Texas Instruments AM3703CBCA

Overview

AM3703CBCA from Texas Instruments is a Sitara™ ARM® Cortex™-A8 microprocessor operating at up to 1 GHz with adaptive core voltage (0.9–1.1 V), integrated 256KB L2 cache, POWERVR SGX graphics accelerator (AM3715 only - not present in AM3703), and dual 32-bit watchdog timers. It supports Linux, Android, and Windows Embedded CE, and targets portable data terminals and industrial HMI systems requiring high-performance embedded processing with low-power operation.

For engineers reviewing the AM3703CBCA datasheet, AM3703CBCA pinout, AM3703CBCA application, or AM3703CBCA equivalent, key selection considerations include its 515-pin s-PBGA package (CBC suffix, 0.65 mm top / 0.5 mm bottom ball pitch), 45-nm CMOS process, SmartReflex™ AVS support, GPMC/SDRC memory interfaces, and absence of on-die POWERVR SGX graphics - distinguishing it from AM3715.

Technical Context

The AM3703CBCA implements an in-order, dual-issue, superscalar ARMv7-A architecture with TrustZone® security extensions, Thumb®-2 instruction set, and NEON™ SIMD coprocessor for accelerated multimedia processing. Its memory subsystem includes 32KB L1 instruction and data caches (4-way set-associative), 256KB unified L2 cache, 64KB on-chip SRAM, and 32KB ROM.

Peripheral integration includes five McBSPs (two with SIDETONE audio buffer), four McSPI ports, three I²C controllers, four UARTs (one with IrDA), HDQ/1-Wire interface, 12 general-purpose timers, and dual USB 2.0 subsystems (OTG + multiport host) with ULPI or serial interface options - all managed via hierarchical L3/L4 interconnect and PRCM power control.

Key Specifications

Pinout & Package

The AM3703CBCA is housed in a 515-ball, 17 × 17 mm, 0.65 mm (top) / 0.5 mm (bottom) pitch s-PBGA package (CBC suffix), optimized for POP memory stacking and thermal dissipation in compact embedded designs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM application processor applications.

Compared with AM3715CBCA, AM3703CBCA removes the POWERVR SGX block to reduce cost and power, while retaining identical CPU, memory, and peripheral capabilities - making it optimal for non-graphics HMI. Versus AM3358BZCZ100, AM3703CBCA offers superior multimedia acceleration, camera ISP, and dual USB 2.0, justifying its use in higher-tier portable devices.

Availability

AM3703CBCA is available at Aetrix Electronics and suitable for portable data terminals, industrial human-machine interfaces, and automotive infotainment systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for AM3703CBCA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in high-reliability industrial and automotive ICs.

The AM3703 belongs to TI's Sitara ARM processor family, designed specifically for high-performance, low-power embedded applications demanding rich OS support, multimedia acceleration, and industrial-grade robustness - not general-purpose computing.

FAQ

What is the maximum operating frequency of the AM3703CBCA?

The AM3703CBCA operates at up to 1 GHz under specified thermal and voltage conditions. Its adaptive voltage scaling (SmartReflex™) allows dynamic adjustment of core voltage between 0.9 V and 1.1 V to maintain stability at this frequency while minimizing power consumption. This 1-GHz capability is confirmed in the SPRS616F datasheet revision August 2011, Table 6-1, and applies specifically to the AM3703CBCA variant.

Does the AM3703CBCA include an integrated GPU?

No, the AM3703CBCA does not include the POWERVR SGX graphics accelerator. That feature is exclusive to the AM3715 variant. The AM3703CBCA shares the same ARM Cortex-A8 core, memory subsystem, and peripheral set as AM3715, but omits the SGX block - reducing silicon area, power, and cost while maintaining full CPU and imaging capabilities such as camera ISP and DSS display processing.

What package type and ball pitch does the AM3703CBCA use?

The AM3703CBCA uses a 515-pin plastic ball grid array (s-PBGA) package with CBC suffix, featuring 0.65 mm ball pitch on the top layer and 0.5 mm on the bottom layer. This asymmetric pitch supports POP (package-on-package) memory stacking and is documented in Section 2.1 of the SPRS616F datasheet. It is mechanically and electrically distinct from the CBP (0.5 mm / 0.4 mm) and CUS (423-pin) variants.

Which operating systems are officially supported on the AM3703CBCA?

Texas Instruments provides official board support packages (BSPs) and software development kits for Linux, Android, and Windows Embedded CE on the AM3703CBCA. These are available free of charge from TI's processor wiki and SDK repositories. The AM3703CBCA's ARMv7-A architecture, TrustZone® security extensions, and memory management unit ensure full compatibility with these OS environments.

How does the AM3703CBCA differ from the AM3715CBCA in terms of pin compatibility?

The AM3703CBCA and AM3715CBCA are pin-compatible and share identical package dimensions, ball map, and electrical characteristics - enabling drop-in replacement on the same PCB. The sole functional difference is the absence of the POWERVR SGX graphics engine in AM3703CBCA. All GPIO, memory, USB, and peripheral signals retain identical pin assignments and timing behavior per the SPRS616F datasheet.