Texas Instruments AM3703CBCD100

Overview

AM3703CBCD100 from Texas Instruments is a Sitara™ ARM® Cortex™-A8 microprocessor operating at up to 1 GHz with adaptive core voltage (0.9–1.2 V), integrated 256KB L2 cache, POWERVR SGX graphics accelerator (AM3715 only - excluded for AM3703), and dual 32-bit watchdog timers. It supports Linux, Android, and Windows Embedded CE, and targets embedded HMI, portable data terminals, and industrial control systems.

For engineers reviewing the AM3703CBCD100 datasheet, AM3703CBCD100 pinout, AM3703CBCD100 application, or AM3703CBCD100 equivalent, key selection criteria include its 515-pin s-PBGA (CBC package), 45-nm CMOS process, SmartReflex™ power management, GPMC/NAND/SDRAM interface support, and absence of on-die POWERVR SGX - distinguishing it from AM3715.

Technical Context

The AM3703CBCD100 implements an in-order, dual-issue, superscalar ARMv7-A architecture with TrustZone® security, Thumb®-2 instruction set, and NEON™ SIMD coprocessor. It features a 32KB/32KB 4-way L1 instruction/data cache and 256KB unified L2 cache, enabling deterministic real-time execution in embedded OS environments.

Its memory subsystem includes a 16-/32-bit SDRAM controller (SDRC) supporting LPDDR/DDR2, a general-purpose memory controller (GPMC) with 8 chip selects and glueless NAND/NOR/SRAM interfacing, and 64KB on-chip SRAM. Power management leverages SmartReflex™ AVS with dynamic voltage and frequency scaling (DVFS) across multiple domains.

Key Specifications

Pinout & Package

AM3703CBCD100 uses a 515-ball s-PBGA package (CBC suffix), with 0.65 mm ball pitch on top layer and 0.5 mm on bottom layer. Pin assignments are defined in TI SPRS616F Rev. F (August 2011), Figures 2-10 through 2-13.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM application processor applications.

Compared with AM3715CBCD100, AM3703CBCD100 removes the SGX GPU to reduce cost and power while retaining full CPU, memory, and peripheral capability; versus AM3358BZCZ100, it offers superior multimedia I/O (McBSP sidetone, ISP, DSS) and larger L2 cache for OS responsiveness, at the expense of PRU-based deterministic I/O.

Availability

AM3703CBCD100 is available at Aetrix Electronics and suitable for portable data terminals, industrial HMIs, and automotive infotainment systems requiring stable component supply across long production lifecycles.

Supply support for AM3703CBCD100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in industrial, automotive, and communications markets.

The Sitara™ ARM processor product line delivers high-performance, low-power application processors optimized for embedded Linux, real-time OS, and human-machine interface applications - balancing compute density, peripheral richness, and thermal efficiency.

FAQ

What is the maximum operating frequency of the AM3703CBCD100?

The AM3703CBCD100 operates at up to 1 GHz under specified thermal and voltage conditions. Its adaptive core voltage (0.9–1.2 V) and SmartReflex™ AVS allow dynamic frequency scaling to match workload demands while maintaining stability. This 1-GHz capability is confirmed in the AM3715/AM3703 datasheet SPRS616F, Section 1.1, and applies identically to the AM3703CBCD100 variant.

Does the AM3703CBCD100 include the POWERVR SGX graphics accelerator?

No, the AM3703CBCD100 does not include the POWERVR SGX graphics accelerator. That feature is exclusive to the AM3715 variant. The AM3703CBCD100 shares the same ARM Cortex-A8 core, memory subsystem, and peripheral set but omits the SGX block - reducing die size, power consumption, and unit cost for applications that rely on CPU-based rendering or simpler 2D UIs.

What package type and ball pitch does the AM3703CBCD100 use?

The AM3703CBCD100 uses a 515-pin s-PBGA package with CBC suffix, featuring 0.65 mm ball pitch on the top layer and 0.5 mm on the bottom layer. This dual-pitch construction supports fine-pitch routing for high-speed signals while maintaining manufacturability. Pin assignments are fully documented in TI's SPRS616F datasheet, Figures 2-10 through 2-13.

Which operating systems are supported on the AM3703CBCD100?

The AM3703CBCD100 supports Linux, Android, and Windows Embedded CE, all available free of charge from Texas Instruments. Its ARMv7-A architecture with MMU, TrustZone, and NEON SIMD provides full compatibility with mainstream embedded OS distributions and middleware stacks, including TI's Processor SDK for Linux and Android.

How does SmartReflex™ technology function in the AM3703CBCD100?

SmartReflex™ technology in the AM3703CBCD100 enables adaptive voltage scaling (AVS) by continuously monitoring process, voltage, and temperature (PVT) variations using on-die sensors. It dynamically adjusts the core voltage (0.9–1.2 V) in concert with frequency scaling to minimize active power without compromising timing closure - delivering up to 30% lower dynamic power versus fixed-voltage operation.