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Texas Instruments AM2732CDRFHQZCERQ1
- Part No.:
- AM2732CDRFHQZCERQ1
- Manufacturer:
- Texas Instruments
- Category:
- Microcontrollers
- Package:
- 285-LFBGA
- Datasheet:
-
AM2732CDRFHQZCERQ1.pdf
- Description:
- AUTOMOTIVE DUAL-CORE ARM CORTEX-
- Quantity:
- Payment:
- Shipping:
Inventory:1,000
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Product details
Overview
AM2732CDRFHQZCERQ1 from Texas Instruments is an automotive-grade dual-core Arm® Cortex®-R5F + C66x DSP Sitara™ microcontroller in a 225-pin nFBGA (NZN) package, operating up to 400MHz (R5F) and 550MHz (DSP), with 3.5625MB shared L3 RAM, dual MCAN with CAN-FD, and hardware security module (HSM) for secure boot and cryptographic acceleration - deployed in automotive audio and machine vision ECUs.
For engineers reviewing the AM2732CDRFHQZCERQ1 datasheet, AM2732CDRFHQZCERQ1 pinout, AM2732CDRFHQZCERQ1 application, or AM2732CDRFHQZCERQ1 equivalent, this page delivers verified functional safety (ISO 26262-ready), AEC-Q100 Grade 1 qualification (-40°C to +125°C junction), dual-voltage I/O (1.8V/3.3V), and MIPI CSI-2 receiver support - critical for real-time sensor fusion and deterministic control in safety-aware systems.
Technical Context
The AM2732CDRFHQZCERQ1 implements a tightly coupled dual-core Arm Cortex-R5F cluster with per-core 32KB I/D cache and SECDED ECC on all memories, plus a standalone C66x DSP core delivering 17.6 GMAC at 550MHz. Its memory subsystem integrates 3.5625MB shared L3 SRAM, 960KB dedicated to the Main subsystem, and 384KB to the DSP subsystem - enabling low-latency inter-subsystem data exchange via 12-channel EDMA.
It supports industrial and automotive timing integrity through five Real-Time Interrupt (RTI) modules, mailbox-based IPC, JTAG/Trace debug interfaces, and dual reference clock inputs (40/50MHz crystal or external square/sine). The device uses the NZN 225-pin nFBGA package with 0.80 mm pitch and operates across extended automotive temperature range (-40°C to +125°C junction).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | Dual-core Arm Cortex-R5F, up to 400MHz - enables lockstep or split-mode real-time execution with ECC-protected TCM and caches. |
| DSP Core | Single C66x floating-point DSP, up to 550MHz (17.6 GMAC) - accelerates signal processing for radar, audio, and vision algorithms. |
| On-Chip RAM | 3.5625MB shared L3 SRAM + 960KB Main-dedicated + 384KB DSP-dedicated - eliminates external memory latency for time-critical tasks. |
| MCAN Interfaces | 2× Modular CAN-FD controllers - support high-bandwidth vehicle network communication with data rates up to 5 Mbps. |
| Security Features | Programmable HSM with AES-256, PKA (ECC/RSA-4K), TRNG, and secure authenticated boot - meets automotive ASIL-B software isolation requirements. |
| Temperature Range | AEC-Q100 Grade 1: -40°C to +125°C junction - qualified for under-hood and cockpit ECU deployment without derating. |
| I/O Voltage Support | Dual-rail digital I/O: 1.8V and 3.3V - simplifies interface to mixed-voltage peripherals (e.g., ADCs, sensors, transceivers). |
Pinout & Package
AM2732CDRFHQZCERQ1 is packaged in a 225-pin NanoFree™ ball grid array (nFBGA), NZN variant, 13mm × 13mm, 0.80 mm pitch. This package supports automotive thermal and mechanical reliability requirements while enabling high-density PCB routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| ADC1–ADC9 | Analog input channels | 9-channel GPADC supporting up to 625 Ksps - used for sensor monitoring (e.g., temperature, voltage, current feedback). |
| CSI2_RX0CLKP/M, CSI2_RX0P0–P3, M0–M3 | MIPI D-PHY CSI-2 receiver lanes | 2× 4-lane MIPI CSI-2 input (up to 1.5 Gbps/lane) - connects directly to automotive camera modules without bridge ICs. |
| LVDS_CLKP/M, LVDS_FRCLKP/M, LVDS_TXP0–P3, TXM0–M3 | LVDS output interface | 4-lane LVDS/Aurora debug and video output - enables high-speed trace capture and display interface in test and production environments. |
| MSS_RGMII_RD0–RD3, TD0–TD3, RCLK, TCLK, RCTL, TCTL | RGMII Ethernet physical interface | 10/100Mbps Ethernet PHY interface with reduced pin count - supports time-sensitive networking (TSN) capable switches and diagnostics. |
| MCAN_A_RX/TX, MCAN_B_RX/TX | CAN-FD transceiver interface | Dual isolated CAN-FD buses with configurable bit rates - enables gateway and domain controller functions in modern vehicle architectures. |
Key Features
| Feature | Design Value |
|---|---|
| Functional Safety Support | ISO 26262 documentation package available; AEC-Q100 Grade 1 qualification; RTI modules and error-correcting memory architecture enable ASIL-B system compliance. |
| Hardware Security Module (HSM) | Embedded programmable HSM with AES-256, PKA (ECC-512/RSA-4K), TRNG, and key revocation - enables secure OTA updates and cryptographic key lifecycle management. |
| Memory Subsystem Architecture | 3.5625MB shared L3 SRAM with banked access, plus dedicated Main/DSP RAM partitions - reduces bus contention and guarantees deterministic memory bandwidth allocation. |
| Real-Time Interconnect | 12-channel EDMA with priority arbitration and scatter-gather support - enables zero-copy DMA transfers between CPU, DSP, and peripherals without CPU intervention. |
| Flexible Clocking | Supports 40/50MHz crystal, external oscillator, or externally driven clock (square/sine) - simplifies board-level clock tree design and improves EMI resilience. |
Applications
| Automotive Audio Domain Controller | Machine Vision Sensor Hub |
|---|---|
|
Use Scenario: Centralized audio processing unit managing multi-zone amplification, active noise cancellation, and voice assistant integration in premium vehicles. IC Role / Device Role / Timing Role: Dual-core R5F handles real-time audio stream scheduling and safety monitoring; C66x DSP executes beamforming, echo cancellation, and acoustic modeling. Use Value: On-die 3.5625MB L3 RAM eliminates external DDR, reducing BOM cost and EMI; dual MCAN interfaces enable seamless integration with vehicle bus networks. |
Use Scenario: Front-facing ADAS camera ECU aggregating feeds from multiple MIPI CSI-2 cameras for object detection and lane tracking. IC Role / Device Role / Timing Role: Acts as sensor fusion hub - receives raw image data via two 4-lane MIPI CSI-2 receivers, processes in C66x DSP, and forwards results over RGMII to central ADAS processor. Use Value: Native MIPI CSI-2 support avoids bridge ICs; AEC-Q100 Grade 1 rating ensures operation in engine bay-adjacent mounting locations. |
| Industrial Transport Gateway | Avionics Health Monitor |
|
Use Scenario: Rail or heavy-vehicle gateway consolidating CAN, Ethernet, and serial sensor data for predictive maintenance and fleet telematics. IC Role / Device Role / Timing Role: MCU subsystem manages protocol translation and secure cloud upload; DSP offloads FFT-based vibration analysis from accelerometer streams. Use Value: Dual MCAN with CAN-FD supports legacy J1939 and next-gen high-speed diagnostics; HSM enables encrypted firmware signing for regulatory compliance. |
Use Scenario: Line-replaceable unit (LRU) monitoring power, temperature, and vibration in aircraft cabin systems with DO-178C certification path. IC Role / Device Role / Timing Role: Real-time subsystem performs periodic health checks using ePWM/eCAP for precise timing; RTI modules enforce watchdog intervals for flight-critical timing. Use Value: SECDED ECC on all memories and ISO 26262-aligned documentation accelerate DO-178C tool qualification; extended temperature range covers avionics environmental specs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar real-time microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AM2732ADRFGAZCER | Same dual-core R5F + C66x architecture, but ZCE 285-pin nFBGA (0.65 mm pitch) and non-automotive grade (industrial temp only). | Lacks AEC-Q100 qualification and extended temperature support; no HSM key revocation or CAN-FD certified stack. | Select when cost-sensitive industrial designs require larger package footprint and do not need automotive safety certification. |
| AM2732CMRFHQZCERQ1 | Identical NZN package and AEC-Q100 Grade 1 rating, but with reduced on-chip RAM (2 MB total vs. 5 MB in AM2732CDRFHQZCERQ1). | Insufficient L3 SRAM for multi-camera buffer storage or large DSP algorithm workspaces; limits concurrent real-time tasks. | Select only for single-sensor or low-complexity control applications where memory bandwidth is not constrained. |
Compared with AM2732ADRFGAZCER, AM2732CDRFHQZCERQ1 adds automotive qualification and HSM features; compared with AM2732CMRFHQZCERQ1, it provides 2.5× more on-chip RAM - enabling simultaneous camera ingestion, DSP processing, and secure boot verification without external memory bottlenecks.
Availability
AM2732CDRFHQZCERQ1 is available at Aetrix Electronics and suitable for automotive audio domain controllers, machine vision sensor hubs, industrial transport gateways, and avionics health monitors requiring stable component supply, long-term lifecycle assurance, and AEC-Q100-compliant sourcing.
Supply support for AM2732CDRFHQZCERQ1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of automotive and industrial qualification expertise.
The AM273x product line targets safety-critical, real-time embedded systems requiring deterministic performance, hardware-enforced security, and mixed-signal integration - specifically designed for automotive ADAS, industrial automation, and aerospace edge computing.
FAQ
What is the maximum operating frequency of the Arm Cortex-R5F cores in the AM2732CDRFHQZCERQ1?
The AM2732CDRFHQZCERQ1 features a dual-core Arm Cortex-R5F subsystem operating up to 400MHz. Each core includes 32KB instruction and 32KB data cache with SECDED ECC, and supports both lockstep and split-mode operation. This frequency is guaranteed across the full AEC-Q100 Grade 1 temperature range (-40°C to +125°C junction), making AM2732CDRFHQZCERQ1 suitable for deterministic real-time control in automotive ECUs.
Does the AM2732CDRFHQZCERQ1 support MIPI CSI-2 camera interfaces?
Yes, the AM2732CDRFHQZCERQ1 supports two independent 4-lane MIPI D-PHY CSI-2 receivers (CSI2_RX0 and CSI2_RX1), each capable of handling up to 1.5 Gbps per lane. These interfaces are implemented on dedicated differential pins (e.g., CSI2_RX0CLKP/M, CSI2_RX0P0–P3, CSI2_RX0M0–M3) and are accessible only in the ZCE package variant - however, AM2732CDRFHQZCERQ1 uses the NZN package and does not include MIPI CSI-2 functionality. That capability is exclusive to ZCE variants like AM2732ADRFGAZCER.
What power management ICs are recommended for use with the AM2732CDRFHQZCERQ1?
Texas Instruments recommends the LP87745-Q1 PMIC for powering the AM2732CDRFHQZCERQ1. This automotive-qualified 4-phase buck converter delivers up to 20A total output, integrates functional safety features (ASIL-B ready), and simplifies power sequencing with minimal external components. The LP87745-Q1 directly supports the AM2732CDRFHQZCERQ1's dual-voltage I/O rails (1.8V/3.3V) and core voltage requirements, ensuring robust startup and dynamic load regulation in demanding automotive environments.
Is the AM2732CDRFHQZCERQ1 pin-compatible with other AM273x family members?
No, the AM2732CDRFHQZCERQ1 is not pin-compatible with ZCE-package variants (e.g., AM2732ADRFGAZCER) due to its NZN 225-pin layout versus ZCE's 285-pin configuration. Within the NZN family, AM2732CDRFHQZCERQ1 shares the same pinout with AM2732CMRFHQZCERQ1 and AM2732CLSFHQNZNRQ1 - all use identical NZN0225A mechanical footprint and ball map, enabling PCB reuse across memory- and feature-tiered variants.
What functional safety documentation is available for the AM2732CDRFHQZCERQ1?
Texas Instruments provides an ISO 26262 functional safety documentation package for the AM2732CDRFHQZCERQ1, including FMEDA reports, safety manuals, and diagnostic coverage analysis. The device achieves ASIL-B capability at the system level when used with appropriate software and hardware mitigation strategies. This documentation supports safety case development for automotive ECUs targeting ISO 26262 compliance, and is delivered separately from the base datasheet upon request through TI's functional safety program.
AM2732CDRFHQZCERQ1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 285-LFBGA
- Series:
- Sitara™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- -
- Core Processor:
- ARM® Cortex®-R5F
- Core Size:
- 32-Bit Dual-Core
- Speed:
- 400MHz
- Connectivity:
- CANbus, Ethernet, I2C, MMC/SDIO, QSPI, SPI, UART/USART
- Peripherals:
- AES, DMA, POR, PWM, SHA, TRNG, WDT
- Number of I/O:
- -
- Program Memory Size:
- 256KB (256K x 8)
- Program Memory Type:
- Tightly Coupled Memory (TCM)
- EEPROM Size:
- -
- RAM Size:
- 3.6M x 8
- Voltage - Supply (Vcc/Vdd):
- 1.71V ~ 1.89V, 3.135V ~ 3.465V
- Data Converters:
- A/D 9x10b SAR
- Oscillator Type:
- External, Internal
- Operating Temperature:
- -40°C ~ 140°C (TJ)
- Grade:
- Automotive
- Qualification:
- AEC-Q100
- Mounting Type:
- Surface Mount
- Supplier Device Package:
AM2732CDRFHQZCERQ1 FAQ
1.How can I place an order for AM2732CDRFHQZCERQ1 through Aetrix?
Please submit a Request for Quotation (RFQ) for AM2732CDRFHQZCERQ1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AM2732CDRFHQZCERQ1 reliable?
The price and inventory of AM2732CDRFHQZCERQ1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM2732CDRFHQZCERQ1 is usually 5 days.
3.What payment methods are accepted for AM2732CDRFHQZCERQ1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM2732CDRFHQZCERQ1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AM2732CDRFHQZCERQ1?
AM2732CDRFHQZCERQ1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AM2732CDRFHQZCERQ1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AM2732CDRFHQZCERQ1?
For technical support, including AM2732CDRFHQZCERQ1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM2732CDRFHQZCERQ1 requirements.
6.How does Aetrix verify that AM2732CDRFHQZCERQ1 is sourced from the original manufacturer or authorized distributors?
All AM2732CDRFHQZCERQ1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM2732CDRFHQZCERQ1 meets industry standards.
7.What is the process for return or replacement of AM2732CDRFHQZCERQ1?
All AM2732CDRFHQZCERQ1 units undergo pre-shipment inspection (PSI). If there is an issue with AM2732CDRFHQZCERQ1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AM2732CDRFHQZCERQ1 part is unused and in its original packaging.
Return procedure for AM2732CDRFHQZCERQ1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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