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Texas Instruments AM3352BZCEA30

Part No.:
AM3352BZCEA30
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
298-LFBGA
Datasheet:
AetrixAM3352BZCEA30.pdf
Description:
IC MPU SITARA 300MHZ 298NFBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,533

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Product details

Overview

AM3352BZCEA30 from Texas Instruments is a 600-MHz ARM Cortex-A8-based Sitara™ processor with 256KB L2 cache (ECC), 8-channel 12-bit SAR ADC, dual 10/100/1000-Mbps Ethernet MACs (1-port enabled in ZCE package), and PRU-ICSS supporting EtherCAT and PROFINET for industrial real-time control. It integrates PowerVR SGX530 graphics, USB 2.0 DRD, and GPMC for NAND/NOR/SRAM interfacing.

For engineers reviewing the AM3352BZCEA30 datasheet, AM3352BZCEA30 pinout, AM3352BZCEA30 application, or AM3352BZCEA30 equivalent, key selection criteria include its 298-ball NFBGA (ZCE) package, -40°C to 105°C industrial temperature rating, 64KB OCMC RAM, DDR3/DDR2/mDDR interface, and PRU-ICSS programmability for deterministic I/O offload.

Technical Context

The AM3352BZCEA30 implements a dual-core PRU-ICSS subsystem with two 200-MHz RISC processors, 8KB instruction/data RAM (parity), and 12KB shared RAM (parity), enabling independent real-time protocol stacks like EtherCAT without CPU intervention. Its MPU subsystem delivers 1200 MIPS at 600 MHz with NEON SIMD, L1/L2 cache hierarchy, and adaptive voltage scaling (AVS) via SmartReflex™ Class 2B.

It supports IEEE 1588v1 PTP timing synchronization, dual eHRPWM modules (6 outputs), three eQEP interfaces for motor position feedback, and a 24-bit LCD controller with DMA-driven raster engine - all accessible through a unified memory architecture with hardware mailbox and spinlock IPC between Cortex-A8, PRU-ICSS, and PRCM.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Core ARM Cortex-A8 @ 600 MHz; delivers 1200 MIPS for Linux-capable HLOS execution
L2 Cache 256KB with ECC; prevents silent data corruption in safety-critical industrial firmware
ADC 8-channel 12-bit SAR @ 200 kSPS; supports resistive touch screen (4-/5-/8-wire) and analog sensor inputs
Ethernet 1 × 10/100/1000-Mbps EMAC (MII/RMII/RGMII); single-port in ZCE package enables compact industrial gateway designs
PRU-ICSS Two 200-MHz PRUs with 12KB shared RAM; runs EtherCAT slave stack independently of ARM core
Memory Interface 16-bit DDR2/DDR3/mDDR @ 266/400 MHz data rate; 1GB address space supports LPDDR-400 for low-power operation
Package 298-ball NFBGA (ZCE), 0.65-mm pitch, 13.0 mm × 13.0 mm; optimized for thermal performance in sealed enclosures

Pinout & Package

The AM3352BZCEA30 uses a 298-pin S-PBGA-N298 Via Channel package (ZCE suffix) with 0.65-mm ball pitch and 13.0 mm × 13.0 mm body size. Thermal resistance θJA is 27.5°C/W (JEDEC High-K board).

Pin/Terminal Circuit Role Design Meaning
VDD_CORE MPU Core Power Supply 1.1-V nominal supply; requires tight regulation (±3%) for stable 600-MHz operation
DDR_A0–DDR_A15 DDR Address Bus 16-bit address lines for 1GB external memory mapping; routed with length-matched traces
MII1_RX_DV / MII1_TX_EN Ethernet Data Valid / Transmit Enable Signals for 10/100-Mbps MII mode; used in industrial gateways with external PHY
AIN0–AIN7 Analog Input Channels Eight single-ended or four differential ADC inputs; support 0–1.8-V range with internal reference
PRU0_R30 / PRU1_R30 PRU General-Purpose I/O Dedicated pins for PRU-ICSS real-time GPIO; configurable as fast edge-triggered interrupts or PWM outputs

Key Features

Feature Design Value
PRU-ICSS Programmability Enables custom industrial protocol stacks (e.g., EtherCAT slave) without ARM core involvement or OS latency
SmartReflex™ Class 2B Real-time adaptive voltage scaling based on die temperature and process variation; reduces dynamic power by up to 25%
Hardware Crypto Acceleration AES-128/256, SHA-1/256, and RNG engines accelerate secure boot and encrypted communications
Unified Memory Architecture Single virtual address space across Cortex-A8, PRU-ICSS, and peripherals; simplifies driver development and DMA setup
Industrial Temperature Range -40°C to +105°C operation validated; supports deployment in uncontrolled factory environments

Applications

Industrial PLC Controller Human-Machine Interface (HMI)

Use Scenario: Compact DIN-rail-mounted programmable logic controller executing ladder logic and fieldbus communication.

IC Role / Device Role / Timing Role: Main application processor running real-time Linux with PRU-ICSS handling CANopen or EtherCAT I/O scanning at ≤1-ms cycle times.

Use Value: Single-chip integration of ARM application processing and deterministic PRU real-time I/O eliminates dual-processor complexity and inter-processor latency.

Use Scenario: Touch-enabled operator panel with 7-inch TFT display and local data logging.

IC Role / Device Role / Timing Role: Graphics and UI processor driving 24-bit RGB LCD via integrated raster controller and DMA engine; ADC reads resistive touchscreen coordinates.

Use Value: On-chip LCD controller and 12-bit ADC eliminate external display driver and touch controller ICs, reducing BOM cost and PCB area.

Smart Energy Gateway Automated Test Equipment (ATE)

Use Scenario: Utility-grade metering gateway aggregating Modbus RTU data from smart meters over RS-485 and forwarding via Ethernet.

IC Role / Device Role / Timing Role: Dual-role device managing USB host (for firmware updates) and Ethernet client/server (for cloud telemetry), with UARTs configured for isolated RS-485 transceivers.

Use Value: Six UARTs with full modem control and IrDA/CIR support enable simultaneous legacy serial and modern IP connectivity without external bridge ICs.

Use Scenario: Benchtop test instrument requiring precise timing capture, waveform generation, and analog stimulus/response measurement.

IC Role / Device Role / Timing Role: Real-time signal processor using eQEP for encoder-based motion control, eHRPWM for calibrated analog output, and 12-bit ADC for input sampling at 200 kSPS.

Use Value: Integrated high-resolution PWM, quadrature encoder, and SAR ADC provide sub-microsecond timing alignment without FPGA or external timing ASIC.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM-based industrial processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
AM3354BZCZA30 324-ball ZCZ package; supports dual Ethernet ports and full PRU-ICSS I/O pinout; rated for -40°C to 90°C Requires larger PCB footprint and different thermal layout; enables dual-EMAC redundancy or separate control/data networks Select when dual-gigabit Ethernet or extended PRU peripheral access is required; not drop-in compatible due to package and pinout differences
AM3356BZCZA30 Same ZCZ package as AM3354 but operates at 600 MHz with full PRU-ICSS I/O and dual Ethernet; identical temperature range (-40°C to 90°C) Offers same peripheral count as AM3354 but with higher thermal margin for fanless enclosures Choose for designs needing full peripheral access and dual Ethernet in ZCZ package; requires PCB redesign from ZCE

Compared with AM3352BZCEA30, AM3354BZCZA30 and AM3356BZCZA30 provide dual Ethernet and expanded PRU I/O but require larger 324-ball packages and different thermal management - making AM3352BZCEA30 optimal for space-constrained, single-port industrial controllers operating across extended temperature ranges.

Availability

AM3352BZCEA30 is available at Aetrix Electronics and suitable for industrial automation, smart energy gateways, and human-machine interface applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for AM3352BZCEA30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in industrial and automotive markets.

The AM335x Sitara™ processor family targets industrial automation and human-machine interface applications, combining ARM Cortex-A8 performance with programmable real-time units (PRU-ICSS) for deterministic protocol offload and fieldbus interoperability.

FAQ

What is the maximum operating frequency of the AM3352BZCEA30?

The AM3352BZCEA30 is rated for 600 MHz operation per the official AM335x datasheet SPRS717L. This frequency is validated across the full industrial temperature range (-40°C to +105°C) and corresponds to 1200 MIPS performance. Silicon revision 2.x supports this speed; earlier revisions are limited to 500 MHz or 600 MHz depending on lot.

Does the AM3352BZCEA30 support dual Ethernet MACs?

The AM3352BZCEA30 silicon includes dual Ethernet MAC hardware, but only one port is enabled and routed in the ZCE package. Pinout documentation confirms MII1 signals are available while MII0 signals are not bonded out. Therefore, AM3352BZCEA30 supports a single 10/100/1000-Mbps Ethernet interface in hardware.

What package type and ball count does the AM3352BZCEA30 use?

The AM3352BZCEA30 uses a 298-ball NFBGA package (ZCE suffix) with 0.65-mm ball pitch and 13.0 mm × 13.0 mm body size. This Via Channel package is distinct from the 324-ball ZCZ variant and features optimized thermal vias for industrial convection-cooled applications.

Can the AM3352BZCEA30 run Linux and real-time operating systems simultaneously?

Yes - the AM3352BZCEA30 supports concurrent execution of Linux on the ARM Cortex-A8 core and real-time tasks on the dual PRU-ICSS subsystem. TI provides Processor SDK Linux and TI-RTOS, and the hardware mailbox/IPC mechanism enables deterministic communication between the two execution environments without OS interference.

What industrial protocols does the PRU-ICSS in AM3352BZCEA30 support?

The PRU-ICSS in AM3352BZCEA30 supports EtherCAT, PROFIBUS, PROFINET, EtherNet/IP, and other industrial protocols via downloadable firmware. While the ZCE package has limited PRU I/O pinout compared to ZCZ variants, it retains full PRU instruction set and memory resources needed to implement protocol stacks with sub-millisecond cycle times.

AM3352BZCEA30 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
298-LFBGA
Series:
Sitara™
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
300MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
LPDDR, DDR2, DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD, Touchscreen
Ethernet:
10/100/1000Mbps (2)
SATA:
-
USB:
USB 2.0 + PHY (2)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Security Features:
Cryptography, Random Number Generator
Mounting Type:
Surface Mount
Supplier Device Package:
298-NFBGA (13x13)
Additional Interfaces:
CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART

AM3352BZCEA30 FAQ

1.How can I place an order for AM3352BZCEA30 through Aetrix?

Please submit a Request for Quotation (RFQ) for AM3352BZCEA30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AM3352BZCEA30 reliable?

The price and inventory of AM3352BZCEA30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM3352BZCEA30 is usually 5 days.

3.What payment methods are accepted for AM3352BZCEA30?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM3352BZCEA30 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AM3352BZCEA30?

AM3352BZCEA30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AM3352BZCEA30 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AM3352BZCEA30?

For technical support, including AM3352BZCEA30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM3352BZCEA30 requirements.

6.How does Aetrix verify that AM3352BZCEA30 is sourced from the original manufacturer or authorized distributors?

All AM3352BZCEA30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM3352BZCEA30 meets industry standards.

7.What is the process for return or replacement of AM3352BZCEA30?

All AM3352BZCEA30 units undergo pre-shipment inspection (PSI). If there is an issue with AM3352BZCEA30, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AM3352BZCEA30 part is unused and in its original packaging.

Return procedure for AM3352BZCEA30:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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