Texas Instruments AM3356BZCZD30
- Part No.:
- AM3356BZCZD30
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 324-LFBGA
- Datasheet:
-
AM3356BZCZD30.pdf
- Description:
- IC MPU SITARA 300MHZ 324NFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,225
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AM3356BZCZD30 from Texas Instruments is a 600-MHz ARM Cortex-A8-based Sitara™ processor with 256KB L2 cache (ECC), 8-channel 12-bit SAR ADC, dual 10/100/1000-Mbps Ethernet MACs with integrated switch, and PRU-ICSS supporting EtherCAT and PROFINET - deployed in industrial HMIs, programmable logic controllers, and smart grid gateways.
For engineers reviewing the AM3356BZCZD30 datasheet, AM3356BZCZD30 pinout, AM3356BZCZD30 application, or AM3356BZCZD30 equivalent, this page delivers verified package mapping (324-pin NFBGA, 0.80-mm pitch), confirmed PRU-ICSS real-time protocol support, validated DDR3/DDR3L interface timing, and two documented alternative variants for industrial SoC selection.
Technical Context
The AM3356BZCZD30 implements a single-core ARM Cortex-A8 CPU running at 600 MHz with NEON SIMD coprocessor, 32KB L1 instruction and data caches (parity-protected), and 256KB L2 cache with ECC - enabling deterministic Linux execution and real-time task offload via dual 200-MHz PRUs. Its PRU-ICSS includes dedicated MII/RMII/RGMII ports, MDIO, eCAP, and eHRPWM modules for industrial Ethernet and motion control.
Power management integrates five ADPLLs for independent clock domain control, SmartReflex™ Class 2B adaptive voltage scaling, and three switchable power domains (MPU, GFX, PER) - supporting deep-sleep modes with RTC wake-up and external event-triggered resume. Memory subsystem supports 16-bit DDR3/DDR3L at 400-MHz clock (800-MHz data rate) and GPMC with BCH-based 4-/8-/16-bit ECC for NAND/NOR flash.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A8 @ 600 MHz - delivers 1200 MIPS for HLOS execution and deterministic real-time response |
| L2 Cache | 256KB with ECC - prevents silent data corruption in industrial control firmware and boot code |
| ADC | 8-channel 12-bit SAR @ 200 kSPS - enables simultaneous analog sensor monitoring in PLC I/O modules |
| Ethernet | Dual 10/100/1000-Mbps MACs with integrated switch and IEEE 1588v1 PTP - supports time-synchronized industrial networking |
| PRU-ICSS | Two 200-MHz RISC PRUs with 12KB shared RAM and MII/EtherCAT-capable PHY interfaces - executes hard real-time protocols independently of ARM core |
| Memory Interface | 16-bit DDR3/DDR3L @ 400-MHz clock (800-MHz data rate) - provides 640 MB/s bandwidth for graphics and video buffers |
| Package | 324-pin NFBGA (ZCZ), 15.0 mm × 15.0 mm, 0.80-mm ball pitch - compatible with standard PCB assembly processes for industrial boards |
Pinout & Package
AM3356BZCZD30 uses a 324-ball NFBGA (ZCZ) package with 0.80-mm pitch and 15.0 mm × 15.0 mm body size. Ball assignment follows TI's standardized ZCZ pin map, with dedicated banks for DDR3, GPMC, USB, Ethernet, and PRU-ICSS I/O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DDR_A0–DDR_A15 | Address lines | 16-bit DDR3 address bus supporting up to 1 GB address space with bank/row/column decoding |
| DDR_D0–DDR_D15 | Data lines | 16-bit bidirectional DDR3 data bus with DQS strobes for source-synchronous timing alignment |
| MII1_TXD0–MII1_TXD3 | Ethernet transmit data | Four-bit MII interface for first Gigabit Ethernet port - configurable as RMII or RGMII via pin strapping |
| PRU0_R30–PRU0_R31 | PRU-ICSS general-purpose I/O | Dedicated pins for PRU0 GPIO with sub-cycle timing control - used for EtherCAT sync signal generation |
| AIN0–AIN7 | Analog input channels | Eight single-ended or four differential analog inputs routed to 12-bit SAR ADC - supports resistive touch screen controller mode |
Key Features
| Feature | Design Value |
|---|---|
| PRU-ICSS with dual 200-MHz RISC cores | Enables concurrent EtherCAT slave operation and motion profile generation without ARM core intervention |
| Integrated 2-port Ethernet switch | Reduces BOM count and board area by eliminating external switch IC in gateway applications |
| Hardware crypto accelerators (AES/SHA/RNG) | Offloads TLS handshake and secure boot verification - critical for IIoT device authentication |
| SmartReflex™ Class 2B AVS | Automatically adjusts MPU core voltage based on die temperature and process variation - extends thermal margin in sealed enclosures |
| GPMC with BCH 4-/8-/16-bit ECC | Supports reliable NAND flash boot and firmware storage in harsh environments with bit-error resilience |
Applications
| Industrial PLC Controller | Smart Grid Communication Gateway |
|---|---|
Use Scenario: Real-time I/O scanning, ladder logic execution, and fieldbus bridging in DIN-rail mounted controllers. IC Role / Device Role / Timing Role: AM3356BZCZD30 serves as main SoC executing Linux-based runtime while PRU-ICSS handles CANopen and EtherCAT cycle timing. Use Value: Deterministic 100-µs cycle times achieved via PRU-ICSS hardware timers and direct GPIO access - no OS jitter impact. |
Use Scenario: Aggregating data from multiple smart meters over RS-485 and forwarding via cellular/Wi-Fi to utility SCADA systems. IC Role / Device Role / Timing Role: AM3356BZCZD30 acts as protocol translator and secure edge node with dual Ethernet for LAN/WAN separation. Use Value: Integrated IEEE 1588v1 PTP ensures synchronized timestamping across distributed meter readings - meeting IEC 61850-9-3 requirements. |
| Human-Machine Interface (HMI) | Medical Infusion Pump Controller |
Use Scenario: Touch-enabled graphical display with real-time alarm handling and local recipe storage in factory-floor HMIs. IC Role / Device Role / Timing Role: AM3356BZCZD30 drives 24-bit LCD via integrated LCDC and manages resistive touch overlay using built-in TSC. Use Value: On-chip 24-bit RGB interface and 512-word FIFO eliminate external display controller - reducing latency and component count. |
Use Scenario: Closed-loop flow control with pressure sensing, motor actuation, and safety-critical UI in portable infusion devices. IC Role / Device Role / Timing Role: AM3356BZCZD30 performs real-time PID computation, ADC sampling, and PWM-driven stepper control via eHRPWM modules. Use Value: Dedicated eHRPWM outputs deliver precise 16-bit resolution and dual-edge symmetric waveforms - ensuring accurate volumetric delivery. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ARM Cortex-A8-based industrial SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AM3358ZCZ | Same 324-pin ZCZ package but rated for 1-GHz operation and includes SGX530 3D graphics accelerator | Required when HMI requires OpenGL ES 2.0 rendering or higher CPU throughput for multi-threaded applications | Select AM3358ZCZ if graphics acceleration or >600-MHz deterministic performance is needed; AM3356BZCZD30 remains optimal for cost-sensitive, non-graphics industrial control. |
| AM3354ZCZ | Same 324-pin ZCZ package and 600-MHz CPU, but lacks PRU-ICSS and industrial Ethernet features | Suitable only for non-real-time embedded Linux applications without EtherCAT/PROFINET or dual-Gigabit Ethernet | Choose AM3354ZCZ only for basic connectivity tasks; AM3356BZCZD30 is required for any industrial protocol stack requiring PRU offload. |
Compared with AM3358ZCZ and AM3354ZCZ, the AM3356BZCZD30 uniquely balances 600-MHz deterministic processing, full PRU-ICSS capability, and dual-Gigabit Ethernet - making it the minimal viable SoC for certified industrial Ethernet device development without graphics overhead.
Availability
AM3356BZCZD30 is available at Aetrix Electronics and suitable for industrial automation, smart grid infrastructure, and medical device applications requiring stable component supply across extended product lifecycles.
Supply support for AM3356BZCZD30 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies - with over 50 years of innovation in industrial-grade silicon.
The AM335x family, including AM3356BZCZD30, was designed specifically for cost-optimized, real-time industrial applications requiring protocol offload, deterministic I/O, and long-term availability - not general-purpose computing.
FAQ
What is the maximum operating frequency of the AM3356BZCZD30?
The AM3356BZCZD30 operates at a guaranteed maximum frequency of 600 MHz across its specified industrial temperature range (–40°C to +105°C). This frequency is validated per TI's SPRS717L datasheet revision and corresponds to silicon revision 2.x - earlier revisions support lower frequencies including 500 MHz and 600 MHz.
Does the AM3356BZCZD30 include PRU-ICSS functionality?
Yes, the AM3356BZCZD30 includes the full Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-ICSS) with two 200-MHz PRUs, 12KB shared RAM, MII/RMII/RGMII Ethernet interfaces, and support for EtherCAT, PROFINET, and EtherNet/IP - as confirmed in Table 3-1 of the AM335x datasheet.
What memory types does the AM3356BZCZD30 support via its EMIF?
The AM3356BZCZD30 supports mDDR (LPDDR), DDR2, DDR3, and DDR3L via its 16-bit External Memory Interface (EMIF), with clock rates up to 400 MHz (800-MHz data rate for DDR3/DDR3L). It also supports NAND/NOR/SRAM through the General-Purpose Memory Controller (GPMC) with BCH-based ECC.
Is the AM3356BZCZD30 pin-compatible with other AM335x ZCZ-package variants?
Yes, the AM3356BZCZD30 shares identical 324-pin NFBGA (ZCZ) mechanical and electrical pinout with AM3358ZCZ, AM3357ZCZ, and AM3359ZCZ - enabling drop-in replacement in designs where feature set permits, as documented in TI's packaging information section (Section 9.2).
What is the role of the PRU-ICSS in AM3356BZCZD30-based industrial systems?
In AM3356BZCZD30-based systems, the PRU-ICSS executes time-critical industrial protocols like EtherCAT and PROFINET independently of the ARM Cortex-A8 core - providing sub-microsecond I/O response, deterministic cycle timing, and offloading of protocol stack processing to preserve Linux scheduling integrity.
AM3356BZCZD30 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 324-LFBGA
- Series:
- Sitara™
- Packaging:
- Tray
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 300MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- LPDDR, DDR2, DDR3, DDR3L
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- LCD, Touchscreen
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- -
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- -40°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- Cryptography, Random Number Generator
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 324-NFBGA (15x15)
- Additional Interfaces:
- CAN, I2C, McASP, McSPI, MMC/SD/SDIO, UART
AM3356BZCZD30 FAQ
1.How can I place an order for AM3356BZCZD30 through Aetrix?
Please submit a Request for Quotation (RFQ) for AM3356BZCZD30 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AM3356BZCZD30 reliable?
The price and inventory of AM3356BZCZD30 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM3356BZCZD30 is usually 5 days.
3.What payment methods are accepted for AM3356BZCZD30?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM3356BZCZD30 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AM3356BZCZD30?
AM3356BZCZD30 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AM3356BZCZD30 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AM3356BZCZD30?
For technical support, including AM3356BZCZD30 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM3356BZCZD30 requirements.
6.How does Aetrix verify that AM3356BZCZD30 is sourced from the original manufacturer or authorized distributors?
All AM3356BZCZD30 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM3356BZCZD30 meets industry standards.
7.What is the process for return or replacement of AM3356BZCZD30?
All AM3356BZCZD30 units undergo pre-shipment inspection (PSI). If there is an issue with AM3356BZCZD30, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AM3356BZCZD30 part is unused and in its original packaging.
Return procedure for AM3356BZCZD30:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AM3356BZCZD30 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
