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Texas Instruments AM263P4ACOLFZCZR
- Part No.:
- AM263P4ACOLFZCZR
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 324-LFBGA
- Datasheet:
-
AM263P4ACOLFZCZR.pdf
- Description:
- MHZ WITH REAL-TIME CONTROL AND E
- Quantity:
- Payment:
- Shipping:
Inventory:2,246
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Product details
Overview
AM263P4ACOLFZCZR from Texas Instruments is a quad-core Arm® Cortex®-R5F real-time microcontroller operating at up to 400MHz per core, featuring 3MB on-chip SRAM with ECC, integrated 8MB OSPI Flash-in-Package (ZCZ-F), and dual-lockstep-capable R5F clusters for functional safety. It integrates PRU-ICSS for EtherCAT®, PROFINET®, and Ethernet/IP™, and targets high-reliability motor control and digital power systems in EV traction inverters and industrial servo drives.
For engineers reviewing the AM263P4ACOLFZCZR datasheet, AM263P4ACOLFZCZR pinout, AM263P4ACOLFZCZR application, or AM263P4ACOLFZCZR equivalent, this page delivers verified core count, Flash-in-Package density, resolver subsystem capability, functional safety targeting (ASIL-D/SIL-3), and ZCZ 324-pin nFBGA package details - all confirmed from TI's SPRSP81D datasheet and orderable part nomenclature.
Technical Context
The AM263P4ACOLFZCZR implements four Arm® Cortex®-R5F cores grouped into two lockstep-capable clusters, each with 256KB TCM and dedicated Trigonometric Math Units (TMUs). Its Flash-in-Package (ZCZ-F) variant embeds a 64Mb ISSI IS25LX064-JWLA3 OSPI Flash die, disabling external OSPI interface use and limiting junction temperature to 125°C.
It integrates a Resolver Subsystem (2× RDC + 2× 4-ch ADC) exclusive to ZCZ-S/ZCZ-F packages, alongside 32x EPWM modules with HRPWM, 5× 12-bit ADCs (up to 4MSPS), and hardware-accelerated cryptography (AES-256, SHA-512, PKA) managed by an isolated Cortex-M4F-based Hardware Security Module (HSM).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Count & Type | Quad-core Arm® Cortex®-R5F, each up to 400MHz; dual-cluster lockstep or dual-core mode supported. |
| On-Chip Memory | 3MB OCSRAM with ECC; 256KB TCM per cluster; no external RAM required for most real-time control workloads. |
| Flash-in-Package | 8MB (64Mb) integrated OSPI Flash (ISSI IS25LX064-JWLA3); enables XIP but disables external OSPI interface. |
| Resolver Support | 2× Resolver-to-Digital Converters (RDC) + 2× 4-ch 12-bit ADCs; available only in ZCZ-F package variant. |
| Functional Safety | Targeted for ASIL-D (automotive) and SIL-3 (industrial); includes ESM, PBIST, DCC, STC, and SAFETY_ERRORn pin. |
| Cryptography | HSM with Cortex-M4F core, AES-128/192/256, SHA2-256/384/512, PKA, TRNG, and secure boot with RoT enforcement. |
| Package | 324-pin nFBGA (ZCZ), 15.0mm × 15.0mm, 0.8mm pitch; AEC-Q100 qualified for automotive applications. |
Pinout & Package
AM263P4ACOLFZCZR uses a 324-ball nFBGA (ZCZ package), 15.0mm × 15.0mm, 0.8mm pitch, with ball grid layout matching AM263x-compatible ZCZ-C, ZCZ-S, and ZCZ-F variants. Pin functions are defined per TI SPRSP81D Section 5.1.2 (ZCZ_S/ZCZ_F diagrams) and validated for resolver, ADC, EPWM, MCAN, and PRU-ICSS signal routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ADC_R0_AIN0–ADC_R1_AIN3 | Resolver analog inputs | Dedicated pins for resolver feedback; only active in ZCZ-F package with resolver subsystem enabled. |
| SAFETY_ERRORn | Functional safety error output | Open-drain active-low signal asserted by ESM on critical fault detection; requires external pull-up. |
| RGMII1_TXC / RGMII1_RXC | Gigabit Ethernet clock | Supports 125MHz RGMII timing for CPSW 3-port switch; enables IEEE 1588 PTP timestamping. |
| MCAN0_TX / MCAN0_RX | CAN FD transceiver interface | Compliant with ISO 11898-1:2015; supports data rates up to 5Mbps with flexible bit timing. |
| EPWM0_A / EPWM0_B | High-resolution PWM outputs | Paired complementary outputs with dead-time insertion; resolution down to 150ps via HRPWM extension. |
Key Features
| Feature | Design Value |
|---|---|
| Resolver Subsystem | ZCZ-F package includes 2× RDC + 2× 4-ch ADC for motor position sensing without external resolver ICs. |
| PRU-ICSS Offload | Dual PRU cores (20 eGPI/eGPO each) execute deterministic industrial protocols (EtherCAT®, PROFINET®) independently of R5F. |
| Secure Boot Enforcement | HSM enforces hardware-rooted trust chain using two RoT key sets, authenticated + encrypted boot, and anti-rollback protection. |
| Real-Time Analog Front-End | 5× SAR ADCs (6-input, 4MSPS max), 40× comparators with DAC references, 32× EPWM, and SDFM for sigma-delta sensor interfaces. |
| Functional Safety Infrastructure | Integrated ESM, 4× DCC, 3× STC, PBIST, and windowed watchdog timers - all documented for IEC 61508 and ISO 26262 compliance. |
Applications
| EV Traction Inverter | Industrial Servo Drive |
|---|---|
|
Use Scenario: High-power motor control in battery-electric vehicles requiring precise torque regulation and thermal monitoring. IC Role / Device Role / Timing Role: Real-time control unit executing field-oriented control (FOC) loops at ≤10μs intervals using R5F clusters and resolver feedback. Use Value: Integrated resolver subsystem eliminates external RDC ICs; lockstep R5F clusters and ESM enable ASIL-D-compliant fault detection and response. |
Use Scenario: Multi-axis motion control in CNC machines and collaborative robots demanding synchronized PWM, encoder, and current sensing. IC Role / Device Role / Timing Role: Central controller managing 32x EPWM channels, 3x EQEP, and 5x ADCs for closed-loop current/voltage/position control. Use Value: On-chip 3MB SRAM with ECC avoids external memory bottlenecks; PRU-ICSS handles time-critical I/O while R5Fs run application firmware. |
| Battery Management System (BMS) | Onboard Charger (OBC) |
|
Use Scenario: Cell voltage, temperature, and isolation monitoring in high-voltage EV battery packs with functional safety requirements. IC Role / Device Role / Timing Role: Safety monitor co-processor validating cell measurements and triggering shutdown via SAFETY_ERRORn pin. Use Value: Dual-lockstep R5F clusters and PBIST support systematic SIL-3 compliance; integrated 12-bit DAC enables precision reference generation. |
Use Scenario: AC/DC and DC/DC conversion control in vehicle-integrated chargers, requiring CAN FD communication and thermal management. IC Role / Device Role / Timing Role: Main MCU coordinating PFC, LLC, and isolation stages via 8x MCAN, 6x UART, and 32x EPWM with phase-shift control. Use Value: 8MB Flash-in-Package stores dual firmware images for fail-safe updates; HSM secures OTA update authentication and decryption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AM263P4ACOLRZCZR | No Flash-in-Package; external OSPI interface available; same ZCZ package and core count. | Suitable when external flash expansion or RWW (Read-While-Write) is required; lacks integrated 8MB storage. | Select AM263P4ACOLRZCZR if board layout must retain OSPI routing or if firmware size exceeds 8MB. |
| AM263P4ACOLQ1ZCZR | AEC-Q100 Grade 0 qualified (–40°C to 150°C); identical core/peripheral set but higher temp rating. | Required for under-hood automotive applications where junction temperature exceeds 125°C. | Choose AM263P4ACOLQ1ZCZR only when full automotive temperature range and qualification documentation are mandatory. |
Compared with AM263P4ACOLFZCZR, AM263P4ACOLRZCZR trades embedded flash for OSPI flexibility, while AM263P4ACOLQ1ZCZR extends thermal operation at the cost of higher qualification overhead - neither offers pin-to-pin replacement without layout or thermal redesign.
Availability
AM263P4ACOLFZCZR is available at Aetrix Electronics and suitable for EV traction inverters, industrial servo drives, and onboard chargers requiring stable component supply, long-term lifecycle support, and automotive-grade traceability.
Supply support for AM263P4ACOLFZCZR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies for industrial and automotive markets.
The AM263Px family was designed for deterministic real-time control in motor drives, digital power, and functional safety–critical systems - combining Arm® R5F performance, PRU-ICSS offload, and hardware-enforced security.
FAQ
What is the Flash-in-Package configuration of AM263P4ACOLFZCZR?
The AM263P4ACOLFZCZR integrates an 8MB (64Mb) OSPI Flash die (ISSI IS25LX064-JWLA3) inside the ZCZ-F package. This eliminates the need for external flash but disables the OSPI interface for application use. The device supports eXecute-In-Place (XIP), though Read-While-Write (RWW) is not supported during XIP operations, as confirmed in TI's SPRSP81D datasheet Section 4.1 and Table 4-1.
Does AM263P4ACOLFZCZR support functional safety certification out of the box?
AM263P4ACOLFZCZR is targeted for IEC 61508 SIL-3 and ISO 26262 ASIL-D compliance, with integrated hardware features including Error Signaling Module (ESM), SAFETY_ERRORn pin, dual-clock comparators (DCC), and programmable built-in self-test (PBIST). While the silicon provides the necessary safety mechanisms, full certification requires system-level validation and TI's safety documentation - which is planned but not yet released per SPRSP81D Section 2.
How does the resolver subsystem in AM263P4ACOLFZCZR differ from standard ADC functionality?
The resolver subsystem in AM263P4ACOLFZCZR comprises two dedicated Resolver-to-Digital Converters (RDC) and two additional 4-channel 12-bit ADCs - accessible only in ZCZ-F and ZCZ-S packages. Unlike general-purpose ADCs, the RDCs perform sine/cosine demodulation and angle calculation in hardware, enabling direct motor shaft position feedback without software-intensive algorithms or external ICs, as detailed in Sections 1 and 3.1 of SPRSP81D.
Can AM263P4ACOLFZCZR run PRU-ICSS firmware concurrently with Arm® R5F applications?
Yes - AM263P4ACOLFZCZR supports concurrent execution: the dual PRU cores (PRU0/PRU1) operate independently of the four Arm® Cortex®-R5F cores, with dedicated 32KB shared RAM, 16KB IRAM per PRU, and hardware mailbox/SPINLOCK for interprocessor communication. This allows industrial protocol stacks (e.g., EtherCAT®) to run deterministically on PRUs while R5Fs handle application logic, as specified in Section 1 and Figure 3-1 of SPRSP81D.
What is the maximum junction temperature rating for AM263P4ACOLFZCZR?
The AM263P4ACOLFZCZR has a maximum junction temperature of 125°C, limited by its integrated OSPI Flash die (ISSI IS25LX064-JWLA3) per SPRSP81D Section 4, Table 4-1 footnote (12). This differs from non-Flash-in-Package variants like AM263P4ACOLQ1ZCZR, which support up to 150°C. Thermal design must ensure sustained operation remains within this 125°C limit.
AM263P4ACOLFZCZR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 324-LFBGA
- Series:
- Sitara™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R4F
- Core Size:
- 32-Bit Quad-Core
- Speed:
- 400MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
- Peripherals:
- AES, DMA, POR, PWM, SHA, TRNG, WDT
- Number of I/O:
- 139
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 3M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 1.89V, 3.135V ~ 3.465V
- Data Converters:
- A/D 6x12b SAR; D/A 1x12b
- Oscillator Type:
- Internal
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
AM263P4ACOLFZCZR FAQ
1.How can I place an order for AM263P4ACOLFZCZR through Aetrix?
Please submit a Request for Quotation (RFQ) for AM263P4ACOLFZCZR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AM263P4ACOLFZCZR reliable?
The price and inventory of AM263P4ACOLFZCZR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM263P4ACOLFZCZR is usually 5 days.
3.What payment methods are accepted for AM263P4ACOLFZCZR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM263P4ACOLFZCZR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AM263P4ACOLFZCZR?
AM263P4ACOLFZCZR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AM263P4ACOLFZCZR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AM263P4ACOLFZCZR?
For technical support, including AM263P4ACOLFZCZR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM263P4ACOLFZCZR requirements.
6.How does Aetrix verify that AM263P4ACOLFZCZR is sourced from the original manufacturer or authorized distributors?
All AM263P4ACOLFZCZR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM263P4ACOLFZCZR meets industry standards.
7.What is the process for return or replacement of AM263P4ACOLFZCZR?
All AM263P4ACOLFZCZR units undergo pre-shipment inspection (PSI). If there is an issue with AM263P4ACOLFZCZR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AM263P4ACOLFZCZR part is unused and in its original packaging.
Return procedure for AM263P4ACOLFZCZR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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