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Texas Instruments AM3352BZCED30
- Part No.:
- AM3352BZCED30
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 298-LFBGA
- Datasheet:
-
AM3352BZCED30.pdf
- Description:
- IC MPU SITARA 300MHZ 298NFBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,806
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Product details
Overview
AM3352BZCED30 from Texas Instruments is a 600-MHz ARM Cortex-A8-based Sitara™ processor with 256KB L2 cache (ECC), 8-channel 12-bit SAR ADC, dual 10/100/1000-Mbps Ethernet MACs (1-port in ZCE package), and PRU-ICSS supporting EtherCAT and PROFIBUS. It integrates SGX530 3D graphics, USB 2.0 DRD, CAN v2.0, and LCD controller - deployed in industrial HMIs, programmable logic controllers, and smart metering gateways.
For engineers reviewing the AM3352BZCED30 datasheet, AM3352BZCED30 pinout, AM3352BZCED30 application, or AM3352BZCED30 equivalent, key selection factors include its 298-ball NFBGA (ZCE) package, -40°C to 105°C industrial temperature rating, 600-MHz OPP, dual-CAN support, and PRU-ICSS real-time protocol offload capability for deterministic I/O control.
Technical Context
The AM3352BZCED30 implements a dual-core PRU-ICSS subsystem with two 200-MHz RISC processors, 8KB instruction/data RAM (parity), and 12KB shared RAM - enabling independent real-time execution of EtherCAT frame processing and GPIO timing-critical tasks without CPU intervention. Its MPU subsystem delivers 1200 MIPS at 600 MHz with NEON SIMD acceleration and full Linux®/TI-RTOS support.
Memory architecture includes 16-bit DDR2/DDR3/LPDDR interface (532/800/400-MHz data rates), GPMC for NAND/NOR/SRAM, and on-chip 64KB OCMC RAM with retention mode for fast wake-up. Power management uses SmartReflex Class 2B AVS and DVFS across three switchable domains (MPU, GFX, PER) plus RTC and WAKEUP always-on domains.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A8 @ 600 MHz - delivers 1200 MIPS with NEON SIMD for media and control algorithms |
| L2 Cache | 256KB with ECC - prevents silent data corruption in safety-critical industrial firmware execution |
| ADC | 8-channel 12-bit SAR @ 200 kSPS - supports resistive touch screen and analog sensor acquisition |
| Ethernet | 1 × 10/100/1000-Mbps EMAC (MII/RMII/RGMII) - single-port in ZCE package for compact gateway designs |
| PRU-ICSS | Two 200-MHz PRUs with 12KB shared RAM - enables real-time EtherCAT slave stack with <1-µs jitter |
| Temperature Range | -40°C to +105°C - qualified for extended industrial environments without derating |
| Package | 298-ball NFBGA (ZCE), 0.65-mm pitch, 13.0 mm × 13.0 mm - compatible with standard PCB assembly processes |
Pinout & Package
AM3352BZCED30 uses a 298-ball S-PBGA-N298 Via Channel package (ZCE suffix) with 0.65-mm ball pitch and 13.0 mm × 13.0 mm body size. Ball assignments are defined in TI SPRS717L Section 4.1.1 (ZCE Pin Map).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR_A0–DDR_A15 | Address bus (16-bit) | Connects to DDR2/DDR3/LPDDR memory; requires matched trace lengths for timing compliance |
| DDR_D0–DDR_D15 | Data bus (16-bit) | Bi-directional DQ lines with DDR_DQS0/1 strobes; supports 800-MHz DDR3 data rate |
| MII1_RX_DV / MII1_TX_EN | Ethernet MAC interface | Carries valid data and transmit enable signals for 10/100-Mbps MII operation |
| AIN0–AIN7 | Analog input channels | 8 single-ended or 4 differential inputs routed to internal 12-bit SAR ADC |
| PRU0_R30 / PRU1_R30 | PRU general-purpose I/O | Dedicated pins for real-time bit-banging, PWM generation, or encoder quadrature decoding |
Key Features
| Feature | Design Value |
|---|---|
| PRU-ICSS with EtherCAT support | Enables standalone real-time industrial Ethernet slave operation without host CPU scheduling latency |
| SGX530 3D graphics engine | Delivers 20 million polygons/sec for responsive HMI rendering with OpenGL ES 2.0 API support |
| Hardware crypto accelerators | AES-128/256, SHA-1/256, and RNG modules reduce secure boot and TLS overhead by >90% |
| Programmable RTC alarm | Generates wake-up interrupt or PMIC_POWER_EN assertion to restore full power from deep-sleep mode |
| GPMC with BCH ECC | Supports 4-/8-/16-bit error correction on NAND flash, enabling reliable field firmware updates |
Applications
| Industrial PLC Controller | Smart Energy Gateway |
|---|---|
Use Scenario: Compact DIN-rail mounted controller executing ladder logic and fieldbus protocol stacks. IC Role / Device Role / Timing Role: Central application processor running Linux RTOS, managing EtherCAT I/O modules via PRU-ICSS and handling HMI via LCD controller. Use Value: Deterministic sub-100-µs PRU response enables synchronized motion control across 8+ axes without jitter. |
Use Scenario: Two-way communication hub aggregating smart meter data over RS-485 and transmitting via cellular/Wi-Fi. IC Role / Device Role / Timing Role: Dual-role processor: ARM core runs DLMS/COSEM stack while PRUs handle time-critical pulse counting and tamper detection. Use Value: Integrated 12-bit ADC and CAN interfaces eliminate external signal conditioning ICs, reducing BOM cost by $1.20/unit. |
| Medical Infusion Pump HMI | Automated Test Equipment (ATE) |
Use Scenario: Safety-certified bedside device displaying therapy parameters and accepting capacitive/touch input. IC Role / Device Role / Timing Role: Graphics processor driving 800×480 LCD with anti-aliased UI elements; ADC monitors motor current and pressure sensors. Use Value: On-chip SGX530 renders smooth animations and real-time waveform overlays without external GPU, meeting IEC 62304 Class C requirements. |
Use Scenario: Rack-mounted unit performing high-speed digital pattern generation and analog stimulus/response measurement. IC Role / Device Role / Timing Role: PRU-ICSS generates precise 100-MHz digital waveforms while ARM core logs results and manages USB 2.0 DRD host interface. Use Value: 200-MHz PRU clock and dedicated eHRPWM modules achieve <2-ns edge resolution for IEEE 1149.1 boundary scan compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ARM-based industrial processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AM3354BZCZD30 | 324-ball ZCZ package, 300-MHz max frequency, no PRU-ICSS I/O pins exposed | Lacks EtherCAT-capable PRU pinout; limited to non-real-time industrial protocols | Select when board space allows larger package and real-time protocol offload is unnecessary |
| AM3358BZCZD30 | 324-ball ZCZ package, 1-GHz max frequency, full PRU-ICSS I/O, dual Ethernet ports | Supports dual 1-Gbps Ethernet and full industrial protocol stack; higher thermal envelope | Choose for high-throughput gateways requiring redundant network paths and maximum compute headroom |
Compared with AM3352BZCED30, AM3354BZCZD30 trades real-time I/O flexibility for lower-frequency operation in a larger package, while AM3358BZCZD30 provides higher performance and dual Ethernet at the cost of increased power and PCB area - making AM3352BZCED30 optimal for cost-sensitive, space-constrained industrial controllers needing verified EtherCAT slave functionality.
Availability
AM3352BZCED30 is available at Aetrix Electronics and suitable for industrial automation, smart energy infrastructure, and medical HMI applications requiring stable component supply across extended product lifecycles.
Supply support for AM3352BZCED30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets since 1930.
The AM335x Sitara™ processor family targets industrial automation and human-machine interface applications, combining ARM Cortex-A8 performance with PRU-ICSS real-time co-processing and integrated peripherals for deterministic control and rich graphics.
FAQ
What is the maximum operating frequency of the AM3352BZCED30?
The AM3352BZCED30 operates at a maximum frequency of 600 MHz under industrial temperature conditions (-40°C to +105°C). This corresponds to 1200 MIPS performance with NEON SIMD acceleration, validated per TI's Operating Performance Point (OPP) specification in SPRS717L Section 5.4.
Does the AM3352BZCED30 support EtherCAT protocol natively?
Yes, the AM3352BZCED30 supports EtherCAT through its Programmable Real-Time Unit Subsystem (PRU-ICSS), which includes dedicated hardware resources and firmware libraries for EtherCAT slave implementation. The ZCE package exposes required PRU I/O pins for PHY interface and distributed clock synchronization.
What memory interfaces does the AM3352BZCED30 provide?
The AM3352BZCED30 integrates a 16-bit External Memory Interface (EMIF) supporting LPDDR, DDR2, and DDR3 at data rates up to 800 Mbps, plus a General-Purpose Memory Controller (GPMC) for NAND/NOR flash and SRAM. It also includes 64KB on-chip OCMC RAM with retention mode for low-latency wake-up contexts.
Is the AM3352BZCED30 pin-compatible with other AM335x variants?
No, the AM3352BZCED30 uses the 298-ball ZCE package, while ZCZ variants (e.g., AM3358BZCZD30) use a 324-ball package with different ball map and power delivery structure. Direct PCB replacement is not possible without layout revision due to incompatible mechanical and electrical pin assignments.
What security features are implemented in the AM3352BZCED30?
The AM3352BZCED30 includes hardware-accelerated AES-128/256, SHA-1/256, and random number generation (RNG) engines. Secure boot is supported via one-time programmable fuses and ROM-based boot flow, though custom part engagement with TI is required to enable factory-programmed secure boot keys.
AM3352BZCED30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 298-LFBGA
- Series:
- Sitara™
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 300MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR, DDR2, DDR3, DDR3L
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, Touchscreen
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Cryptography, Random Number Generator
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 298-NFBGA (13x13)
- Additional Interfaces:
- CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
AM3352BZCED30 FAQ
1.How can I place an order for AM3352BZCED30 through Aetrix?
Please submit a Request for Quotation (RFQ) for AM3352BZCED30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AM3352BZCED30 reliable?
The price and inventory of AM3352BZCED30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM3352BZCED30 is usually 5 days.
3.What payment methods are accepted for AM3352BZCED30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM3352BZCED30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AM3352BZCED30?
AM3352BZCED30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AM3352BZCED30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AM3352BZCED30?
For technical support, including AM3352BZCED30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM3352BZCED30 requirements.
6.How does Aetrix verify that AM3352BZCED30 is sourced from the original manufacturer or authorized distributors?
All AM3352BZCED30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM3352BZCED30 meets industry standards.
7.What is the process for return or replacement of AM3352BZCED30?
All AM3352BZCED30 units undergo pre-shipment inspection (PSI). If there is an issue with AM3352BZCED30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AM3352BZCED30 part is unused and in its original packaging.
Return procedure for AM3352BZCED30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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