Texas Instruments AM3703CBC100

Overview

AM3703CBC100 from Texas Instruments is a Sitara™ ARM® Cortex™-A8 microprocessor operating at up to 1 GHz with adaptive core voltage (0.9–1.2 V), integrated 256KB L2 cache, POWERVR SGX graphics accelerator (AM3715 only - AM3703 excludes SGX), and support for SDRAM, NAND/NOR flash, and multimedia interfaces including 5 McBSPs, 4 McSPI, 3 MMC/SDIO, and HDQ/1-Wire. It targets embedded human-machine interface and industrial control applications requiring high-performance Linux or Android execution.

For engineers reviewing the AM3703CBC100 datasheet, AM3703CBC100 pinout, AM3703CBC100 application, or AM3703CBC100 equivalent, key selection considerations include its 515-pin s-PBGA package (CBC suffix, 0.65 mm top / 0.5 mm bottom ball pitch), absence of POWERVR SGX graphics, 188 multiplexed GPIOs, SmartReflex™ power management, and compatibility with OMAP™3 architecture for legacy migration paths.

Technical Context

The AM3703CBC100 implements an in-order, dual-issue, superscalar ARMv7-A architecture with TrustZone® security, Thumb®-2 instruction set, and NEON™ SIMD coprocessor. It integrates dedicated subsystems including SDRC (SDRAM controller), GPMC (general-purpose memory controller), and L3/L4 interconnect networks for predictable latency across peripherals.

Its memory subsystem supports 16-/32-bit SDRAM with SMS scheduler and rotation engine, plus glueless NAND/NOR/SRAM interfacing via GPMC with up to 8 chip selects and 128 MB per select. The device uses TI's 45-nm CMOS process and supports dynamic voltage and frequency scaling (DVFS) through SmartReflex™ AVS for optimized power-performance tradeoffs.

Key Specifications

Pinout & Package

The AM3703CBC100 is housed in a 515-ball, 0.65 mm (top) / 0.5 mm (bottom) pitch s-PBGA package (CBC suffix), supporting POP memory stacking on the bottom layer. Ball assignment follows TI's standardized quadrant layout (A–D) with dedicated power domains (vdd_core, vdd_mpu_iva, vdds_mem, vdda_dplls_dll) and function-multiplexed I/Os.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM application processor applications.

Compared with AM3715CBC100, AM3703CBC100 removes SGX but retains identical CPU, memory, and peripheral capabilities-ideal for CPU-bound UIs. Versus AM1808BZWT, it delivers >2× integer performance and full ARMv7 feature set, justifying upgrade for complex embedded Linux deployments.

Availability

AM3703CBC100 is available at Aetrix Electronics and suitable for portable data terminals, industrial HMI panels, and medical point-of-care devices requiring stable component supply and long-term industrial temperature support.

Supply support for AM3703CBC100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with decades of automotive and industrial qualification expertise.

The AM37x Sitara™ MPU product line targets high-performance embedded applications requiring Linux/Android runtime, rich multimedia I/O, and industrial-grade reliability-designed specifically for HMI, medical, and automation systems where software flexibility meets deterministic hardware control.

FAQ

What is the maximum operating frequency of the AM3703CBC100?

The AM3703CBC100 operates at up to 1 GHz under industrial temperature conditions. This frequency is achieved with adaptive core voltage (0.9–1.2 V) managed by SmartReflex™ AVS. The device also supports lower OPPs (300/600/800 MHz) for power-constrained use cases. All frequency modes are validated across the full –40°C to +105°C junction temperature range specified for the AM3703CBC100.

Does the AM3703CBC100 include the POWERVR SGX graphics accelerator?

No, the AM3703CBC100 does not include the POWERVR SGX graphics accelerator. That feature is exclusive to the AM3715 variant. The AM3703CBC100 retains the full ARM Cortex-A8 CPU, memory subsystem, and all peripheral interfaces-including the display processor-but relies on CPU-based rendering or external GPU solutions for graphics-intensive workloads.

What package type and ball pitch does the AM3703CBC100 use?

The AM3703CBC100 uses a 515-pin plastic ball grid array (s-PBGA) package with CBC suffix, featuring 0.65 mm ball pitch on the top layer and 0.5 mm on the bottom layer. This asymmetric pitch supports POP memory stacking and is mechanically and thermally qualified for industrial reflow profiles. Pin assignments match the AM3715CBC100, enabling shared PCB layout where graphics acceleration is not required.

How many general-purpose I/O pins does the AM3703CBC100 provide?

The AM3703CBC100 provides up to 188 general-purpose I/O pins, multiplexed with other peripheral functions such as McBSP, McSPI, UART, and camera interface signals. These GPIOs are distributed across multiple power domains (vdd_mpu_iva, vdd_core) and support configurable pull-up/down, drive strength, and interrupt capability-enabling direct connection to buttons, LEDs, sensors, and discrete logic without external I/O expanders.

Is the AM3703CBC100 pin-compatible with the AM3715CBC100?

Yes, the AM3703CBC100 is pin-compatible with the AM3715CBC100. Both share identical 515-pin s-PBGA (CBC) packaging, ball map, power domain assignments, and peripheral pinout. The only functional difference is the absence of POWERVR SGX in the AM3703CBC100. This allows drop-in replacement in existing AM3715 designs where graphics acceleration is unused, reducing BOM cost without PCB revision.