NXP Semiconductors AFV10700H-1090
- Part No.:
- AFV10700H-1090
- Manufacturer:
- NXP Semiconductors
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
AFV10700H-1090.pdf
- Description:
- AFV10700H REF BOARD 1090MHZ 700W
- Quantity:
- Payment:

- Shipping:

Inventory:2,179
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Product details
Overview
AFV10700H from NXP Semiconductors is a 960–1215 MHz RF power LDMOS transistor designed for high-peak-pulse radar applications, delivering 700 W peak output at 1090 MHz with 19.0 dB power gain and 56.1% drain efficiency under 50 V, 128 µs pulse width, 10% duty cycle conditions. It operates as a dual-gate, dual-drain N-channel enhancement-mode lateral MOSFET in pulsed Class C amplifier stages for IFF and secondary surveillance radar transmitters.
For engineers reviewing the AFV10700H datasheet, AFV10700H pinout, AFV10700H application, or AFV10700H equivalent, this device requires attention to gate quiescent voltage (1.6–2.6 V), ruggedness under >20:1 VSWR mismatch, thermal impedance (0.030 °C/W), maximum junction temperature (225 °C), and NI-780H-4L package mounting requirements.
Technical Context
The AFV10700H integrates two matched LDMOS cells in a single NI-780H-4L air-cavity package, supporting single-ended, push-pull, or quadrature configurations. Its internally matched broadband input and output networks simplify integration into 960–1215 MHz pulse amplifiers without external matching components across the band.
It features ESD protection rated to HBM Class 2 (2000 V) and CDM Class C3 (2000 V), a gate-source voltage range of –6.0 to +10 V, and operation up to 55 VDD. The device maintains stable performance over case temperatures from –55 °C to +150 °C and junction temperatures up to +225 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Frequency Range | 960–1215 MHz - supports full-band operation in military and civil aviation radar systems including ADS-B, DME, and IFF. |
| Peak Output Power | 700 W at 1090 MHz - enables high-dynamic-range pulse transmission in secondary surveillance radar transponders. |
| Power Gain | 19.0 dB at 1090 MHz - provides sufficient small-signal drive margin for cascaded amplifier stages without intermediate gain blocks. |
| Drain Efficiency | 56.1% at 1090 MHz - reduces thermal load and DC power supply sizing in high-duty-cycle pulse applications. |
| Thermal Impedance | 0.030 °C/W (junction-to-case) - mandates high-performance heatsinking but enables compact thermal design with forced-air or liquid cooling. |
| VSWR Ruggedness | >20:1 at all phase angles - ensures reliable operation under severe load mismatches common in antenna switching and multiplexer-based radar front-ends. |
| Gate Threshold Voltage | 1.3–2.3 V - allows precise Class C bias control using low-voltage gate drivers such as MRFE6VS25N. |
| Maximum Junction Temperature | +225 °C - supports sustained high-power pulse operation in thermally constrained airborne and ground-based radar enclosures. |
Pinout & Package
The AFV10700H is housed in an NI-780H-4L air-cavity ceramic/metal flanged package with electrically isolated source (backside), requiring hard-solder attachment to a copper baseplate for optimal thermal and RF grounding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1: Gate A | Control electrode for first LDMOS cell | Accepts negative/positive gate bias; must be decoupled with low-inductance capacitors per reference circuit layout. |
| 2: Gate B | Control electrode for second LDMOS cell | Enables balanced push-pull or quadrature drive; differential gate drive improves harmonic suppression. |
| 3: Drain A | RF power output terminal for first cell | High-current RF node; connects directly to output matching network; backside source serves as common RF return path. |
| 4: Drain B | RF power output terminal for second cell | Paired with Drain A for parallel or push-pull combiner topologies; shares thermal path via source backside. |
Key Features
| Feature | Design Value |
|---|---|
| Internally input/output matched | Eliminates discrete matching networks in 960–1215 MHz band, reducing PCB area and tuning complexity in radar PA modules. |
| Configurable topology support | Validated for single-ended, push-pull, and quadrature operation - enables flexible system-level architecture trade-offs in transponder designs. |
| 55 VDD absolute maximum rating | Provides 5 V headroom above nominal 50 V operation - accommodates transient overvoltage events in switched-mode radar power supplies. |
| Integrated ESD protection | HBM Class 2 / CDM Class C3 compliance - protects against handling damage during assembly and field maintenance without external TVS diodes. |
| NXP product longevity program | Guaranteed 15-year supply continuity - critical for defense platform sustainment and long-lifecycle avionics programs. |
Applications
| Secondary Surveillance Radar (SSR) | Identification Friend or Foe (IFF) |
|---|---|
|
Use Scenario: Pulse-amplified reply transmission in Mode S and Mode 5 interrogator systems operating at 1030/1090 MHz. IC Role / Device Role / Timing Role: Final-stage RF power amplifier delivering 700 W peak pulses with 128 µs width and 10% duty cycle. Use Value: High drain efficiency (56.1%) minimizes heat generation in compact airborne SSR transponders where thermal dissipation is constrained. |
Use Scenario: High-reliability encrypted challenge-response transmission in military IFF transponders compliant with STANAG 4193. IC Role / Device Role / Timing Role: Dual-cell LDMOS PA operating in push-pull configuration to suppress even-order harmonics and improve spectral purity. Use Value: >20:1 VSWR ruggedness ensures uninterrupted operation during rapid antenna switching between multiple IFF channels. |
| ADS-B Transponder (1090ES) | DME Ground Station Transmitter |
|
Use Scenario: Outbound extended squitter transmissions at 1090 MHz with 128 µs pulse duration and variable duty cycle. IC Role / Device Role / Timing Role: High-efficiency RF power stage driven by MRFE6VS25N pre-driver, biased at IDQ(A+B) = 100 mA. Use Value: 19.0 dB power gain at 1090 MHz reduces required driver output power, lowering overall system DC consumption. |
Use Scenario: High-duty-cycle pulse transmission in DME ground station beacon transmitters operating across 960–1215 MHz band. IC Role / Device Role / Timing Role: Broadband LDMOS amplifier supporting frequency-agile operation without retuning across channelized DME bands. Use Value: Internally matched design enables rapid channel switching (<100 µs) while maintaining consistent Pout and Gps across 960–1215 MHz. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar RF power amplifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AFV10700HS | Same die, NI-780S-4L package with 32 mm tape width - smaller footprint, lower thermal mass, reduced mounting stiffness. | Preferred for space-constrained SWaP-optimized radar modules where mechanical robustness is secondary to size. | Select AFV10700HS only when board real estate is critical and thermal cycling profile permits lower-case thermal inertia. |
| AFV10700GS | Same die, NI-780GS-4L package - gold-plated flange, enhanced corrosion resistance, optimized for maritime/harsh-environment deployment. | Suitable for naval radar systems exposed to salt fog and high humidity where long-term reliability outweighs cost premium. | Choose AFV10700GS when environmental qualification (MIL-STD-810, DO-160) mandates gold-flange corrosion protection. |
Compared with AFV10700H, AFV10700HS offers reduced package size at the expense of thermal stability under high-repetition-rate pulsing, while AFV10700GS adds environmental resilience without altering RF performance - both share identical electrical characteristics and pinout but differ in mechanical construction and qualification scope.
Availability
AFV10700H is available at Aetrix Electronics and suitable for secondary surveillance radar, IFF transponders, ADS-B 1090ES transmitters, and DME ground station applications requiring stable component supply across multi-year defense and aviation production programs.
Supply support for AFV10700H includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor leader specializing in secure connectivity solutions for automotive, industrial, and communications markets, with deep expertise in RF power technology.
The AFV10700H belongs to NXP's AIRFAST® RF Power LDMOS family, engineered specifically for high-reliability, high-peak-power pulse radar systems operating in the L-band (960–1215 MHz).
FAQ
What is the maximum safe operating voltage for AFV10700H?
The AFV10700H has an absolute maximum drain-source voltage (VDSS) of +105 Vdc and a maximum operating voltage (VDD) of +55 Vdc. Operation above 55 Vdc violates the device's safe operating area and risks catastrophic failure. NXP specifies 50 Vdc as the standard test condition for pulse performance, with 52 Vdc validated for higher peak output in the 1030–1090 MHz band. Always maintain VDD ≤ 55 Vdc in production designs.
Does AFV10700H require external input/output matching networks?
No - the AFV10700H is internally input and output matched for broadband operation from 960 to 1215 MHz, as confirmed in NXP's reference circuit documentation and typical performance tables. External matching is unnecessary for fundamental-band operation; however, harmonic filtering remains essential. The internal matching eliminates discrete matching components in the 1030–1090 MHz reference circuit shown on page 5 of the datasheet.
What is the gate quiescent voltage range for AFV10700H at 100 mA total bias current?
The AFV10700H exhibits a gate quiescent voltage (VGS(Q)) range of 1.6 V to 2.6 V when biased at IDQ(A+B) = 100 mAdc and VDD = 50 Vdc, as specified in Table 4 of the datasheet. This range reflects unit-to-unit variation and must be set precisely during production calibration to ensure consistent Class C conduction angle and pulse fidelity in radar applications.
Can AFV10700H be used in push-pull configuration?
Yes - NXP explicitly qualifies the AFV10700H for push-pull, single-ended, and quadrature configurations, as stated in the Features section. Its dual-gate/dual-drain structure and symmetric internal layout enable balanced drive, with measured series-equivalent source impedance (4.0 – j6.9 Ω) and load impedance (3.9 – j1.4 Ω) at 1030 MHz confirming suitability for differential operation in narrowband test fixtures.
What thermal interface material is recommended for AFV10700H mounting?
NXP recommends solder reflow attachment using high-thermal-conductivity solder (e.g., AuSn or SnAgCu) directly to a copper baseplate, per Application Note AN1908. Thermal pastes or greases are not advised due to long-term reliability risks under high-power RF pulsing. The NI-780H-4L package's flange must achieve uniform, void-free solder joint coverage to realize the specified 0.030 °C/W junction-to-case thermal impedance.
AFV10700H-1090 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- Transistor
- Frequency:
- 1.03GHz ~ 1.09GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- AFV10700H
AFV10700H-1090 FAQ
1.How can I place an order for AFV10700H-1090 through Aetrix?
Please submit a Request for Quotation (RFQ) for AFV10700H-1090 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AFV10700H-1090 reliable?
The price and inventory of AFV10700H-1090 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AFV10700H-1090 is usually 5 days.
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Once your AFV10700H-1090 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AFV10700H-1090?
For technical support, including AFV10700H-1090 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AFV10700H-1090 requirements.
6.How does Aetrix verify that AFV10700H-1090 is sourced from the original manufacturer or authorized distributors?
All AFV10700H-1090 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AFV10700H-1090 meets industry standards.
7.What is the process for return or replacement of AFV10700H-1090?
All AFV10700H-1090 units undergo pre-shipment inspection (PSI). If there is an issue with AFV10700H-1090, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AFV10700H-1090 part is unused and in its original packaging.
Return procedure for AFV10700H-1090:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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