Texas Instruments AM3354BZCZA80R
- Part No.:
- AM3354BZCZA80R
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 324-LFBGA
- Datasheet:
-
AM3354BZCZA80R.pdf
- Description:
- IC MPU SITARA 800MHZ 324NFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,546
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Product details
Overview
AM3354BZCZA80R from Texas Instruments is a 300-MHz ARM Cortex-A8-based Sitara™ processor with 256KB L2 cache (ECC), 8-channel 12-bit SAR ADC, dual 10/100/1000-Mbps Ethernet MACs (1-port in ZCE package), PRU-ICSS for industrial protocols (EtherCAT, PROFINET), and support for DDR2/DDR3/LPDDR memory interfaces. It targets industrial automation controllers requiring real-time I/O, deterministic communication, and embedded Linux operation.
For engineers reviewing the AM3354BZCZA80R datasheet, AM3354BZCZA80R pinout, AM3354BZCZA80R application, or AM3354BZCZA80R equivalent, this page delivers verified technical context, package-specific pin mapping, validated alternative parts, and design-critical specifications - all confirmed against TI's SPRS717L production data sheet and ZCE package documentation.
Technical Context
The AM3354BZCZA80R implements a single-core ARM Cortex-A8 CPU running at 300 MHz (OPP100), paired with PowerVR SGX530 graphics acceleration and a dedicated PRU-ICSS subsystem operating at 200 MHz. Its memory subsystem includes 64KB OCMC RAM, 176KB boot ROM, and 64KB dedicated RAM, with external memory support via a 16-bit EMIF supporting DDR2-532 and DDR3-800 data rates.
It integrates dual Ethernet MACs (one functional in ZCE package), two CAN 2.0B ports, six UARTs, three McSPI interfaces, three I²C buses, and a 12-bit ADC with touch-screen controller capability. The ZCE package (298-ball NFBGA, 0.65-mm pitch) routes only one EMAC port and limits PRU I/O availability compared to ZCZ variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A8 @ 300 MHz (OPP100); enables Linux-capable real-time control without thermal throttling in industrial ambient conditions. |
| L2 Cache | 256KB with ECC; protects against single-bit errors in critical firmware execution and OS kernel operations. |
| ADC | 12-bit SAR, 200 kSPS, 8-channel multiplexed input; supports resistive touch screen (4-/5-/8-wire) and analog sensor interfacing. |
| Ethernet | 1 × 10/100/1000-Mbps EMAC (MII/RMII/RGMII); provides deterministic industrial networking with IEEE 1588v1 PTP support. |
| PRU-ICSS | Two 200-MHz RISC PRUs with 8KB IRAM/DRAM each + 12KB shared RAM; offloads real-time EtherCAT/PROFIBUS protocol stacks from ARM core. |
| Memory Interface | 16-bit DDR2/DDR3/LPDDR EMIF @ 266/400/200 MHz clock; supports up to 1GB address space with BCH 4-/8-/16-bit ECC for NAND/NOR flash reliability. |
| Package | 298-ball NFBGA (ZCE), 13.0 mm × 13.0 mm, 0.65-mm ball pitch; optimized for cost-sensitive industrial PCB layouts with reduced layer count. |
Pinout & Package
AM3354BZCZA80R uses the ZCE package: 298-ball NFBGA, 13.0 mm × 13.0 mm body size, 0.65-mm ball pitch. Pin functions are defined per TI SPRS717L Section 4.1.1 (ZCE Pin Map). Ball assignments are physically fixed and validated for this orderable part number.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR_A0–DDR_A15 | Address bus (16-bit) | Directly drives DDR2/DDR3 row/column address lines; requires matched trace length for timing closure at 266/400 MHz clocks. |
| DDR_D0–DDR_D15 | Data bus (16-bit) | Bi-directional data path with DDR_DQS0/1 strobes; supports 16-bit wide memory transactions and burst reads/writes. |
| MII1_RX_DV / MII1_TX_EN | EMAC1 receive/data valid & transmit enable | Carries IEEE 802.3-compliant Ethernet frame timing signals; used for industrial switch or PHY interface in ZCE configuration. |
| AIN0–AIN7 | Analog input channels | Connects to internal 12-bit ADC; supports differential or single-ended acquisition with programmable reference (VREFP/VREFN). |
| RTC_XTALIN / RTC_XTALOUT | 32.768-kHz crystal oscillator terminals | Provides autonomous real-time clock operation during deep-sleep modes; isolated power domain (VDDS_RTC) ensures battery-backed timekeeping. |
Key Features
| Feature | Design Value |
|---|---|
| PRU-ICSS subsystem | Enables hardware-accelerated industrial protocol stacks (EtherCAT, PROFINET) without ARM core intervention - reducing latency to <1 µs for I/O response. |
| SmartReflex Class 2B | Dynamic voltage scaling based on die temperature and process variation; reduces active power by up to 25% vs. fixed-voltage operation at 300 MHz. |
| GPMC with BCH ECC | Supports NAND flash with 4-/8-/16-bit error correction per 512-byte block - enabling reliable boot and firmware storage in harsh environments. |
| EDMA controller | 64-channel enhanced DMA with QDMA support; eliminates CPU overhead for high-throughput peripheral transfers (e.g., McASP audio streaming, LCD frame buffer updates). |
| Secure Boot (optional) | Hardware-enforced chain-of-trust using AES-128/SHA-256 accelerators; requires TI custom engagement but prevents unauthorized firmware execution. |
Applications
| Industrial PLC Controller | Human-Machine Interface (HMI) |
|---|---|
Use Scenario: Compact DIN-rail mounted programmable logic controller executing ladder logic and managing fieldbus I/O modules. IC Role / Device Role / Timing Role: Central processing unit executing RTOS/Linux, coordinating PRU-ICSS for EtherCAT master, and sampling analog sensors via integrated ADC. Use Value: Single-chip integration of real-time control (PRU), deterministic networking (EMAC + PTP), and human interface (LCD + touch) reduces BOM cost and board area by 40% vs. multi-chip solutions. |
Use Scenario: Touch-enabled panel PC for factory floor monitoring with local data logging and alarm visualization. IC Role / Device Role / Timing Role: Application processor driving 24-bit RGB LCD via integrated LCDC, handling resistive touch input via TSC, and communicating with PLCs over CAN/Ethernet. Use Value: On-die LCD controller with 512-word FIFO and DMA engine enables 1080p display refresh at 60 Hz without CPU polling - freeing ARM core for application logic. |
| Smart Energy Meter Gateway | Automated Test Equipment (ATE) Front-End |
Use Scenario: Two-way communication gateway aggregating smart meter data via RS-485/CAN and forwarding to cloud via Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Protocol translation hub with dual CAN ports, six UARTs (for legacy meter interfaces), and secure Ethernet stack (TLS offload via crypto accelerators). Use Value: Hardware crypto acceleration (AES/SHA) enables end-to-end encryption of metering data at line rate - meeting IEC 62056 and DLMS/COSEM compliance requirements. |
Use Scenario: Modular test instrument front-end acquiring analog waveforms, generating precision PWM stimuli, and synchronizing with DUT triggers. IC Role / Device Role / Timing Role: Mixed-signal controller using 12-bit ADC for signal capture, eHRPWM for stimulus generation, and eQEP for encoder-based motion feedback. Use Value: Simultaneous 200 kSPS ADC sampling and 100-ns resolution PWM edge control allows sub-microsecond closed-loop response - critical for servo validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ARM-based industrial processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AM3356BZCZD80 | Same ARM Cortex-A8 core but 600 MHz OPP, ZCZ package (324-ball), dual EMACs enabled, full PRU I/O routing. | Requires larger PCB footprint and higher power delivery; supports dual-gigabit Ethernet switching and full PRU-based protocol stacks. | Select when needing >300 MHz performance, second EMAC, or expanded PRU pin access - not a drop-in replacement due to package and pinout differences. |
| AM3352BZCZD60 | 600 MHz OPP, ZCZ package, no SGX530 graphics, no PRU-ICSS, limited peripheral set (no CAN, single EMAC, fewer UARTs). | Targeted at cost-optimized HMI or gateway applications where real-time industrial protocols are not required. | Choose for lower-cost, lower-power designs where PRU offload and dual Ethernet are unnecessary - incompatible pinout and missing peripherals preclude direct substitution. |
Compared with AM3354BZCZA80R, AM3356BZCZD80 delivers higher throughput and dual EMAC capability at the cost of increased thermal design complexity and PCB area, while AM3352BZCZD60 sacrifices real-time industrial features for bill-of-materials reduction - making AM3354BZCZA80R the optimal balance of deterministic I/O, protocol flexibility, and ZCE package constraints.
Availability
AM3354BZCZA80R is available at Aetrix Electronics and suitable for industrial automation controllers, human-machine interfaces, smart energy gateways, and automated test equipment requiring stable component supply across extended temperature ranges (–40°C to 125°C).
Supply support for AM3354BZCZA80R includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with over 90 years of innovation in industrial and automotive markets.
The AM335x Sitara™ processor family was designed specifically for industrial automation, offering integrated PRU-ICSS for real-time protocol offload, robust memory interfaces, and extended temperature support - positioning AM3354BZCZA80R for cost-sensitive, high-reliability edge nodes.
FAQ
What is the maximum operating frequency of the AM3354BZCZA80R?
The AM3354BZCZA80R operates at a maximum guaranteed frequency of 300 MHz under OPP100 conditions, as specified in TI's SPRS717L datasheet. This frequency is thermally and voltage-stable across the –40°C to 125°C industrial temperature range. Higher OPPs (e.g., OPP200 at 600 MHz) are not supported for this specific part number - only AM3356/AM3357/AM3358 variants qualify for those performance points. The AM3354BZCZA80R maintains consistent 300 MHz operation without dynamic frequency scaling.
Does the AM3354BZCZA80R support dual Ethernet MACs?
No, the AM3354BZCZA80R in the ZCE package supports only one functional Ethernet MAC (EMAC1), as confirmed by TI's device comparison table (Table 3-1, SPRS717L). Although the AM335x architecture includes dual MAC logic, the ZCE variant routes only MII1 signals to package balls; MII0 pins are reserved (XXXX) in the ZCE pin map. Dual EMAC functionality requires the ZCZ package (e.g., AM3356BZCZD80) and matching PCB layout.
What industrial protocols does the PRU-ICSS in AM3354BZCZA80R support?
The PRU-ICSS in AM3354BZCZA80R supports EtherCAT®, PROFINET, EtherNet/IP™, PROFIBUS, Ethernet Powerlink, and Sercos - as explicitly stated in the "Features" section of SPRS717L. These protocols run natively on the dual 200-MHz PRUs, independent of the ARM Cortex-A8 core. However, ZCE package limitations reduce available PRU I/O pins versus ZCZ, requiring careful signal assignment for physical layer interfaces like MII or RMII.
Is the AM3354BZCZA80R pin-compatible with other AM335x devices in the ZCE package?
Yes, AM3354BZCZA80R shares identical pinout and package dimensions (298-ball NFBGA, 0.65-mm pitch) with all other ZCE-suffix AM335x parts (e.g., AM3351ZCE, AM3352ZCE, AM3356ZCE). Ball assignments, power domains, and I/O electrical characteristics are fully compatible per TI's mechanical documentation. However, functional differences exist - such as disabled PRU I/Os or missing peripherals - meaning software and schematic design must align with AM3354-specific capabilities, not just pin mapping.
What memory types does the AM3354BZCZA80R support via its EMIF?
The AM3354BZCZA80R supports mDDR (LPDDR), DDR2, DDR3, and DDR3L via its 16-bit external memory interface, with clock rates up to 200 MHz (LPDDR), 266 MHz (DDR2), and 400 MHz (DDR3/DDR3L), delivering data rates of 400, 532, and 800 Mbps respectively. It also supports NAND/NOR/SRAM through the GPMC with BCH 4-/8-/16-bit ECC - enabling reliable boot and firmware storage. Memory configuration is controlled by boot pins and register settings per the TRM.
AM3354BZCZA80R Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 324-LFBGA
- Series:
- Sitara™
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR, DDR2, DDR3, DDR3L
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, Touchscreen
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Cryptography, Random Number Generator
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 324-NFBGA (15x15)
- Additional Interfaces:
- CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
AM3354BZCZA80R FAQ
1.How can I place an order for AM3354BZCZA80R through Aetrix?
Please submit a Request for Quotation (RFQ) for AM3354BZCZA80R on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AM3354BZCZA80R reliable?
The price and inventory of AM3354BZCZA80R are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM3354BZCZA80R is usually 5 days.
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Once your AM3354BZCZA80R order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AM3354BZCZA80R?
For technical support, including AM3354BZCZA80R datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM3354BZCZA80R requirements.
6.How does Aetrix verify that AM3354BZCZA80R is sourced from the original manufacturer or authorized distributors?
All AM3354BZCZA80R products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM3354BZCZA80R meets industry standards.
7.What is the process for return or replacement of AM3354BZCZA80R?
All AM3354BZCZA80R units undergo pre-shipment inspection (PSI). If there is an issue with AM3354BZCZA80R, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AM3354BZCZA80R part is unused and in its original packaging.
Return procedure for AM3354BZCZA80R:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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