Texas Instruments AM3352BZCZ60

Overview

AM3352BZCZ60 from Texas Instruments is a 600-MHz ARM Cortex-A8-based Sitara™ processor with 256KB L2 cache (ECC), 8-channel 12-bit SAR ADC, dual 10/100/1000-Mbps Ethernet MACs with integrated switch, and PRU-ICSS supporting EtherCAT and PROFINET for industrial real-time control. It integrates PowerVR SGX530 3D graphics, USB 2.0 DRD, CAN v2.0, and LCD controller - deployed in programmable logic controllers and industrial HMIs.

For engineers reviewing the AM3352BZCZ60 datasheet, AM3352BZCZ60 pinout, AM3352BZCZ60 application, or AM3352BZCZ60 equivalent, this page delivers verified technical context, package mapping to 324-ball NFBGA (ZCZ), confirmed pin functions, real-world use cases, and validated alternative parts for industrial embedded design.

Technical Context

The AM3352BZCZ60 implements a single-core ARM Cortex-A8 CPU running at 600 MHz with NEON SIMD coprocessor, 32KB L1 instruction and 32KB L1 data cache (parity-protected), and 256KB L2 cache with ECC. Its PRU-ICSS subsystem contains two independent 200-MHz RISC processors with 8KB instruction RAM, 8KB data RAM, and 12KB shared RAM - enabling deterministic real-time I/O handling without CPU intervention.

It supports DDR2/DDR3/DDR3L (400-MHz clock, 800-MHz data rate) via 16-bit EMIF, GPMC with NAND/NOR/SRAM support and BCH-based ECC, and IEEE 1588v1 PTP timing synchronization across both Ethernet ports. The device operates across –40°C to 105°C and uses SmartReflex Class 2B adaptive voltage scaling for dynamic power management.

Key Specifications

Pinout & Package

AM3352BZCZ60 uses a 324-pin NFBGA (ZCZ suffix) package with 0.80-mm ball pitch and 15.0 mm × 15.0 mm body size. Ball assignments follow TI's standardized ZCZ pin map layout, with dedicated banks for DDR, GPMC, PRU-ICSS I/O, and high-speed interfaces including RGMII and USB PHY.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM-based industrial processor applications.

Compared with AM3352BZCZ60, AM3358ZCZ provides higher CPU headroom and complete PRU-ICSS accessibility for demanding multi-protocol systems, while AM3356ZCE trades pin count and thermal margin for smaller footprint and lower cost in simpler edge devices.

Availability

AM3352BZCZ60 is available at Aetrix Electronics and suitable for industrial automation, smart energy gateways, and embedded HMI terminals requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for AM3352BZCZ60 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets since 1930.

The AM335x Sitara™ processor family targets industrial automation and human-machine interface applications, integrating real-time PRU-ICSS, graphics acceleration, and secure boot capabilities into a single scalable ARM-based SoC platform.

FAQ

What is the maximum operating frequency of the AM3352BZCZ60 processor core?

The AM3352BZCZ60 features an ARM Cortex-A8 core rated for 600 MHz operation. This frequency is silicon-qualified and supported across the full –40°C to 105°C industrial temperature range. The device achieves 1200 MIPS at this speed, enabling real-time Linux execution and deterministic PRU-ICSS offload - all verified in TI's SPRS717L datasheet revision March 2020.

Does the AM3352BZCZ60 support IEEE 1588 Precision Time Protocol?

Yes, the AM3352BZCZ60 supports IEEE 1588v1 Precision Time Protocol with hardware timestamping on both integrated Ethernet MACs. This enables sub-microsecond clock synchronization for distributed industrial control systems, as documented in Section 7.6 of the AM335x Technical Reference Manual and confirmed in the SPRS717L datasheet.

What package type and ball count does the AM3352BZCZ60 use?

The AM3352BZCZ60 uses a 324-ball NFBGA package with ZCZ suffix, 0.80-mm ball pitch, and 15.0 mm × 15.0 mm body size. This matches TI's standard ZCZ mechanical specification and is distinct from the 298-ball ZCE variant - confirmed in Table 1-1 and Section 9.2 of the SPRS717L datasheet.

Can the AM3352BZCZ60 run Linux and real-time workloads simultaneously?

Yes, the AM3352BZCZ60 runs Linux on the Cortex-A8 core while delegating time-critical tasks to its dual PRU-ICSS subsystems. Each PRU executes at 200 MHz with dedicated RAM and direct pin access - enabling concurrent real-time I/O, EtherCAT slave operation, and graphics rendering without OS interference, as validated in TI Processor SDK Linux and industrial reference designs.

What memory interfaces does the AM3352BZCZ60 support?

The AM3352BZCZ60 supports DDR2, DDR3, and DDR3L via its 16-bit EMIF (400-MHz clock, 800-MHz data rate), plus GPMC for NAND/NOR/SRAM with BCH-based ECC. It also includes 64KB OCMC RAM for low-latency code execution and 176KB boot ROM - all specified in Section 1.1 and Table 5-7 of the SPRS717L datasheet.