NXP Semiconductors AFV09P350-04NR3
- Part No.:
- AFV09P350-04NR3
- Manufacturer:
- NXP Semiconductors
- Category:
- Single FETs, MOSFETs
- Package:
- OM-780-4L
- Datasheet:
-
AFV09P350-04NR3.pdf
- Description:
- RF MOSFET LDMOS 48V OM780-4
- Quantity:
- Payment:

- Shipping:

Inventory:6,866
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Product details
Overview
AFV09P350-04NR3 from NXP Semiconductors (formerly Freescale) is a symmetrical Doherty RF power LDMOS transistor designed for cellular base station amplifiers operating from 720 to 960 MHz. It delivers 100 W average output power at 48 Vdc, achieves 19.5 dB power gain and 48.5% drain efficiency at 920 MHz under W-CDMA single-carrier conditions, and supports digital predistortion for linearization in macrocell infrastructure.
For engineers reviewing the AFV09P350-04NR3 datasheet, AFV09P350-04NR3 pinout, AFV09P350-04NR3 application, or AFV09P350-04NR3 equivalent, this page provides verified electrical specifications, thermal resistance (0.45 °C/W), symmetrical Doherty configuration validation, gate-source voltage range (–6.0 to +10 Vdc), and real-world W-CDMA performance metrics including ACPR (–29.2 dBc) and PAR (7.2 dB) at 920 MHz.
Technical Context
This dual-gate LDMOS device integrates carrier and peaking transistors in a single 4-lead plastic package (OM-780-4L), with exposed backside serving as common source terminal. Its symmetrical Doherty architecture enables high efficiency across 720–960 MHz while maintaining linearity under 9.9 dB PAR input signals.
The device is production-tested in functional Doherty fixtures using 50 Ω systems, with internal input matching and validated load-pull contours for both P1dB and P3dB tuning. Key design enablers include extended negative VGS range (–6.0 Vdc) for Class C peaking operation and ESD robustness per JESD22-A114 Class 1C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 720–960 MHz - Covers LTE Band 12/13/17/18/19/20/26/28 and legacy GSM/UMTS bands. |
| Avg. Output Power | 100 W - Sustained W-CDMA average power at 48 Vdc, IDQA = 860 mA, enabling macrocell coverage. |
| Power Gain | 19.5 dB typ. @ 920 MHz - Enables reduced driver stage complexity and higher system gain margin. |
| Drain Efficiency | 48.5% typ. @ 920 MHz - Reduces thermal load and power supply requirements in densely packed PA modules. |
| ACPR | –29.2 dBc @ ±5 MHz offset - Meets 3GPP ACLR requirements for 5 MHz channel bandwidth without excessive filtering. |
| Thermal Resistance | 0.45 °C/W - Junction-to-case value measured at 102 W W-CDMA, supporting compact heatsink designs. |
| VGS Range | –6.0 to +10 Vdc - Enables deep Class C biasing of peaking transistor for optimal Doherty efficiency enhancement. |
Pinout & Package
AFV09P350-04NR3 uses the OM-780-4L plastic overmolded package with exposed copper backside (common source terminal). Dimensions conform to standard RF power transistor footprints for surface-mount assembly and thermal interface to heatsinks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: RFoutA / VDSA | Carrier transistor drain | High-power RF output node for carrier amplifier path; requires impedance-matched output network. |
| 2: RFoutB / VDSB | Peaking transistor drain | High-power RF output node for peaking amplifier path; phase-aligned with Pin 1 for Doherty combiner. |
| 3: RFinA / VGSA | Carrier transistor gate | DC-biased RF input for carrier transistor; internally matched to 50 Ω for simplified layout. |
| 4: RFinB / VGSB | Peaking transistor gate | DC-biased RF input for peaking transistor; biased at 0.9 Vdc for Class C operation in Doherty mode. |
Key Features
| Feature | Design Value |
|---|---|
| Symmetrical Doherty integration | Single-package carrier+peaking topology eliminates inter-device phase/timing mismatch and reduces PCB area by >30% vs discrete solutions. |
| Negative VGS capability | –6.0 Vdc rating enables stable deep Class C peaking bias, critical for >45% efficiency at backed-off power levels. |
| Digital predistortion readiness | Validated AM/PM distortion of –21° max across 920–960 MHz supports standard DPD algorithm convergence without custom modeling. |
| Tape-and-reel packaging | R3 suffix denotes 250-unit reel on 32 mm tape, compatible with high-speed pick-and-place for automated RF PA module assembly. |
| ESD robustness | JESD22-A114 Class 1C (2 kV HBM) ensures reliability during handling and board-level reflow without additional protection circuitry. |
Applications
| Macrocell Base Station Transmitter | Multi-Band LTE Remote Radio Head |
|---|---|
Use Scenario: High-power final-stage amplifier in 4T4R MIMO macrocell BTS covering Bands 12/13/17/20/26/28. IC Role / Device Role / Timing Role: Dual-path Doherty RF power transistor delivering 100 W avg. output per channel with integrated carrier and peaking devices. Use Value: Achieves 48.5% drain efficiency at 100 W avg., reducing cooling requirements and AC power draw versus prior-generation LDMOS. |
Use Scenario: Compact, thermally efficient PA module in outdoor RRH units requiring wideband 720–960 MHz support. IC Role / Device Role / Timing Role: Single-package symmetrical Doherty transistor enabling space-constrained 2-layer PCB layouts with minimal external matching. Use Value: 0.45 °C/W RθJC allows direct mounting to aluminum housing, eliminating need for thermal vias or thick copper layers. |
| W-CDMA/HSPA+ Infrastructure Amplifier | Digital Predistortion Linearization Platform |
Use Scenario: Final amplifier stage in legacy UMTS Node B deployments requiring backward compatibility and high reliability. IC Role / Device Role / Timing Role: RF power transistor optimized for 3.84 MHz W-CDMA signal with 9.9 dB PAR and CCDF-based compression metrics. Use Value: Delivers –29.2 dBc ACPR at 100 W avg., meeting 3GPP TS 25.104 ACLR mask without post-filtering overhead. |
Use Scenario: Reference Doherty device in lab-grade DPD development platforms for algorithm validation and model extraction. IC Role / Device Role / Timing Role: Production-tested symmetrical Doherty transistor with published load-pull contours and AM/PM data for behavioral model training. Use Value: Published P1dB/P3dB load-pull data at 920/940/960 MHz enables accurate X-parameter model generation for Keysight ADS and MATLAB DPD toolchains. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AFV09P350-04GNR3 | Same die, green-qualified (halogen-free) molding compound; identical electrical specs and pinout. | Required for RoHS-compliant or environmentally restricted deployments where halogen content must be minimized. | Select AFV09P350-04GNR3 when compliance with IEC 61249-2-21 or JEDEC JS709C is mandated. |
| MRF6VP21K25HR5 | 1200–2700 MHz range, 250 W P3dB, higher VDD (65 V), no integrated Doherty architecture - discrete carrier+peaking required. | Targets TDD-LTE and small cell applications above 1.2 GHz; not suitable for 700–900 MHz macrocell use. | Choose only if frequency band or peak power requirement exceeds AFV09P350-04NR3 capabilities; expect added design complexity. |
Compared with AFV09P350-04GNR3, the AFV09P350-04NR3 offers identical RF performance but lacks halogen-free certification; compared with MRF6VP21K25HR5, it provides optimized 720–960 MHz efficiency and integrated Doherty functionality at lower voltage and cost, making it superior for macrocell infrastructure where band and architecture alignment are critical.
Availability
AFV09P350-04NR3 is available at Aetrix Electronics and suitable for macrocell base stations, remote radio heads, and W-CDMA infrastructure equipment requiring stable component supply, long-lifecycle support, and traceable sourcing for telecom OEMs.
Supply support for AFV09P350-04NR3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors acquired Freescale in 2015 and continues its RF Power portfolio, specializing in high-efficiency LDMOS and GaN transistors for wireless infrastructure.
The AFV09P350-04NR3 belongs to the Airfast family, engineered specifically for energy-efficient, digitally linearized Doherty amplifiers in 4G/LTE macrocell base stations operating below 1 GHz.
FAQ
What is the maximum continuous drain current rating for AFV09P350-04NR3?
The AFV09P350-04NR3 does not specify a maximum continuous drain current (ID) rating in its datasheet. Instead, it defines safe operating limits via VDSS (–0.5 to +105 Vdc), VGS (–6.0 to +10 Vdc), and case temperature (–40 to +150 °C). Operational current is determined by bias point: typical quiescent drain current is 860 mA per side (IDQA/IDQB) at 48 Vdc, with pulsed testing up to 301 W P1dB output.
Does AFV09P350-04NR3 require external input matching networks?
No, the AFV09P350-04NR3 is internally input-matched for 50 Ω systems across 720–960 MHz, as confirmed in Table 5 notes and Figure 2 test circuit documentation. External matching is only needed at the output (drain) side to achieve optimal P1dB, P3dB, or efficiency per load-pull data in Tables 7–10.
What is the gate threshold voltage range for AFV09P350-04NR3?
The gate threshold voltage (VGS(th)) for AFV09P350-04NR3 is specified as 1.3–2.3 Vdc (min–max) at VDS = 10 Vdc and ID = 460 µAdc, per Table 5. This range ensures consistent turn-on behavior across process variation and supports stable Class AB carrier biasing.
Can AFV09P350-04NR3 operate at 65 V drain supply voltage?
No. The absolute maximum VDD rating is +55 Vdc (Table 1). Operation at 65 Vdc exceeds specification and risks catastrophic failure. The device is characterized and optimized for 48 Vdc operation, with all published performance data (gain, efficiency, ACPR) referenced to that condition.
Is AFV09P350-04NR3 pin-compatible with AFV09P350-04GNR3?
Yes. AFV09P350-04NR3 and AFV09P350-04GNR3 share identical pinout, package (OM-780-4L), electrical characteristics, and thermal performance. The only difference is the halogen-free molding compound in the GNR3 variant, making them mechanically and electrically interchangeable in existing designs.
AFV09P350-04NR3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Package/Case:
- OM-780-4L
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- LDMOS
- Configuration:
- Dual
- Frequency:
- 920MHz
- Gain:
- 19.5dB
- Voltage - Test:
- 48 V
- Current Rating (Amps):
- -
- Noise Figure:
- -
- Current - Test:
- 860 mA
- Power - Output:
- 100W
- Voltage - Rated:
- 105 V
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- OM-780-4L
AFV09P350-04NR3 FAQ
1.How can I place an order for AFV09P350-04NR3 through Aetrix?
Please submit a Request for Quotation (RFQ) for AFV09P350-04NR3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AFV09P350-04NR3 reliable?
The price and inventory of AFV09P350-04NR3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AFV09P350-04NR3 is usually 5 days.
3.What payment methods are accepted for AFV09P350-04NR3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AFV09P350-04NR3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AFV09P350-04NR3?
AFV09P350-04NR3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AFV09P350-04NR3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AFV09P350-04NR3?
For technical support, including AFV09P350-04NR3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AFV09P350-04NR3 requirements.
6.How does Aetrix verify that AFV09P350-04NR3 is sourced from the original manufacturer or authorized distributors?
All AFV09P350-04NR3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AFV09P350-04NR3 meets industry standards.
7.What is the process for return or replacement of AFV09P350-04NR3?
All AFV09P350-04NR3 units undergo pre-shipment inspection (PSI). If there is an issue with AFV09P350-04NR3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AFV09P350-04NR3 part is unused and in its original packaging.
Return procedure for AFV09P350-04NR3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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