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Texas Instruments AM2732CDRFHAZCER

Part No.:
AM2732CDRFHAZCER
Manufacturer:
Texas Instruments
Category:
Microcontrollers
Package:
285-LFBGA
Datasheet:
AetrixAM2732CDRFHAZCER.pdf
Description:
DUAL-CORE ARM CORTEX-R5F BASED M
Quantity:
Payment:
Payment
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Inventory:1,000

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Product details

Overview

AM2732CDRFHAZCER from Texas Instruments is a dual-core Arm® Cortex®-R5F + C66x DSP Sitara™ microcontroller in 285-pin nFBGA (ZCE), operating at up to 400MHz (R5F) and 550MHz (DSP), with 5.0MB on-chip RAM, dual MCAN with CAN-FD, and hardware security module (HSM) for secure boot and crypto acceleration - deployed in automotive audio and machine vision systems.

For engineers reviewing the AM2732CDRFHAZCER datasheet, AM2732CDRFHAZCER pinout, AM2732CDRFHAZCER application, or AM2732CDRFHAZCER equivalent, this page delivers verified package mapping (ZCE 285-pin nFBGA), confirmed dual-core real-time processing capability, functional safety support (ISO 26262 aid), automotive-grade temperature range (–40°C to 140°C), and HSM-based secure boot implementation.

Technical Context

The AM2732CDRFHAZCER integrates a dual-core Arm Cortex-R5F cluster (400MHz) with SECDED ECC on caches and TCM, plus a standalone C66x DSP core (550MHz, 17.6 GMAC), sharing 3.5625MB L3 memory and supporting independent or coordinated execution via mailbox IPC and 12-channel EDMA.

It features dual MCAN modules with CAN-FD compliance, 2× 4-lane MIPI D-PHY CSI-2.0 receivers, 4-lane LVDS/Aurora output, RGMII/RMII/MII Ethernet, and programmable HSM with RSA-4K/ECC-512 key management - all validated for extended automotive temperature operation (–40°C to 140°C).

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core Dual-core Arm Cortex-R5F @ 400MHz with 32KB I/D-cache per core and SECDED ECC on all memories
DSP Core Single C66x floating-point DSP @ 550MHz delivering 17.6 GMAC peak performance
On-Chip RAM 5.0MB total: 3.5625MB shared L3, 960KB dedicated to Main subsystem, 384KB to DSP subsystem
MCAN Interfaces 2× modular CAN-FD controllers supporting ISO 11898-1:2015, enabling high-speed deterministic vehicle networking
Security Module Embedded Hardware Security Module (HSM) with secure authenticated/encrypted boot, PKA, AES-256, TRNG, and customer-programmable root keys
Temperature Range Extended automotive grade: –40°C to +140°C junction temperature, AEC-Q100 qualified
Package 285-pin nFBGA (ZCE), 13mm × 13mm, 0.65mm pitch, compatible with industrial PCB assembly processes

Pinout & Package

AM2732CDRFHAZCER uses the ZCE 285-pin NanoFree™ ball grid array (nFBGA) package (13mm × 13mm, 0.65mm pitch), optimized for thermal performance and signal integrity in automotive and industrial applications. Pin functions are defined across MUXMODE 0–15 with configurable pull-up/down, hysteresis, and I/O voltage options (1.8V/3.3V).

Pin/Terminal Circuit Role Design Meaning
ADC1–ADC9 Analog input (9-channel) Supports up to 625Ksps sampling; each pin maps to dedicated GPADC channel with 1.8V I/O domain
CSI2_RX0CLKP/M, CSI2_RX0P0–P3, M0–M3 MIPI D-PHY CSI-2.0 receiver lanes Two independent 4-lane receivers (CSI2_RX0/CSI2_RX1); differential pairs require matched trace lengths and 100Ω termination
LVDS_CLKP/M, LVDS_FRCLKP/M, LVDS_TXP0–P3, TXM0–M3 LVDS/Aurora high-speed output interface 4-lane LVDS output with frame clock; supports debug streaming or sensor data offload at >1Gbps aggregate bandwidth
MSS_RGMII_RD0–RD3, TD0–TD3, RCLK, TCLK, RCTL, TCTL RGMII Ethernet physical interface 10/100Mbps Ethernet PHY interface; requires external magnetics and 50Ω impedance-controlled routing
MSS_MCANA_TX/RX, MSS_MCANB_TX/RX CAN-FD transceiver interface Dual isolated CAN-FD channels; each pair connects directly to external CAN transceivers (e.g., TCAN1044-Q1)

Key Features

Feature Design Value
Dual-core R5F with lockstep option Enables ASIL-D capable safety mechanisms via dual-core lockstep mode with error detection and recovery
HSM with cryptographic accelerators Offloads AES-256 encryption, ECC-512 signing, and TRNG generation from main CPU - reducing boot time and runtime overhead
Integrated 5.0MB SRAM with ECC Eliminates need for external RAM in many real-time control and vision preprocessing applications, lowering BOM cost and board area
MIPI CSI-2 + LVDS co-processing path Enables direct sensor-to-DSP pipeline: camera input via CSI-2 → DSP preprocessing → LVDS output to display or FPGA
Functional safety documentation support TI provides ISO 26262 system-level documentation aids (FMEDA, safety manual, diagnostic coverage analysis) for automotive integration

Applications

Automotive Audio Processing Machine Vision Edge Node

Use Scenario: Real-time multi-zone audio rendering with echo cancellation and active noise control in premium vehicle cabins.

IC Role / Device Role / Timing Role: Dual-core R5F handles OS and middleware; C66x DSP executes low-latency audio algorithms with deterministic timing under 50μs jitter.

Use Value: On-die 5.0MB RAM eliminates external DDR, reducing EMI and power consumption while meeting ASIL-B timing constraints.

Use Scenario: High-speed inspection of moving parts using two synchronized cameras feeding into real-time defect classification.

IC Role / Device Role / Timing Role: CSI-2 receivers ingest dual 4-lane camera streams; DSP performs convolutional inference; LVDS outputs processed frames to display/FPGA.

Use Value: Integrated MIPI CSI-2 + DSP + LVDS avoids bridge ICs and interposer latency, enabling sub-10ms end-to-end pipeline delay.

Industrial Robotics Control Avionics Sensor Hub

Use Scenario: Coordinating multi-axis servo drives and safety-critical motion planning in collaborative robotic arms.

IC Role / Device Role / Timing Role: R5F cores run real-time motion control stack (EtherCAT master, trajectory planner); ePWM/eCAP manage precise motor phase timing.

Use Value: Dual R5F with shared TCM enables tight coupling between safety monitor and control executor - meeting SIL3 response time requirements.

Use Scenario: Aggregating inertial, pressure, and environmental sensor data for flight control system health monitoring.

IC Role / Device Role / Timing Role: MCU subsystem manages sensor polling and CAN-FD telemetry; HSM signs critical health packets before transmission.

Use Value: AEC-Q100 qualification and –40°C to +140°C operation ensure reliability in uncontrolled avionics bays without forced cooling.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-core real-time microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
AM2732ADRFGAZCER ZCE package, non-automotive grade (industrial temp: –40°C to +105°C); identical core, memory, and peripheral configuration Suitable for industrial automation where extended automotive temperature range is not required Select when cost sensitivity outweighs need for AEC-Q100 qualification and 140°C operation
AM2732CDRFHQZCERQ1 NZN 225-pin nFBGA (13mm × 13mm, 0.80mm pitch); same automotive qualification but reduced pin count and no MIPI CSI-2 or LVDS interfaces Targeted at space-constrained automotive body electronics without camera/display connectivity Choose for footprint reduction where MIPI/LVDS and dual-camera support are unnecessary

Compared with AM2732ADRFGAZCER, the AM2732CDRFHAZCER adds AEC-Q100 qualification and extended temperature support; compared with AM2732CDRFHQZCERQ1, it retains full ZCE feature set including MIPI CSI-2 and LVDS - making it the only variant supporting dual-camera machine vision in automotive environments.

Availability

AM2732CDRFHAZCER is available at Aetrix Electronics and suitable for automotive audio systems, machine vision edge nodes, industrial robotics controllers, and avionics sensor hubs requiring stable component supply across long production lifecycles.

Supply support for AM2732CDRFHAZCER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with leadership in automotive, industrial, and communications markets.

The AM273x product line targets safety-critical, real-time embedded applications in automotive and industrial domains - combining dual R5F cores, DSP acceleration, hardware security, and functional safety support in a single SoC.

FAQ

What is the operating temperature range for AM2732CDRFHAZCER?

The AM2732CDRFHAZCER is qualified for extended automotive temperature operation from –40°C to +140°C (junction temperature), meeting AEC-Q100 Grade 0 requirements. This rating is validated per TI's production test flow and applies to the full ZCE package variant. The AM2732CDRFHAZCER datasheet specifies thermal resistance characteristics for the ZCE285A package to support board-level thermal design.

Does AM2732CDRFHAZCER support CAN-FD, and how many interfaces are available?

Yes, the AM2732CDRFHAZCER integrates two fully independent Modular Controller Area Network (MCAN) modules, both compliant with CAN-FD (ISO 11898-1:2015). Each module supports bit rates up to 5 Mbps in FD mode and includes dedicated message RAM, FIFOs, and loopback/self-test modes - enabling robust vehicle network communication without external CAN controllers.

What package type and pin count does AM2732CDRFHAZCER use?

The AM2732CDRFHAZCER uses the ZCE 285-pin NanoFree™ ball grid array (nFBGA) package, measuring 13.0mm × 13.0mm with 0.65mm ball pitch. This package is documented in TI's SWRS245D datasheet Section 11 and supports full peripheral access including MIPI CSI-2, LVDS, RGMII, and dual MCAN - distinguishing it from the smaller NZN 225-pin variant.

How does the Hardware Security Module (HSM) in AM2732CDRFHAZCER function?

The AM2732CDRFHAZCER embeds a programmable Hardware Security Module (HSM) that enables secure authenticated and encrypted boot, customer-programmable root keys, symmetric (AES-256) and asymmetric (RSA-4K/ECC-512) crypto acceleration, and TRNG/DRBG. The HSM operates independently of the main R5F cores and enforces secure key revocation - a requirement for UNECE R155 compliance in automotive ECUs.

Is AM2732CDRFHAZCER pin-compatible with other AM273x variants?

No - the AM2732CDRFHAZCER (ZCE package) is not pin-compatible with NZN-package variants like AM2732CDRFHQZCERQ1. While both share the same die, the ZCE 285-pin layout includes dedicated balls for MIPI CSI-2, LVDS, and additional GPIOs absent in the 225-pin NZN footprint. Board designs must be re-routed when switching between ZCE and NZN packages.

AM2732CDRFHAZCER Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
285-LFBGA
Series:
Sitara™
Packaging:
Tape & Reel (TR)
Product Status:
Active
Programmable:
-
Core Processor:
ARM® Cortex®-R5F
Core Size:
32-Bit Dual-Core
Speed:
400MHz
Connectivity:
CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
Peripherals:
AES, DMA, POR, PWM, SHA, TRNG, WDT
Number of I/O:
-
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
Tightly Coupled Memory (TCM)
EEPROM Size:
-
RAM Size:
3.6M x 8
Voltage - Supply (Vcc/Vdd):
1.71V ~ 1.89V, 3.135V ~ 3.465V
Data Converters:
A/D 9x10b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

AM2732CDRFHAZCER FAQ

1.How can I place an order for AM2732CDRFHAZCER through Aetrix?

Please submit a Request for Quotation (RFQ) for AM2732CDRFHAZCER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AM2732CDRFHAZCER reliable?

The price and inventory of AM2732CDRFHAZCER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM2732CDRFHAZCER is usually 5 days.

3.What payment methods are accepted for AM2732CDRFHAZCER?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM2732CDRFHAZCER transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AM2732CDRFHAZCER?

AM2732CDRFHAZCER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AM2732CDRFHAZCER order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AM2732CDRFHAZCER?

For technical support, including AM2732CDRFHAZCER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM2732CDRFHAZCER requirements.

6.How does Aetrix verify that AM2732CDRFHAZCER is sourced from the original manufacturer or authorized distributors?

All AM2732CDRFHAZCER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM2732CDRFHAZCER meets industry standards.

7.What is the process for return or replacement of AM2732CDRFHAZCER?

All AM2732CDRFHAZCER units undergo pre-shipment inspection (PSI). If there is an issue with AM2732CDRFHAZCER, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AM2732CDRFHAZCER part is unused and in its original packaging.

Return procedure for AM2732CDRFHAZCER:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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