Texas Instruments AM3703CBP100

Overview

AM3703CBP100 from Texas Instruments is a Sitara™ ARM® Cortex™-A8 microprocessor operating up to 1 GHz with adaptive core voltage (0.9–1.2 V), integrated 256KB L2 cache, POWERVR SGX graphics accelerator (AM3715 only - AM3703 excludes SGX), and 188 multiplexed GPIO pins. It supports Linux, Android, and Windows Embedded CE, targeting portable data terminals and industrial HMI systems requiring high-performance embedded processing with low-power operation.

For engineers reviewing the AM3703CBP100 datasheet, AM3703CBP100 pinout, AM3703CBP100 application, or AM3703CBP100 equivalent, key selection criteria include its 515-pin s-PBGA (CBP) package, absence of POWERVR SGX graphics, SDRAM controller with SMS/rotation engine, SmartReflex™ AVS power management, and compatibility with OMAP™3 architecture for legacy migration paths.

Technical Context

The AM3703CBP100 implements an in-order, dual-issue, superscalar ARMv7-A architecture with TrustZone® security extensions, Thumb®-2 instruction set, and NEON™ SIMD coprocessor. It integrates a 32KB/32KB 4-way L1 instruction/data cache and 256KB unified L2 cache, with memory subsystems including SDRC (16-/32-bit SDRAM) and GPMC (NOR/NAND/SRAM).

Its peripheral interconnect uses hierarchical L3/L4 buses supporting concurrent access by multiple masters. Power management includes SmartReflex™ Level 2 with dynamic voltage and frequency scaling (DVFS), two independent SmartReflex control modules, and support for OPP (Operating Performance Point) optimization across commercial and extended temperature grades.

Key Specifications

Pinout & Package

AM3703CBP100 is housed in a 515-ball, 0.5 mm (top)/0.4 mm (bottom) pitch, plastic ball grid array (s-PBGA-N515) package designated CBP. This package supports Package-on-Package (POP) memory stacking and is mechanically identical to the AM3715CBP100 variant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM microprocessor applications.

Compared with AM3715CBP100, AM3703CBP100 removes SGX to reduce cost and power while retaining full CPU/peripheral compatibility; versus AM3517BZCNA, it offers higher clock speed, more GPIO, and enhanced USB/McBSP capabilities at the expense of larger package and thermal budget.

Availability

AM3703CBP100 is available at Aetrix Electronics and suitable for portable data terminals, industrial HMI systems, and medical imaging devices requiring stable component supply across long product lifecycles.

Supply support for AM3703CBP100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and consumer markets.

The AM37x Sitara™ MPU product line targets high-performance, low-power embedded applications requiring Linux/Android support, rich peripheral integration, and seamless migration from OMAP3 platforms.

FAQ

Does AM3703CBP100 include the POWERVR SGX graphics accelerator?

No, AM3703CBP100 does not include the POWERVR SGX graphics accelerator. That feature is exclusive to the AM3715CBP100 variant. The AM3703CBP100 shares identical CPU core, memory subsystem, and peripheral specifications but omits SGX to reduce cost and power consumption for applications relying solely on CPU-based rendering or simpler 2D display pipelines.

What is the maximum supported SDRAM interface width and clock rate for AM3703CBP100?

The AM3703CBP100 supports a 16-bit or 32-bit SDRAM interface via its SDRC module, with a maximum clock rate of 167 MHz (333 MT/s). It interfaces directly with LPDDR, DDR2, and mobile SDRAM using hardware-controlled memory scheduling (SMS) and rotation engine logic to optimize bandwidth and minimize latency in real-time OS environments.

Is AM3703CBP100 pin-compatible with AM3715CBP100?

Yes, AM3703CBP100 is fully pin-compatible with AM3715CBP100 in the CBP package. Both share identical 515-ball s-PBGA mechanical layout, power domains, and signal assignments. The only functional difference is the absence of POWERVR SGX in AM3703CBP100, making it a drop-in replacement where graphics acceleration is not required.

Which operating systems are officially supported on AM3703CBP100?

Texas Instruments provides official board support packages (BSPs) for Linux, Android, and Windows Embedded CE on AM3703CBP100. These are available free of charge from TI's processor wiki and SDK repositories, with validated drivers for all major peripherals including SDRC, GPMC, McBSP, McSPI, USB, and DSS.

What power management features does AM3703CBP100 implement?

AM3703CBP100 implements SmartReflex™ Level 2 technology with two independent control modules, enabling dynamic voltage and frequency scaling (DVFS) based on real-time process, voltage, and temperature monitoring. It supports multiple Operating Performance Points (OPPs) and adaptive core logic voltage (0.9–1.1 V), reducing active power by up to 30% compared to fixed-voltage operation under variable workloads.