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Texas Instruments AM1707DZKB3

Part No.:
AM1707DZKB3
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
256-BGA
Datasheet:
AetrixAM1707DZKB3.pdf
Description:
IC MPU SITARA 375MHZ 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,664

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Product details

Overview

AM1707DZKB3 from Texas Instruments is a 375-MHz ARM926EJ-S™ microprocessor in a 256-ball PBGA (ZKB) package, featuring 128KB on-chip RAM, dual USB ports (USB 2.0 OTG + USB 1.1 OHCI), 10/100 Mbps Ethernet MAC with RMII, and three McASP audio interfaces. It targets industrial automation and portable data terminals requiring real-time OS support and mixed-signal peripheral integration.

For engineers reviewing the AM1707DZKB3 datasheet, AM1707DZKB3 pinout, AM1707DZKB3 application, or AM1707DZKB3 equivalent, this page delivers verified core frequency, memory subsystem layout, peripheral register mapping, thermal specifications for ZKB packaging, and validated alternative microprocessors for ARM9-based embedded control designs.

Technical Context

The AM1707DZKB3 implements an ARMv5TEJ-compliant 32-bit RISC core with separate 16KB instruction and 16KB data caches, MMU support, and Embedded Trace Buffer (ETB). Its clock architecture includes dual PLLs-one for CPU (375 MHz at 1.2 V) and one for peripherals-managed by a Power/Sleep Controller (PSC) with domain-level clock gating.

Peripheral interconnect uses AHB and APB buses with dedicated EDMA3 controller (32 channels + 8 QDMA), enabling zero-copy transfers between McASP FIFOs, EMAC buffers, and external SDRAM via EMIFB (16-/32-bit, 256 MB address space) or NAND/NOR/SDRAM via EMIFA (128 MB).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM926EJ-S, 32-bit/16-bit Thumb, supports Java bytecodes and real-time debug via ETM/ETB
Max Operating Frequency 375 MHz at 1.2 V core voltage; validated for commercial and industrial temperature ranges
On-Chip Memory 128KB SRAM, 64KB ROM, 8KB vector RAM, plus 16KB I-cache and 16KB D-cache
USB Interfaces USB 2.0 OTG (high/full/low-speed) + USB 1.1 OHCI host (full-speed), both with integrated PHY
Ethernet 10/100 Mbps EMAC with RMII interface and MDIO management port
Audio Interface Three McASP modules, each with 28 serial data pins, FIFO buffering, and TDM/I²S/DIT support
External Memory EMIFB: 16-/32-bit SDRAM up to 256 MB; EMIFA: 8-/16-bit NAND/NOR/SDRAM up to 128 MB

Pinout & Package

AM1707DZKB3 is housed in a 256-ball Pb-free plastic ball grid array (PBGA) package with 1.0-mm ball pitch and 17.0 mm × 17.0 mm body size, rated for commercial and industrial temperature operation.

Pin/Terminal Circuit Role Design Meaning
VDD_CORE Core power supply 1.2-V nominal input; must be sequenced before I/O and analog supplies per boot requirements
VDD_IO I/O power supply 3.3-V supply for all LVCMOS I/O banks except USB PHY pins
CLKIN Primary oscillator input Accepts 24-MHz crystal or external clock; feeds PLL1 for CPU clock generation
USB0_VDDA12 USB0 analog PHY supply 1.2-V output from internal regulator; requires external 1-µF bypass capacitor
MDIO / MDC PHY management interface Two-wire interface to configure external Ethernet PHY; operates at 2.5 MHz max
GPIO[0:127] Configurable digital I/O Eight 16-bit banks; each pin multiplexed with UART, McASP, eHRPWM, or eCAP functions

Key Features

Feature Design Value
Programmable Real-Time Unit Subsystem (PRUSS) Two independent 32-bit PRU cores with 4KB IRAM and 512B DRAM each; offloads deterministic I/O tasks from ARM
eHRPWM modules Three enhanced PWM units supporting 6 single-edge, 6 dual-edge symmetric, or 3 dual-edge asymmetric outputs with dead-band and chopping
eCAP modules Three 32-bit capture peripherals configurable as event timers or auxiliary PWM outputs; support quadrature decoding via eQEP
EDMA3 controller 32 independent DMA channels + 8 quick-DMA channels; enables concurrent transfers across McASP, EMAC, and memory without CPU intervention
Memory protection Dual MPU blocks (MPU1/MPU2) enforce access rights across ARM, PRUSS, and DMA masters to isolate firmware partitions

Applications

Industrial PLC Controllers Portable Data Terminals

Use Scenario: Real-time motion control and fieldbus communication in compact programmable logic controllers.

IC Role / Device Role / Timing Role: Central processing unit executing deterministic ladder logic with synchronized PWM outputs and encoder feedback via eQEP.

Use Value: Integrated eHRPWM/eQEP eliminates external timing ICs; EMAC + dual USB enables HMI, EtherNet/IP, and firmware update over multiple interfaces.

Use Scenario: Barcode scanning, RFID reading, and wireless reporting in handheld logistics devices.

IC Role / Device Role / Timing Role: Application processor running Linux with direct peripheral control of scan engine, display, and cellular modem via UART/USB.

Use Value: McASP interfaces audio prompts and alerts; 128KB RAM supports full OS image and application stack without external SDRAM.

Home Automation Gateways Test & Measurement Front Ends

Use Scenario: Protocol translation hub aggregating Zigbee, Z-Wave, and Wi-Fi sensor data into cloud-uploaded payloads.

IC Role / Device Role / Timing Role: Multi-protocol bridge using PRUSS for bit-banged radio control and ARM for TLS-secured MQTT transport.

Use Value: Dual USB ports allow simultaneous connection to PC host (debug) and USB-to-serial adapter (sensor interface); I²C supports local sensor expansion.

Use Scenario: Signal acquisition and waveform generation in benchtop oscilloscopes and function generators.

IC Role / Device Role / Timing Role: High-precision timing controller synchronizing ADC sampling (via McASP or GPIO triggers) and DAC output (via eHRPWM carrier modulation).

Use Value: 64-bit general-purpose timers provide sub-microsecond timestamping; EDMA3 enables burst transfer of sampled data to RAM without CPU load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM9-based microprocessor applications.

Alternative Part Technical Difference Application Difference Selection Advice
AM1808BZKN 456-MHz ARM926EJ-S, same ZKN package but 361-ball BGA; adds SATA controller and security accelerator Targeted at higher-throughput storage gateways and secure boot applications Select when >375-MHz performance, SATA, or cryptographic acceleration is required
OMAP-L138BZWT ARM9 + C674x DSP dual-core; 375-MHz ARM + 375-MHz DSP; same 361-ball BGA but different pinout and power sequencing Optimized for audio analytics, voice recognition, and real-time signal processing Select when DSP-intensive algorithms (e.g., FFT, filtering) must run alongside ARM applications

Compared with AM1707DZKB3, AM1808BZKN offers higher CPU frequency and added peripherals in a larger package, while OMAP-L138BZWT trades pure ARM throughput for heterogeneous compute capability-neither is pin-compatible, but both share toolchain and peripheral driver compatibility within TI's ARM9 ecosystem.

Availability

AM1707DZKB3 is available at Aetrix Electronics and suitable for industrial automation, portable data terminals, and test & measurement equipment requiring stable component supply across extended product lifecycles.

Supply support for AM1707DZKB3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and communications markets.

The AM1707DZKB3 belongs to TI's Sitara™ ARM microprocessor family, designed specifically for cost-sensitive, low-power embedded applications requiring rich peripheral integration and Linux-capable processing without external memory controllers.

FAQ

What is the maximum operating frequency of the AM1707DZKB3 and under what voltage condition?

The AM1707DZKB3 operates at a maximum frequency of 375 MHz when supplied with a 1.2-V core voltage (VDD_CORE). This rating is specified for commercial and industrial temperature ranges and is validated in the SPRS637E datasheet revision. The device also supports lower-frequency operation (e.g., 300 MHz or 266 MHz) at reduced voltage for power-constrained deployments. AM1707DZKB3 does not support the 456-MHz mode, which requires 1.3-V core voltage and is reserved for higher-grade variants like AM1707DZKBA.

Does the AM1707DZKB3 include on-chip memory sufficient to run a lightweight Linux kernel without external SDRAM?

No, the AM1707DZKB3 includes 128KB of on-chip RAM and 64KB of ROM, which is insufficient for loading and executing a standard Linux kernel and root filesystem. External memory is required: EMIFB supports 16-/32-bit SDRAM up to 256 MB, and EMIFA supports NAND/NOR flash for boot code storage. AM1707DZKB3 relies on external SDRAM for runtime execution, with on-chip RAM typically used for boot ROM, cache, or critical real-time buffers.

How many USB interfaces does the AM1707DZKB3 support, and what are their compliance levels?

The AM1707DZKB3 integrates two fully independent USB interfaces: USB0 is a USB 2.0 On-The-Go (OTG) controller compliant with high-speed (480 Mbps), full-speed (12 Mbps), and low-speed (1.5 Mbps) modes, including integrated PHY; USB1 is a USB 1.1 Open Host Controller Interface (OHCI) host controller compliant with full-speed (12 Mbps) only, also with integrated PHY. Both interfaces are electrically isolated and require separate 1.2-V analog supplies (USB0_VDDA12 and USB1_VDDA12). AM1707DZKB3 does not support USB 3.x or SuperSpeed.

Can the AM1707DZKB3 directly interface with an LCD panel, and what display capabilities does it support?

Yes, the AM1707DZKB3 includes a dedicated LCD controller supporting passive and active matrix panels with RGB, YUV, and serial interface outputs. It handles resolutions up to VGA (640×480) with 16- or 24-bit color depth, programmable pixel clocks, and hardware cursor overlay. The controller supports both synchronous and asynchronous modes and integrates DMA for frame buffer transfers. AM1707DZKB3 does not include HDMI or MIPI DSI transmitters; external bridge ICs are required for modern digital displays.

What debugging interfaces are available on the AM1707DZKB3, and are they accessible via standard JTAG?

The AM1707DZKB3 provides IEEE 1149.1 JTAG (TCK/TMS/TDI/TDO/TRST) for boundary-scan and core debug, plus an Embedded Trace Buffer (ETB) with 4KB memory for instruction and data trace capture. Debugging is supported via ARM CoreSight-compliant tools using the JTAG interface; no SWD or cJTAG is implemented. The ETB connects internally to the ARM926EJ-S ETM but lacks a routed trace port-trace data must be read through JTAG. AM1707DZKB3 also supports Embedded ICE-RT for real-time breakpoint and watchpoint control during active execution.

AM1707DZKB3 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
256-BGA
Series:
Sitara™
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM926EJ-S
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
375MHz
Co-Processors/DSP:
System Control; CP15
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
10/100Mbps (1)
SATA:
-
USB:
USB 1.1 + PHY (1), USB 2.0 + PHY (1)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 90°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-BGA (17x17)
Additional Interfaces:
I2C, McASP, SPI, MMC/SD, UART

AM1707DZKB3 FAQ

1.How can I place an order for AM1707DZKB3 through Aetrix?

Please submit a Request for Quotation (RFQ) for AM1707DZKB3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AM1707DZKB3 reliable?

The price and inventory of AM1707DZKB3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM1707DZKB3 is usually 5 days.

3.What payment methods are accepted for AM1707DZKB3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM1707DZKB3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AM1707DZKB3?

AM1707DZKB3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AM1707DZKB3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AM1707DZKB3?

For technical support, including AM1707DZKB3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM1707DZKB3 requirements.

6.How does Aetrix verify that AM1707DZKB3 is sourced from the original manufacturer or authorized distributors?

All AM1707DZKB3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM1707DZKB3 meets industry standards.

7.What is the process for return or replacement of AM1707DZKB3?

All AM1707DZKB3 units undergo pre-shipment inspection (PSI). If there is an issue with AM1707DZKB3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AM1707DZKB3 part is unused and in its original packaging.

Return procedure for AM1707DZKB3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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