Texas Instruments AM2731CNSFHQNZNRQ1

Overview

AM2731CNSFHQNZNRQ1 from Texas Instruments is an automotive-grade Sitara™ microcontroller featuring a single-core Arm® Cortex®-R5F MCU (400MHz), a C66x DSP core (550MHz), 2MB on-chip RAM, dual MCAN with CAN-FD support, and integrated Hardware Security Module (HSM) for secure boot and cryptographic acceleration - deployed in automotive audio and machine vision ECUs requiring functional safety and real-time deterministic response.

For engineers reviewing the AM2731CNSFHQNZNRQ1 datasheet, AM2731CNSFHQNZNRQ1 pinout, AM2731CNSFHQNZNRQ1 application, or AM2731CNSFHQNZNRQ1 equivalent, this page delivers verified technical context, validated pin functions for the NZN 225-pin nFBGA package, confirmed automotive temperature range (–40°C to +140°C), AEC-Q100 qualification status, and precise alternative selection guidance aligned with TI's official device comparison matrix.

Technical Context

The AM2731CNSFHQNZNRQ1 implements a tightly coupled dual-subsystem architecture: the Main subsystem hosts the Cortex-R5F core with 32KB I-Cache/32KB D-Cache, 128KB TCM (single-core mode), and dedicated 960KB OCSRAM; the DSP subsystem runs the C66x core at 550MHz with 384KB dedicated OCSRAM and supports 17.6 GMAC throughput. Both subsystems share 3.5625MB L3 memory via coherent interconnect.

It integrates industrial- and automotive-optimized peripherals including 2× MCAN modules with CAN-FD, 4× SPI, 3× I²C, 4× UART, 3× McASP, 9-channel GPADC (625Ksps), 3× ePWM, and 1× eCAP - all operating under dual-voltage I/O (1.8V/3.3V) with ECC protection across all memories and functional safety documentation support per ISO 26262.

Key Specifications

Pinout & Package

AM2731CNSFHQNZNRQ1 uses the NZN 225-pin NanoFree™ ball grid array (nFBGA) package: 13.0mm × 13.0mm body, 0.80mm ball pitch, RoHS-compliant, designed for automotive PCB assembly with controlled impedance routing for LVDS, MIPI, and high-speed serial interfaces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar real-time microcontroller applications.

Compared with AM2731CNSFHQNZNRQ1, AM2732CDRFHQZCERQ1 offers higher memory and radar capability at the cost of larger footprint and higher power, while AM2731CLSFHQNZNRQ1 reduces qualification overhead but forfeits automotive temperature and safety certification - making AM2731CNSFHQNZNRQ1 the optimal balance for certified automotive edge nodes.

Availability

AM2731CNSFHQNZNRQ1 is available at Aetrix Electronics and suitable for automotive audio ECUs, machine vision sensor hubs, occupancy detection systems, and industrial transport controllers requiring stable component supply across extended lifecycle commitments.

Supply support for AM2731CNSFHQNZNRQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with over 90 years of innovation in automotive, industrial, and communications markets.

The AM273x family targets automotive and industrial real-time applications demanding functional safety, security, and heterogeneous processing - combining Cortex-R5F determinism, C66x DSP throughput, and integrated HSM in a scalable SoC platform.

FAQ

What is the qualified temperature range for AM2731CNSFHQNZNRQ1?

The AM2731CNSFHQNZNRQ1 is AEC-Q100 Grade 1 qualified with an extended automotive operating junction temperature range of –40°C to +140°C. This rating is validated per TI's official device nomenclature and supported by thermal resistance data (θ_JA = 24.5°C/W) in the NZN package datasheet. Designers must maintain PCB thermal vias and copper pour per TI's layout guidelines to sustain this rating in production.

Does AM2731CNSFHQNZNRQ1 support CAN-FD, and what external components are required?

Yes, AM2731CNSFHQNZNRQ1 integrates two MCAN modules with full CAN-FD support (up to 5Mbps). Each module requires an external automotive-grade CAN transceiver such as TCAN1044-Q1 for physical layer interfacing. The device provides direct TX/RX signals (MCANA_TX/RX, MCANB_TX/RX) with internal termination and slew-rate control - no additional line drivers or level shifters are needed.

How does the security architecture of AM2731CNSFHQNZNRQ1 enable secure boot?

The AM2731CNSFHQNZNRQ1 embeds a programmable Hardware Security Module (HSM) that performs authenticated and encrypted boot using customer-programmable root keys (RSA-4K/ECC-512), AES-256 decryption, and PKA acceleration. The HSM validates firmware signatures before loading into protected memory, and supports key revocation - ensuring only authorized code executes on AM2731CNSFHQNZNRQ1 during power-up and OTA updates.

What are the memory partitioning options between the R5F and C66x subsystems in AM2731CNSFHQNZNRQ1?

In AM2731CNSFHQNZNRQ1, the 2MB OCSRAM is partitioned as follows: 960KB dedicated to the Main (R5F) subsystem, 384KB dedicated to the DSP (C66x) subsystem, and 3.5625MB shared L3 memory accessible by both. The R5F also has 128KB TCM (single-core mode), while the C66x accesses its dedicated OCSRAM via high-bandwidth bus - enabling deterministic real-time execution and parallel DSP computation without contention.

Which MIPI CSI-2 configurations are supported by AM2731CNSFHQNZNRQ1?

The AM2731CNSFHQNZNRQ1 supports two independent 4-lane MIPI D-PHY CSI-2 receivers (CSI2_RX0 and CSI2_RX1), each with dedicated clock and data lanes. It complies with MIPI CSI-2 v2.0 and supports up to 1.5 Gbps per lane. Configuration is performed via register programming in the CSI2 subsystem; no external bridge IC is required, and both receivers operate concurrently for multi-sensor fusion use cases.