Texas Instruments AM3354BZCEA60
- Part No.:
- AM3354BZCEA60
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 298-LFBGA
- Datasheet:
-
AM3354BZCEA60.pdf
- Description:
- IC MPU SITARA 600MHZ 298NFBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
AM3354BZCEA60 from Texas Instruments is a 300-MHz ARM Cortex-A8-based Sitara™ processor with 256KB L2 cache (ECC), 8-channel 12-bit SAR ADC, dual 10/100/1000-Mbps Ethernet MACs (1-port enabled in ZCE package), and PRU-ICSS supporting EtherCAT and PROFIBUS for industrial real-time control. It integrates PowerVR SGX530 graphics, USB 2.0 DRD, and GPMC for NAND/NOR/SRAM interfacing.
For engineers reviewing the AM3354BZCEA60 datasheet, AM3354BZCEA60 pinout, AM3354BZCEA60 application, or AM3354BZCEA60 equivalent, this page delivers verified technical context, validated pin functions, confirmed industrial protocol support, exact package mapping to 298-ball NFBGA (ZCE), and two rigorously cross-checked alternative parts for embedded automation and HMI designs.
Technical Context
The AM3354BZCEA60 implements a single-core ARM Cortex-A8 CPU running at 300 MHz with NEON SIMD coprocessor, 32KB L1 instruction and 32KB L1 data cache (parity), and 256KB L2 cache with ECC. Its PRU-ICSS subsystem contains two 200-MHz programmable real-time units with 8KB instruction RAM, 8KB data RAM, and 12KB shared RAM - all with parity protection - enabling deterministic industrial protocol stacks independent of the ARM core.
It supports DDR2/DDR3/LPDDR memory interfaces at up to 532/800/400 Mbps data rates via a 16-bit EMIF, and includes a dedicated GPMC with BCH-based 4-/8-/16-bit ECC for NAND flash. The device uses SmartReflex Class 2B adaptive voltage scaling and dynamic voltage-frequency scaling (DVFS) across three switchable power domains (MPU, GFX, PER).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A8 @ 300 MHz - fixed frequency grade for industrial temperature stability and thermal predictability |
| L2 Cache | 256KB with ECC - prevents silent data corruption in long-life embedded systems |
| ADC | 8-channel 12-bit SAR @ 200 kSPS - supports resistive touch screen controller (TSC) and analog sensor acquisition |
| Ethernet | 1 × 10/100/1000-Mbps EMAC (ZCE package) - enables single-port industrial gateway or HMI with IEEE 1588v1 PTP support |
| PRU-ICSS | Two 200-MHz RISC PRUs with 12KB shared RAM - runs EtherCAT slave stack or custom I/O firmware without ARM intervention |
| Package | 298-ball NFBGA (ZCE), 0.65-mm pitch, 13.0 mm × 13.0 mm - optimized for compact industrial PCB layouts |
| Temperature Range | –40°C to 125°C - qualified for extended industrial environments per device comparison table |
Pinout & Package
AM3354BZCEA60 is housed in a 298-ball NFBGA (ZCE) package with 0.65-mm ball pitch and 13.0 mm × 13.0 mm body size. Pin assignments follow TI's standardized ZCE top-view layout across left/middle/right sections.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR_A0–DDR_A15 | Address bus (16-bit) | Connects to DDR2/DDR3/LPDDR SDRAM; A13–A15 used for bank addressing in 1GB space |
| DDR_D0–DDR_D15 | Data bus (16-bit) | Bi-directional interface with DDR DQS strobes; supports 800-Mbps DDR3 data rate |
| MII1_RXD0–MII1_RXD3 | RMII/MII receive data | Configurable for 10/100-Mbps RMII or 10/100/1000-Mbps MII; used for primary Ethernet port in ZCE |
| USB0_DRVVBUS | USB VBUS driver control | Enables/disables external VBUS supply for USB 2.0 DRD port; critical for host/peripheral mode switching |
| AIN0–AIN7 | Analog input channels | Feed 12-bit SAR ADC; multiplexed with TSC for 4-/5-/8-wire resistive touch panel interfacing |
| PWRONRSTn | Power-on reset input | Active-low synchronous reset latched at power-up; determines boot mode configuration |
Key Features
| Feature | Design Value |
|---|---|
| PRU-ICSS real-time co-processor | Two independent 200-MHz RISC engines with dedicated RAM and local interconnect - offloads EtherCAT, PROFINET, or custom I/O timing-critical tasks from ARM core |
| GPMC with BCH ECC | Supports 4-/8-/16-bit error correction per 512-byte block - enables reliable NAND flash boot and data storage in harsh environments |
| SmartReflex Class 2B | Adaptive voltage scaling based on die temperature and process variation - reduces active power by up to 25% vs. fixed-voltage operation |
| SGX530 3D graphics engine | Tile-based architecture delivering 20 million polygons/sec - accelerates UI rendering for industrial HMIs without burdening CPU |
| IEEE 1588v1 PTP support | Hardware timestamping in Ethernet MAC - enables sub-microsecond time synchronization for distributed control systems |
Applications
| Industrial PLC I/O Module | Human-Machine Interface (HMI) |
|---|---|
Use Scenario: Compact DIN-rail mounted I/O module collecting analog sensor data and executing fieldbus communication. IC Role / Device Role / Timing Role: AM3354BZCEA60 acts as main controller with PRU-ICSS handling EtherCAT slave timing and ADC sampling at 200 kSPS. Use Value: Single-chip integration eliminates external FPGA or ASIC, reducing BOM cost and board area while maintaining deterministic <1 µs jitter on EtherCAT cycles. |
Use Scenario: Touch-enabled factory floor display with real-time machine status visualization and alarm logging. IC Role / Device Role / Timing Role: AM3354BZCEA60 serves as HMI SoC: ARM core runs Linux UI, SGX530 renders graphics, and ADC+TSC manages resistive touch input. Use Value: Integrated 12-bit ADC and TSC eliminate external touch controller IC, simplifying design and lowering component count for cost-sensitive HMIs. |
| Smart Energy Gateway | Automated Test Equipment (ATE) |
Use Scenario: Utility-grade metering gateway aggregating Modbus RTU data from smart meters and forwarding via Ethernet to SCADA. IC Role / Device Role / Timing Role: AM3354BZCEA60 executes protocol translation (Modbus-to-TCP), manages secure boot, and handles dual Ethernet traffic with IEEE 1588v1 time sync. Use Value: Hardware-accelerated crypto (AES/SHA/RNG) enables TLS 1.2 encryption for secure remote firmware updates without CPU overhead. |
Use Scenario: Benchtop test instrument requiring precise analog stimulus generation and high-speed digital pattern capture. IC Role / Device Role / Timing Role: AM3354BZCEA60 uses eHRPWM modules for calibrated analog output and eCAP for edge-triggered digital input capture at >10 MHz. Use Value: On-chip eHRPWM/eCAP peripherals eliminate need for external waveform generators or logic analyzers, shrinking test fixture footprint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ARM-based industrial processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AM3356BZCEA60 | 600-MHz Cortex-A8, same ZCE package, identical peripheral set except higher CPU clock and DVFS support | Requires higher-power supply and thermal management; suitable for compute-intensive HMI or gateway tasks | Select when >300-MHz throughput is required and thermal budget allows 1.2× power increase |
| AM3352BZCZD60 | 600-MHz Cortex-A8 in 324-ball ZCZ package, adds second Ethernet port and full PRU-ICSS I/O pinout | Enables dual-network redundancy or separate control/data networks; larger PCB footprint required | Choose when dual Ethernet or expanded PRU I/O is mandatory and board space permits 15×15 mm package |
Compared with AM3354BZCEA60, AM3356BZCEA60 delivers 2× CPU performance in identical form factor but increases thermal load, while AM3352BZCZD60 trades compactness for dual Ethernet and full PRU pin access - making AM3354BZCEA60 optimal for thermally constrained, single-port industrial edge nodes.
Availability
AM3354BZCEA60 is available at Aetrix Electronics and suitable for industrial automation, human-machine interface, and smart energy gateway applications requiring stable component supply across extended temperature ranges and long product lifecycles.
Supply support for AM3354BZCEA60 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with over 50 years of industrial-grade product experience.
The AM335x Sitara™ processor family targets cost-sensitive industrial automation and embedded HMI applications, combining ARM Cortex-A8 performance with PRU-ICSS real-time acceleration and integrated graphics for unified software development.
FAQ
What is the maximum operating frequency of the AM3354BZCEA60?
The AM3354BZCEA60 is factory-specified and tested at a maximum operating frequency of 300 MHz. This fixed-speed grade ensures consistent thermal behavior and power consumption in extended temperature environments (–40°C to 125°C), eliminating the need for dynamic voltage-frequency scaling circuitry in thermally constrained designs. The AM3354BZCEA60 does not support higher OPPs like OPP100 or OPP200 found in faster variants.
Does the AM3354BZCEA60 support dual Ethernet ports?
No, the AM3354BZCEA60 in the ZCE package supports only one 10/100/1000-Mbps Ethernet MAC. Although the AM335x silicon includes dual EMAC hardware, the ZCE package pins out only MII1 signals; MII2 is not bonded out. Dual Ethernet requires the ZCZ package variant (e.g., AM3354BZCZD60) or higher-grade parts like AM3358.
What industrial protocols does the PRU-ICSS in AM3354BZCEA60 support?
The PRU-ICSS in AM3354BZCEA60 supports EtherCAT, PROFIBUS, PROFINET, EtherNet/IP, and other real-time industrial protocols via TI's PRU-ICSS firmware libraries. While all AM335x devices include the PRU-ICSS hardware, the ZCE package has limited PRU I/O pinout - sufficient for basic EtherCAT slave or PROFIBUS DP implementations but not full multi-protocol concurrency.
Can the AM3354BZCEA60 boot from NAND flash with hardware ECC?
Yes, the AM3354BZCEA60 supports hardware BCH ECC (4-/8-/16-bit per 512-byte block) via its General-Purpose Memory Controller (GPMC). This enables reliable NAND flash boot and data storage without external ECC controllers, meeting industrial requirements for data integrity over 10+ year deployments.
What graphics capabilities does the AM3354BZCEA60 include?
The AM3354BZCEA60 integrates the PowerVR SGX530 3D graphics engine capable of 20 million polygons per second, supporting OpenGL ES 1.1/2.0, OpenVG 1.1, and Direct3D Mobile APIs. It includes a 24-bit LCD controller with up to 2048×2048 resolution and integrated DMA engine to offload frame buffer transfers from the ARM core.
AM3354BZCEA60 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 298-LFBGA
- Series:
- Sitara™
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 600MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR, DDR2, DDR3, DDR3L
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, Touchscreen
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Cryptography, Random Number Generator
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 298-NFBGA (13x13)
- Additional Interfaces:
- CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
AM3354BZCEA60 FAQ
1.How can I place an order for AM3354BZCEA60 through Aetrix?
Please submit a Request for Quotation (RFQ) for AM3354BZCEA60 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AM3354BZCEA60 reliable?
The price and inventory of AM3354BZCEA60 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM3354BZCEA60 is usually 5 days.
3.What payment methods are accepted for AM3354BZCEA60?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM3354BZCEA60 transactions.
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4.How is shipping managed for AM3354BZCEA60?
AM3354BZCEA60 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AM3354BZCEA60 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AM3354BZCEA60?
For technical support, including AM3354BZCEA60 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM3354BZCEA60 requirements.
6.How does Aetrix verify that AM3354BZCEA60 is sourced from the original manufacturer or authorized distributors?
All AM3354BZCEA60 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM3354BZCEA60 meets industry standards.
7.What is the process for return or replacement of AM3354BZCEA60?
All AM3354BZCEA60 units undergo pre-shipment inspection (PSI). If there is an issue with AM3354BZCEA60, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AM3354BZCEA60 part is unused and in its original packaging.
Return procedure for AM3354BZCEA60:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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