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Texas Instruments AM3703CBP

Part No.:
AM3703CBP
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
515-WFBGA, FCBGA
Datasheet:
AetrixAM3703CBP.pdf
Description:
IC MPU SITARA 800MHZ 515FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,171

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Product details

Overview

AM3703CBP from Texas Instruments is a Sitara™ ARM® Cortex™-A8 microprocessor operating up to 1 GHz with adaptive core voltage (0.9–1.2 V), integrated 256KB L2 cache, POWERVR SGX graphics accelerator (AM3715 only - not present in AM3703), and support for SDRAM, NAND/NOR flash, and multimedia interfaces including McBSP, McSPI, USB OTG/Host, and camera ISP. It targets embedded human-machine interface and industrial control applications requiring high-performance Linux or Android execution.

For engineers reviewing the AM3703CBP datasheet, AM3703CBP pinout, AM3703CBP application, or AM3703CBP equivalent, key selection considerations include its 515-pin s-PBGA (CBP) package, absence of POWERVR SGX (vs. AM3715), 45-nm process node, SmartReflex™ AVS power management, and compatibility with OMAP™3 architecture for legacy migration paths.

Technical Context

The AM3703CBP implements an in-order, dual-issue, superscalar ARMv7-A architecture with TrustZone® security extensions, Thumb®-2 instruction set, and NEON™ SIMD coprocessor. Its memory subsystem includes 32KB L1 instruction and data caches (4-way set-associative), 256KB unified L2 cache, 64KB on-chip SRAM, and 32KB ROM.

Peripheral integration centers on a hierarchical L3/L4 interconnect supporting concurrent access to SDRC (SDRAM controller), GPMC (general-purpose memory controller), multiple McBSP audio ports with SIDETONE, HDQ/1-Wire, four UARTs (one with IrDA), three I²C controllers, five McBSPs, four McSPI ports, and dual USB subsystems (OTG + multiport host) with ULPI or serial PHY interface options.

Key Specifications

ParameterValue and Actual Design Meaning
Core ArchitectureARM Cortex-A8, ARMv7-A, TrustZone®, Thumb-2 - enables secure real-time OS and Linux execution with hardware virtualization support
Max Operating Frequency1 GHz - delivers >2× ARMv6 performance for UI rendering, video decode, and control-loop processing
L1 Cache32KB instruction + 32KB data (4-way set-associative) - reduces memory latency for deterministic interrupt response
L2 Cache256KB unified - improves throughput for multi-threaded workloads and bursty peripheral DMA transfers
Process Technology45-nm CMOS - enables lower dynamic power vs. 65-nm predecessors while sustaining 1-GHz operation
SmartReflex AVSDynamic voltage and frequency scaling - automatically adjusts core voltage based on silicon characterization and temperature for optimal power/performance trade-off
Package515-pin s-PBGA (CBP), 0.5 mm top / 0.4 mm bottom ball pitch - supports POP memory stacking and high I/O density for compact board layouts

Pinout & Package

The AM3703CBP uses a 515-ball, 0.5-mm-pitch (top)/0.4-mm-pitch (bottom) s-PBGA package designated CBP, optimized for Package-on-Package (POP) memory stacking. Ball assignment follows TI's documented quadrant layout (A–D) with dedicated power domains (vdd_core, vdd_mpu_iva, vdds_mem, vdda_dpll_per, etc.) and multiplexed function pins.

Pin/TerminalCircuit RoleDesign Meaning
GPMC_A0–A11Address bus for General Purpose Memory ControllerDirect glueless interface to NOR/NAND flash, SRAM, FPGA; 12-bit address supports up to 128MB per chip select
GPMC_D0–D15Data bus for General Purpose Memory Controller16-bit bidirectional data path enabling high-speed parallel memory access without external logic
SDRC_D0–D31Data bus for SDRAM Controller32-bit wide interface to LPDDR/DDR2 SDRAM; supports 1GB total address space with configurable timing
USB0_DATA[0:7]UTMI+ data lines for HS USB OTG8-bit parallel interface compliant with ULPI v1.1; eliminates need for external transceiver in cost-sensitive designs
MCBSP1_FSX/CLKX/DR/DXFrame sync, clock, receive, transmit for McBSP1Full-duplex synchronous serial port supporting I²S, PCM, and TDM protocols for audio codec interfacing

Key Features

FeatureDesign Value
NEON SIMD CoprocessorAccelerates signal processing, image filtering, and cryptographic operations without CPU intervention
Camera ISP with BT.656 InterfaceHardware-accelerated CCD/CMOS capture, resize engine (1/4× to 4×), and YCbCr 4:2:2 video input handling
Triple MMC/SDIO ControllersSupports SD 3.0, eMMC 4.5, and SDIO Wi-Fi/BT modules with hardware CRC/ECC for NAND reliability
System DMA (SDMA)32-channel controller offloading CPU from memory-to-peripheral transfers; critical for low-latency video/audio streaming
TrustZone Security ExtensionsHardware-enforced separation between secure and non-secure worlds for bootloader integrity and credential storage

Applications

Portable Data TerminalIndustrial HMI Panel

Use Scenario: Rugged handheld device scanning barcodes, capturing signatures, and running Linux-based warehouse management software.

IC Role / Device Role / Timing Role: Main application processor executing Qt-based GUI, managing USB HID peripherals, and driving resistive touchscreen via GPIO and SPI.

Use Value: 1-GHz Cortex-A8 core ensures sub-100ms UI response; integrated SDMA enables zero-CPU-overhead barcode image transfer from CMOS sensor to memory.

Use Scenario: DIN-rail mounted panel PC controlling PLC I/O, displaying real-time process data, and logging to SD card.

IC Role / Device Role / Timing Role: Central MPU coordinating EtherCAT master stack, rendering SVG-based SCADA visuals on LVDS display, and managing secure firmware updates.

Use Value: SmartReflex AVS reduces thermal load in enclosed enclosures; GPMC allows direct connection to industrial FPGA co-processors for custom I/O expansion.

Medical Imaging GatewayAutomotive Infotainment Head Unit

Use Scenario: Edge gateway aggregating DICOM images from ultrasound probes and forwarding over Ethernet to PACS servers.

IC Role / Device Role / Timing Role: Image acquisition processor interfacing with BT.656 video inputs, performing JPEG compression via NEON, and managing encrypted network stacks.

Use Value: Dedicated camera ISP eliminates external video decoder IC; 256KB L2 cache sustains 30 fps 720p encode without DDR bandwidth contention.

Use Scenario: In-vehicle head unit rendering navigation maps, mixing audio sources, and supporting Apple CarPlay via USB.

IC Role / Device Role / Timing Role: Application SoC running Android Automotive OS, driving dual-display output (LCD + rear-seat HDMI), and managing USB OTG + multiport host simultaneously.

Use Value: Dual USB subsystems enable concurrent smartphone mirroring and USB storage playback; McBSP2 with SIDETONE supports hands-free telephony echo cancellation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM application processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AM3715CBPIncludes POWERVR SGX graphics accelerator; otherwise identical pinout, package, and peripheral setRequired for OpenGL ES 2.0-accelerated UIs or video composition; unnecessary for headless or basic GUI use casesSelect AM3715CBP only when GPU acceleration is mandatory; AM3703CBP reduces BOM cost where graphics are software-rendered or absent
AM3358BZCZ100ARM Cortex-A8 at 1 GHz, but single-core only, no NEON, no SGX, smaller 324-pin package, lacks McBSP SIDETONE and dual USB subsystemsBetter suited for cost-optimized, lower-I/O industrial gateways; lacks camera ISP and advanced audio features of AM3703Choose AM3358BZCZ100 for simpler, lower-power applications where camera/video/audio are not required

Compared with AM3715CBP, AM3703CBP removes the SGX GPU to reduce cost and power, making it ideal for non-graphic-intensive HMI; versus AM3358BZCZ100, it offers richer multimedia I/O and higher peripheral concurrency at the expense of larger footprint and higher complexity.

Availability

AM3703CBP is available at Aetrix Electronics and suitable for portable data terminals, industrial HMI panels, and medical imaging gateways requiring stable component supply across extended product lifecycles.

Supply support for AM3703CBP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies with leadership in industrial, automotive, and communications markets.

The AM37x Sitara™ family was designed for high-performance embedded applications demanding Linux/Android runtime, rich multimedia I/O, and industrial-grade reliability - bridging the gap between application processors and microcontrollers.

FAQ

What distinguishes AM3703CBP from AM3715CBP?

The AM3703CBP omits the POWERVR SGX graphics accelerator present in the AM3715CBP, resulting in lower power consumption, reduced thermal output, and lower unit cost. Both share identical pinout, package (CBP), core architecture (Cortex-A8), memory subsystem, and peripheral set - making AM3703CBP ideal for applications where GPU acceleration is unnecessary, such as headless controllers or software-rendered UIs.

Does AM3703CBP support camera interfaces?

Yes, the AM3703CBP integrates a dedicated Camera Image Signal Processor (ISP) supporting parallel CMOS/CCD sensors with BT.601/BT.656 digital YCbCr 4:2:2 (8-/10-bit) input, hardware resize (1/4× to 4×), and temporal dithering. This enables direct connection to image sensors without external video decoders, reducing system complexity and BOM count.

What power management features does AM3703CBP include?

The AM3703CBP implements SmartReflex™ Adaptive Voltage Scaling (AVS) with dynamic voltage and frequency scaling (DVFS), allowing real-time adjustment of core voltage (0.9–1.2 V) and clock frequency (300–1000 MHz) based on workload and junction temperature. This minimizes active power without compromising deterministic performance in thermally constrained environments.

Is AM3703CBP pin-compatible with OMAP3 processors?

Yes, the AM3703CBP is fully backward compatible with OMAP™3 architecture at the pin, software, and peripheral level. Its documentation explicitly states compatibility with previous Cortex-A8 Sitara and OMAP processors, enabling drop-in replacement in existing designs targeting OMAP3530 or OMAP3630 - provided power delivery and thermal design accommodate the 45-nm process characteristics.

What operating systems are supported on AM3703CBP?

Texas Instruments provides full software support for AM3703CBP with Linux (including mainline kernel patches), Android (Gingerbread through KitKat), and Windows Embedded CE - all available free of charge. TI's Processor SDK includes BSPs, drivers, graphics libraries (OpenGL ES 1.1), and development tools validated specifically for AM3703CBP hardware configurations.

AM3703CBP Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
515-WFBGA, FCBGA
Series:
Sitara™
Packaging:
Tray
Product Status:
Not For New Designs
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
800MHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Display & Interface Controllers:
LCD
Ethernet:
-
SATA:
-
USB:
USB 2.0 (4)
Voltage - I/O:
1.8V
Operating Temperature:
0°C ~ 90°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
515-POP-FCBGA (12x12)
Additional Interfaces:
HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART

AM3703CBP FAQ

1.How can I place an order for AM3703CBP through Aetrix?

Please submit a Request for Quotation (RFQ) for AM3703CBP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AM3703CBP reliable?

The price and inventory of AM3703CBP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM3703CBP is usually 5 days.

3.What payment methods are accepted for AM3703CBP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM3703CBP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AM3703CBP?

AM3703CBP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AM3703CBP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AM3703CBP?

For technical support, including AM3703CBP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM3703CBP requirements.

6.How does Aetrix verify that AM3703CBP is sourced from the original manufacturer or authorized distributors?

All AM3703CBP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM3703CBP meets industry standards.

7.What is the process for return or replacement of AM3703CBP?

All AM3703CBP units undergo pre-shipment inspection (PSI). If there is an issue with AM3703CBP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AM3703CBP part is unused and in its original packaging.

Return procedure for AM3703CBP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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