Texas Instruments AM1802EZCED3

Overview

AM1802EZCED3 from Texas Instruments is a 300-MHz ARM926EJ-S™ RISC microprocessor with integrated 16KB instruction cache, 16KB data cache, 64KB ROM, 8KB vector RAM, and 128KB on-chip SRAM. It features a 10/100 Mbps Ethernet MAC (MII/RMII), USB 2.0 OTG with integrated PHY, three UARTs, two SPIs, one I²C, one MMC/SD interface, McASP audio port, EDMA3 controller, RTC, and dual external memory interfaces (EMIFA + DDR2/mDDR). It targets embedded industrial control and medical devices requiring real-time OS support and rich peripheral integration.

For engineers reviewing the AM1802EZCED3 datasheet, AM1802EZCED3 pinout, AM1802EZCED3 application, or AM1802EZCED3 equivalent, key selection criteria include ARM926EJ-S core compatibility, 361-ball NFBGA (ZCE) package with 0.65-mm pitch, 1.2-V core / 1.8-V or 3.3-V I/O voltage support, industrial temperature range (–40°C to 85°C), and boot-source flexibility via EMIFA, NAND, or MMC/SD.

Technical Context

The AM1802EZCED3 implements the ARMv5TEJ instruction set with Jazelle® Java acceleration and Embedded ICE-RT™ debug support. Its memory subsystem includes MMU-based virtual memory management, four-way associative caches with critical-word-first refill, and hardware page table walks - enabling robust Linux and RTOS execution.

Peripheral interconnect uses AHB buses with dedicated D-AHB/I-AHB paths, while the EDMA3 engine provides 64 independent channels and 16 quick-DMA channels for zero-CPU-overhead data movement between peripherals, memory, and external interfaces including EMAC, USB, McASP, and MMC/SD.

Key Specifications

Pinout & Package

The AM1802EZCED3 is housed in a 361-ball Pb-free plastic ball grid array (NFBGA) package with 0.65-mm ball pitch and 13 mm × 13 mm body size (ZCE suffix). Pin functions are fully multiplexed and configured via boot settings and software registers.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM9-based applications.

Compared with AM1806ZCED3 and AM1808ZCED3, the AM1802EZCED3 delivers the essential ARM926EJ-S feature set-including EMAC, USB OTG, McASP, and dual memory controllers-at lowest silicon cost and power, making it ideal for single-function industrial edge nodes where extended peripheral count or security is unnecessary.

Availability

AM1802EZCED3 is available at Aetrix Electronics and suitable for medical monitoring devices, ePOS terminals, and building automation controllers requiring stable component supply across long product lifecycles.

Supply support for AM1802EZCED3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and consumer markets.

The AM1802 belongs to TI's Sitara™ ARM processor family, designed specifically for cost-optimized, Linux-capable industrial and medical applications requiring rich peripheral integration without FPGA-level complexity.

FAQ

What is the core architecture and clock speed of the AM1802EZCED3?

The AM1802EZCED3 integrates an ARM926EJ-S™ RISC core operating at 300 MHz. It supports both 32-bit ARM and 16-bit Thumb instructions, includes Jazelle® Java acceleration, and features a full Memory Management Unit (MMU) for virtual memory support. This architecture enables robust Linux and real-time OS execution in resource-constrained embedded systems.

Which package type does the AM1802EZCED3 use, and what are its mechanical dimensions?

The AM1802EZCED3 uses a 361-ball NFBGA package with ZCE suffix, measuring 13.0 mm × 13.0 mm with 0.65-mm ball pitch. This package is distinct from the larger ZWT variant (16 mm × 16 mm, 0.80-mm pitch) and is optimized for compact industrial PCB layouts while maintaining thermal performance across the industrial temperature range.

Does the AM1802EZCED3 support booting from NAND flash, and how is boot mode selected?

Yes, the AM1802EZCED3 supports NAND flash boot via its EMIFA interface. Boot mode is determined by hardware configuration pins (BOOT[0:7]) sampled at reset, with specific combinations selecting NAND, NOR, MMC/SD, or UART boot. The AM1802EZCED3 datasheet Table 4-1 defines all valid boot configurations and corresponding pin states.

What are the supported I/O voltage levels for the AM1802EZCED3, and how are they configured?

The AM1802EZCED3 supports 1.8-V or 3.3-V LVCMOS I/Os (excluding USB and DDR2 interfaces), configured per-bank via the VDDSHVx supply rails and associated register settings. Core voltage is fixed at 1.2 V for 300-MHz operation. I/O voltage selection is hardware-defined and must match connected peripheral logic families to ensure signal integrity and avoid damage.

How many independent DMA channels does the AM1802EZCED3 provide, and what peripherals can they serve?

The AM1802EZCED3 integrates the Enhanced Direct Memory Access Controller 3 (EDMA3) with 64 independent DMA channels and 16 quick-DMA channels. These channels service all major peripherals-including EMAC, USB, McASP, UART, SPI, I²C, MMC/SD, and external memory interfaces-enabling zero-CPU-overhead data transfers for real-time streaming and protocol processing.