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Texas Instruments AM2732ADRFGQZCERQ1
- Part No.:
- AM2732ADRFGQZCERQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 285-LFBGA
- Datasheet:
-
AM2732ADRFGQZCERQ1.pdf
- Description:
- IC MPU 400MHZ 285NFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,976
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Product details
Overview
AM2732ADRFGQZCERQ1 from Texas Instruments is an automotive-qualified dual-core Arm® Cortex®-R5F + C66x DSP Sitara™ microcontroller in a 285-pin nFBGA (ZCE) package, operating at up to 400MHz (R5F) and 550MHz (DSP), with 5.0MB on-chip RAM, dual MCAN with CAN-FD, and hardware security module (HSM) for secure boot and crypto acceleration - deployed in automotive audio and machine vision systems.
For engineers reviewing the AM2732ADRFGQZCERQ1 datasheet, AM2732ADRFGQZCERQ1 pinout, AM2732ADRFGQZCERQ1 application, or AM2732ADRFGQZCERQ1 equivalent, this page delivers verified functional safety (ISO 26262-ready), AEC-Q100 Grade 1 qualification (-40°C to +140°C), dual-core real-time execution, and MIPI CSI-2/4-lane LVDS interface support - critical for robotics, avionics, and industrial transport designs.
Technical Context
The AM2732ADRFGQZCERQ1 implements a tightly coupled dual-core Arm Cortex-R5F cluster with SECDED ECC on 32KB I-Cache, 32KB D-Cache, and configurable TCM (64KB per core in dual-core mode), paired with a standalone C66x DSP core delivering 17.6 GMAC at 550MHz. Its memory subsystem integrates 3.5625MB shared L3 SRAM and dedicated DSP/MAIN subsystem RAM.
System-level features include 12-channel EDMA, 5 RTI modules, mailbox-based IPC, JTAG/trace debug, and dual 4-lane MIPI D-PHY CSI-2 receivers plus 4-lane LVDS/Aurora output - all supported by dual-voltage I/O (1.8V/3.3V), LP87745-Q1 PMIC compatibility, and HSM-managed AES-256, ECC-512, and TRNG.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core Arm Cortex-R5F @ 400MHz + single C66x DSP @ 550MHz - enables deterministic real-time control and high-throughput signal processing in one SoC. |
| On-Chip Memory | 5.0MB OCSRAM (3.5625MB shared L3 + 960KB MAIN + 384KB DSP) - eliminates external RAM for latency-critical applications like radar preprocessing. |
| Automotive Qualification | AEC-Q100 Grade 1 (−40°C to +140°C junction) - validated for under-hood and infotainment ECU deployment without derating. |
| Security Features | Embedded HSM with RSA-4K/ECC-512 key storage, AES-256 acceleration, and secure authenticated boot - meets ISO/SAE 21434 threat mitigation requirements. |
| High-Speed Interfaces | 2× MCAN with CAN-FD, 10/100Mbps Ethernet (RGMII/RMII/MII), 2× 4-lane MIPI CSI-2, 4-lane LVDS/Aurora - supports camera fusion and time-synchronized sensor data acquisition. |
| ADC & PWM | 9-channel GPADC @ 625 Ksps + 3× ePWM + 1× eCAP - suitable for motor control feedback and analog sensor monitoring in electric powertrain subsystems. |
Pinout & Package
AM2732ADRFGQZCERQ1 uses the ZCE 285-pin nFBGA package (13mm × 13mm, 0.65mm pitch), with ball-grid layout defined in TI's SWRS245D datasheet Figure 5-1. Power domains include VDD (1.0V core), VDD_SRAMx (1.2V SRAM), VIOIN_18 (1.8V I/O), and VIOIN (3.3V I/O). Ground balls are distributed across corners and center for EMI suppression and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VSS (multiple) | Ground reference | Multiple dedicated ground balls ensure low-impedance return paths for core, SRAM, and I/O domains - critical for signal integrity in mixed-signal automotive environments. |
| VDD / VDD_SRAMx | Power supply inputs | Separate 1.0V core and 1.2V SRAM rails enable independent voltage scaling and dynamic power management during real-time task scheduling. |
| VIOIN_18 / VIOIN | I/O voltage supplies | Dual-voltage I/O domain supports 1.8V (LVDS, CSI-2, ADC) and 3.3V (UART, SPI, I2C) peripherals without level shifters - simplifies board design. |
| CSI2_RX0P0–P3, M0–M3, CLKP/CLKM | MIPI D-PHY receiver lanes | Two independent 4-lane MIPI CSI-2 receivers (RX0/RX1) accept concurrent high-resolution image streams from stereo cameras or surround-view sensors. |
| LVDS_TXP0–P3, TXM0–M3, CLKP/CLKM, FRCLKP/FRCLKM | LVDS transmitter interface | 4-lane LVDS output with frame clock supports high-speed debug trace, display output, or FPGA co-processing with sub-nanosecond skew control. |
| MSS_RGMII_RD0–RD3, TD0–TD3, RCLK, TCLK, RCTL, TCTL | RGMII Ethernet interface | Full RGMII implementation (not RMII/MII only) enables 100Mbps deterministic networking with <2ns clock-to-data skew - required for time-sensitive automotive protocols. |
| MSS_MCANA_TX/RX, MSS_MCANB_TX/RX | CAN-FD transceiver interfaces | Dual isolated MCAN modules support concurrent CAN FD communication at up to 5Mbps - essential for gateway ECUs aggregating ADAS and chassis networks. |
Key Features
| Feature | Design Value |
|---|---|
| Functional Safety Support | ISO 26262 ASIL-B ready documentation, lockstep-capable R5F cores, ECC on all memories, and diagnostic libraries - reduces FMEDA effort for automotive system certification. |
| Hardware Security Module (HSM) | Programmable embedded HSM with key revocation, secure boot ROM, and crypto accelerators (PKA, AES, TRNG) - enables OTA firmware updates with cryptographic integrity verification. |
| Real-Time Interprocessor Communication | Mailbox system + 12-channel EDMA + 5 RTI timers - enables deterministic task handoff between R5F and DSP subsystems with <1μs latency for closed-loop control loops. |
| Flexible Clock Architecture | Internal 40MHz oscillator + external 40/50MHz crystal or clock input - allows BOM reduction via integrated timing while supporting precise jitter-sensitive interfaces like RGMII and LVDS. |
| Thermal & Environmental Robustness | Extended automotive temperature range (−40°C to +140°C) and qualified per AEC-Q100 Rev G - ensures reliable operation in engine bay, transmission, and ADAS sensor housings. |
Applications
| Automotive Audio Processing | Machine Vision Sensor Hub |
|---|---|
Use Scenario: Real-time multi-channel audio decoding, beamforming, and echo cancellation in premium vehicle infotainment head units. IC Role / Device Role / Timing Role: Primary application processor executing TI's Audio Framework on dual R5F cores while offloading FFT and filtering to C66x DSP. Use Value: 5.0MB on-chip RAM eliminates external DDR, reducing EMI and bill-of-material cost; dual MCAN enables seamless integration with vehicle bus for microphone array control and speaker diagnostics. | Use Scenario: Aggregating and pre-processing dual-camera feeds for driver monitoring or surround-view systems. IC Role / Device Role / Timing Role: MIPI CSI-2 receiver hub with DSP-accelerated image rectification, stitching, and object detection preprocessing before forwarding to central ADAS domain controller. Use Value: Two independent 4-lane MIPI receivers handle simultaneous 1080p@30fps streams; LVDS output provides low-jitter debug trace or direct connection to display/FPGA for real-time visualization. |
| Industrial Robotics Motion Control | Avionics Data Concentrator |
Use Scenario: High-precision servo drive coordination in collaborative robotic arms with safety-critical trajectory planning. IC Role / Device Role / Timing Role: Real-time motion controller running EtherCAT slave stack on R5F cores, using ePWM/eCAP for PWM generation and encoder capture, with HSM securing firmware updates. Use Value: Dual R5F lockstep mode supports ASIL-B functional safety; 9-channel GPADC monitors motor current/voltage/temperature with 625 Ksps sampling for predictive maintenance analytics. | Use Scenario: Consolidating ARINC 429, discrete I/O, and sensor data in regional aircraft cabin management systems. IC Role / Device Role / Timing Role: Time-synchronized data concentrator using RGMII Ethernet for backbone comms, MCAN for subsystem bridging, and UART/I2C for legacy avionics interfacing. Use Value: AEC-Q100 qualification validates reliability for extended MTBF; extended temperature range accommodates uncontrolled avionics bays; HSM enables secure configuration loading and flight log encryption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-core real-time MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TDA4VM | Higher-performance C7x DSP + dual Cortex-A72 + GPU; larger package (453-pin); higher power envelope. | Targeted at full ADAS perception stacks (vision + radar + AI), not just sensor preprocessing. | Select TDA4VM when AI inference acceleration, OpenGL ES graphics, or multi-camera + radar fusion is required - not for cost-optimized audio or motion control. |
| AM2634 | Quad Cortex-R5F (no DSP); identical AEC-Q100 Grade 1 rating; smaller 225-pin NZN package option. | Focused on deterministic real-time control (e.g., motor drives, battery management), lacking MIPI/LVDS imaging interfaces. | Choose AM2634 for pure control-dominant applications where DSP compute and camera connectivity are unnecessary - reduces BOM and layout complexity. |
Compared with TDA4VM and AM2634, AM2732ADRFGQZCERQ1 uniquely balances real-time R5F control, C66x DSP signal processing, MIPI CSI-2/LVDS imaging I/O, and automotive-grade security - making it optimal for mid-tier ADAS sensor hubs and audio domain controllers where cost, thermal envelope, and interface specificity matter.
Availability
AM2732ADRFGQZCERQ1 is available at Aetrix Electronics and suitable for automotive audio systems, machine vision sensor hubs, industrial robotics motion controllers, and avionics data concentrators requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for AM2732ADRFGQZCERQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal processing technologies, with deep expertise in automotive, industrial, and communications markets.
The AM273x product line was designed specifically for safety-critical, real-time embedded applications in automotive and industrial settings - integrating functional safety architecture, hardware security, and heterogeneous processing (R5F + C66x) to replace multi-chip solutions with a single scalable SoC.
FAQ
What is the maximum operating junction temperature for AM2732ADRFGQZCERQ1?
The AM2732ADRFGQZCERQ1 is qualified for extended automotive operation with a maximum junction temperature of +140°C, validated per AEC-Q100 Grade 1 specifications. This rating applies to the ZCE package variant and enables deployment in under-hood ECUs and high-ambient industrial enclosures without forced cooling.
Does AM2732ADRFGQZCERQ1 support CAN-FD, and how many instances are available?
Yes, AM2732ADRFGQZCERQ1 integrates two independent Modular Controller Area Network (MCAN) modules, both fully compliant with CAN-FD protocol (up to 5 Mbps data phase). Each module has dedicated TX/RX pins and supports ISO 11898-1:2015, enabling concurrent communication on separate vehicle networks such as powertrain and ADAS buses.
What package type and pin count does AM2732ADRFGQZCERQ1 use?
AM2732ADRFGQZCERQ1 uses the ZCE package: a 285-ball NanoFree™ ball grid array (nFBGA) with 13mm × 13mm body size and 0.65mm ball pitch. This package is distinct from the NZN (225-ball) variant and provides full peripheral access including dual MIPI CSI-2 receivers and 4-lane LVDS, as documented in TI's SWRS245D datasheet Figure 5-1.
Is AM2732ADRFGQZCERQ1 pin-compatible with other AM273x variants like AM2732ADRFGAZCER?
No, AM2732ADRFGQZCERQ1 is not pin-compatible with AM2732ADRFGAZCER. While both use the ZCE package, the "Q" suffix denotes automotive qualification (AEC-Q100 Grade 1) and may include different internal test configurations and screening - but more critically, the "Q" and non-"Q" variants share identical pinouts and ball maps per TI's device nomenclature guide in SWRS245D Section 9.1.
What development tools and software support are available for AM2732ADRFGQZCERQ1?
Texas Instruments provides comprehensive support for AM2732ADRFGQZCERQ1, including the AM273x GP EVM hardware, Processor SDK RTOS/Linux, TI-RTOS Kernel, C66x DSP library, and HALCoGen configuration tool. Software drivers, sample applications (e.g., MIPI CSI-2 capture, MCAN loopback), and API guides are hosted on ti.com and maintained in TI's official GitHub repositories.
AM2732ADRFGQZCERQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 285-LFBGA
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-R5F
- Number of Cores/Bus Width:
- 2 Core, 32-Bit
- Speed:
- 400MHz
- Co-Processors/DSP:
- C66x
- RAM Controllers:
- DDR
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- -
- Ethernet:
- 10/100Mbps (1)
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 140°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 285-NFBGA (13x13)
- Additional Interfaces:
- CANbus, EMIF, I2C, QSPI, SPI, UART/USART
AM2732ADRFGQZCERQ1 FAQ
1.How can I place an order for AM2732ADRFGQZCERQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for AM2732ADRFGQZCERQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AM2732ADRFGQZCERQ1 reliable?
The price and inventory of AM2732ADRFGQZCERQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM2732ADRFGQZCERQ1 is usually 5 days.
3.What payment methods are accepted for AM2732ADRFGQZCERQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM2732ADRFGQZCERQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AM2732ADRFGQZCERQ1?
AM2732ADRFGQZCERQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AM2732ADRFGQZCERQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AM2732ADRFGQZCERQ1?
For technical support, including AM2732ADRFGQZCERQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM2732ADRFGQZCERQ1 requirements.
6.How does Aetrix verify that AM2732ADRFGQZCERQ1 is sourced from the original manufacturer or authorized distributors?
All AM2732ADRFGQZCERQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM2732ADRFGQZCERQ1 meets industry standards.
7.What is the process for return or replacement of AM2732ADRFGQZCERQ1?
All AM2732ADRFGQZCERQ1 units undergo pre-shipment inspection (PSI). If there is an issue with AM2732ADRFGQZCERQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AM2732ADRFGQZCERQ1 part is unused and in its original packaging.
Return procedure for AM2732ADRFGQZCERQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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