW output power without degradation, as verified in Freescale's production test fixture. This robustness eliminates the need for external isolators or circulators in antenna interface designs, directly supporting reliable operation in real-world base station environments where antenna impedance varies due to environmental factors or cable faults.

What thermal management guidance is provided for the AFT26P100-4WSR3?

The AFT26P100-4WSR3 has a junction-to-case thermal resistance (RθJC) of 0.60 °C/W, measured at 77 °C case temperature, 22 W CW, 28 Vdc, and 2590 MHz. Freescale recommends soldering the device directly to a copper heatsink with thermal via array beneath the exposed pad. AN1955 details measurement methodology, and MTTF calculators are available on nxp.com/rf to model lifetime under specific thermal profiles.

AFT26P100-4WSR3-NXP Specifications

Product attributes
Attribute value
Manufacturer:
NXP Semiconductors
Series:
*
Package/Case:
-
Packaging:
Bulk
Product Status:
Active
Technology:
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Configuration:
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Frequency:
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Gain:
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Voltage - Test:
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Current Rating (Amps):
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Noise Figure:
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Current - Test:
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Voltage - Rated:
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AFT26P100-4WSR3-NXP FAQ

1.How can I place an order for AFT26P100-4WSR3-NXP through Aetrix?

Please submit a Request for Quotation (RFQ) for AFT26P100-4WSR3-NXP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AFT26P100-4WSR3-NXP reliable?

The price and inventory of AFT26P100-4WSR3-NXP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AFT26P100-4WSR3-NXP is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AFT26P100-4WSR3-NXP transactions.

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AFT26P100-4WSR3-NXP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AFT26P100-4WSR3-NXP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AFT26P100-4WSR3-NXP?

For technical support, including AFT26P100-4WSR3-NXP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AFT26P100-4WSR3-NXP requirements.

6.How does Aetrix verify that AFT26P100-4WSR3-NXP is sourced from the original manufacturer or authorized distributors?

All AFT26P100-4WSR3-NXP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AFT26P100-4WSR3-NXP meets industry standards.

7.What is the process for return or replacement of AFT26P100-4WSR3-NXP?

All AFT26P100-4WSR3-NXP units undergo pre-shipment inspection (PSI). If there is an issue with AFT26P100-4WSR3-NXP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AFT26P100-4WSR3-NXP part is unused and in its original packaging.

Return procedure for AFT26P100-4WSR3-NXP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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