Texas Instruments AM3352BZCE30R

Overview

AM3352BZCE30R from Texas Instruments is a 600-MHz ARM Cortex-A8-based Sitara™ processor with 256KB L2 cache (ECC), 8-channel 12-bit SAR ADC, dual 10/100/1000-Mbps Ethernet MACs (1-port enabled in ZCE package), and PRU-ICSS supporting EtherCAT and PROFINET for industrial real-time control. It integrates PowerVR SGX530 graphics, USB 2.0 DRD, and GPMC for NAND/NOR/SRAM interfacing.

For engineers reviewing the AM3352BZCE30R datasheet, AM3352BZCE30R pinout, AM3352BZCE30R application, or AM3352BZCE30R equivalent, key selection criteria include its 298-ball NFBGA (ZCE) package, -40°C to 105°C industrial temperature rating, 64KB OCMC RAM, DDR3/DDR2/mDDR support, and PRU-ICSS I/O pin limitations versus ZCZ variants.

Technical Context

The AM3352BZCE30R implements a single-core ARM Cortex-A8 CPU with NEON SIMD coprocessor, 32KB L1 instruction and 32KB L1 data cache (parity-protected), and 256KB L2 cache with ECC. Its PRU-ICSS contains two 200-MHz programmable real-time units with 8KB instruction RAM, 8KB data RAM, and 12KB shared RAM-enabling deterministic industrial protocol stacks independent of the ARM core.

Power management includes SmartReflex Class 2B adaptive voltage scaling, five ADPLLs for clock generation, and three switchable power domains (MPU, GFX, PER). The device supports IEEE 1588v1 PTP via its dual EMACs and features a 24-bit LCD controller with DMA-driven raster engine and integrated touch-screen controller.

Key Specifications

Pinout & Package

AM3352BZCE30R uses a 298-ball NFBGA (ZCE) package with 0.65-mm ball pitch and 13.0 mm × 13.0 mm body size. Pin functions are defined per TI SPRS717L Section 4.1.1 (ZCE Pin Map).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM-based industrial processor applications.

Compared with AM3354BZCE30R, the AM3352BZCE30R delivers 2× CPU performance and functional PRU-ICSS I/O for industrial protocols; compared with AM3352BZCZ60R, it trades pin count and dual-EMAC capability for smaller footprint and lower thermal density in space-constrained enclosures.

Availability

AM3352BZCE30R is available at Aetrix Electronics and suitable for industrial automation, smart energy metering, and human-machine interface applications requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for AM3352BZCE30R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets since 1930.

The AM335x Sitara™ processor family targets industrial automation and human-machine interface applications, combining ARM Cortex-A8 performance with programmable real-time units and industrial protocol acceleration to replace FPGA+MCU combinations.

FAQ

What is the maximum operating frequency of the AM3352BZCE30R?

The AM3352BZCE30R is rated for 600 MHz operation per TI SPRS717L revision L. This frequency is validated across the full -40°C to +105°C industrial temperature range and corresponds to 1200 MIPS performance. Silicon revision 2.x supports this speed; earlier revisions are limited to 500 MHz or 600 MHz depending on lot date.

Does the AM3352BZCE30R support dual Ethernet interfaces?

The AM3352BZCE30R silicon includes two EMAC peripherals, but only one is routed to package balls in the ZCE variant per Table 3-1 and Section 4.1.1 of SPRS717L. The second EMAC remains unconnected; dual Ethernet requires the ZCZ package (e.g., AM3352BZCZ60R) with full pinout.

How many PRU-ICSS I/O pins are accessible on the AM3352BZCE30R?

The AM3352BZCE30R exposes a limited subset of PRU-ICSS I/O pins due to ZCE package constraints. Per TI documentation, only basic industrial protocol support is enabled - sufficient for single-port EtherCAT or PROFINET slave operation, but not full multi-protocol or high-pin-count implementations requiring the ZCZ variant.

What memory types does the AM3352BZCE30R support via its EMIF?

The AM3352BZCE30R supports mDDR (LPDDR), DDR2, DDR3, and DDR3L through its 16-bit external memory interface, with clock rates up to 200 MHz (mDDR), 266 MHz (DDR2), and 400 MHz (DDR3/DDR3L). Total addressable space is 1 GB, configurable for one x16 or two x8 memory devices.

Is secure boot enabled by default on the AM3352BZCE30R?

Secure boot is an optional feature on the AM3352BZCE30R that requires custom engagement with Texas Instruments during part ordering. The hardware accelerators (AES-256, SHA-256, RNG) are present, but boot ROM behavior defaults to standard unauthenticated boot unless factory-programmed fuse bits are set during manufacturing.