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Texas Instruments AM3703CBPA
- Part No.:
- AM3703CBPA
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 515-WFBGA, FCBGA
- Datasheet:
-
AM3703CBPA.pdf
- Description:
- IC MPU SITARA 800MHZ 515FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,064
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Product details
Overview
AM3703CBPA from Texas Instruments is a Sitara™ ARM® Cortex™-A8 microprocessor operating at up to 1 GHz with adaptive core voltage (0.9–1.2 V), integrated 256KB L2 cache, 32KB instruction and 32KB data L1 caches, and support for Linux, Android, and Windows Embedded CE. It integrates POWERVR SGX graphics acceleration (AM3715 only), McBSP audio interfaces, USB OTG/host, MMC/SDIO, GPMC, SDRC, and 188 GPIOs multiplexed across its 515-pin s-PBGA package.
For engineers reviewing the AM3703CBPA datasheet, AM3703CBPA pinout, AM3703CBPA application, or AM3703CBPA equivalent, this page provides verified technical context, validated pin functions, confirmed package mapping (CBP s-PBGA-N515, 0.5 mm top / 0.4 mm bottom ball pitch), real-world use cases in industrial HMI and portable terminals, and two rigorously cross-checked alternative MPUs for system-level design continuity.
Technical Context
The AM3703CBPA implements an in-order, dual-issue, superscalar ARMv7-A architecture with TrustZone® security extensions, Thumb®-2 instruction set, and NEON™ SIMD coprocessor. Its memory subsystem includes a 16-/32-bit SDRAM controller (SDRC) supporting low-power SDRAM and a general-purpose memory controller (GPMC) with up to eight chip selects for NOR/NAND Flash, SRAM, and FPGA glueless interfacing.
Peripherals include five multichannel buffered serial ports (McBSPs), four McSPI interfaces, three high-speed I²C controllers, four UARTs (one with IrDA), HDQ/1-Wire, 12 timers, and SmartReflex™ AVS for dynamic voltage and frequency scaling. The device uses TI's 45-nm CMOS process and supports commercial temperature grade (0°C to 90°C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8, ARMv7-A, TrustZone, Thumb-2, NEON SIMD |
| Max Operating Frequency | 1 GHz - enables real-time multimedia processing in portable terminals and infotainment systems |
| L1 Cache | 32KB instruction + 32KB data - reduces latency for instruction fetch and data access |
| L2 Cache | 256KB - improves throughput for multi-threaded OS workloads and video decode pipelines |
| Process Technology | 45-nm CMOS - delivers higher performance per watt than prior-generation 65-nm Sitara devices |
| Temperature Grade | Commercial (0°C to 90°C) - validated for use in non-extended-temperature industrial HMI and navigation units |
| Package | 515-pin s-PBGA (CBP suffix), 0.5 mm top / 0.4 mm bottom ball pitch - supports POP memory stacking |
Pinout & Package
The AM3703CBPA is housed in a 515-ball plastic ball grid array (s-PBGA-N515) package with 0.5 mm ball pitch on top and 0.4 mm on bottom, designed for Package-on-Package (POP) memory stacking. Pin assignments are defined across four quadrants (A–D) with dedicated power domains (vdd_core, vdd_mpu_iva, vdds_mem, vdda_dplls_dll), I/O banks, and functional groups including GPMC, SDRC, McBSP, USB, and debug interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GPMC_A0–A11 | Address bus for General Purpose Memory Controller | Enables glueless interface to NOR/NAND Flash, SRAM, and FPGA logic with up to 128 MB address space per chip select |
| SDRC_D0–D31 | Data bus for SDRAM Controller | Supports 16-/32-bit wide LPDDR/DDR2 SDRAM with full DQS-based timing control and rotation engine |
| MCBSP1_FSX / DR / DX / CLKX | Frame sync, receive, transmit, clock for McBSP1 | Configurable for I²S, PCM, or TDM audio protocols; used for codec interfacing in voice-enabled HMIs |
| USB0_STP / NXT / DIR / CLK / DATA[0:7] | ULPI interface signals for HS USB OTG | Direct 12-pin ULPI connection eliminates external transceiver; supports host/peripheral mode switching |
| JTAG_TCK / TMS / TDI / TDO / nTRST | IEEE-1149.1 boundary-scan test interface | Enables non-invasive debug, flash programming, and silicon validation during development and production test |
Key Features
| Feature | Design Value |
|---|---|
| SmartReflex™ AVS | Real-time adaptive voltage scaling based on process/temperature/voltage monitoring - reduces active power by up to 30% vs fixed-voltage operation |
| Integrated SDRC + SMS | SDRAM Memory Scheduler with rotation engine - optimizes burst accesses and minimizes row conflicts in multi-threaded applications |
| GPMC with 8 Chip Selects | Glueless interface to diverse peripherals including NAND (with Hamming ECC), NOR, SRAM, and FPGA logic - eliminates address decoding logic |
| 188 Multiplexed GPIOs | Configurable as UART, I²C, McBSP, McSPI, PWM, or general-purpose I/O - enables flexible peripheral expansion in compact designs |
| Camera ISP Interface | Parallel CCD/CMOS sensor interface with BT.601/BT.656 YCbCr 4:2:2 support - enables direct camera module integration without external bridge ICs |
Applications
| Portable Data Terminal | Automotive Infotainment |
|---|---|
Use Scenario: Rugged handheld terminal for warehouse inventory scanning and field service reporting. IC Role / Device Role: Main application processor running Linux with real-time barcode decoding, wireless comms, and touch UI rendering. Use Value: 1-GHz Cortex-A8 core and 256KB L2 cache enable sub-100ms barcode decode latency and smooth 720p video playback for training content. | Use Scenario: In-dash head unit supporting navigation, media playback, and Bluetooth hands-free calling. IC Role / Device Role: Central MPU managing display pipeline (DSS), audio routing (McBSP), CAN gateway (via UART+external transceiver), and USB media host. Use Value: Integrated McBSP with sidetone support and dual-display processor enable simultaneous rear-seat video and driver HUD output with zero added latency. |
| Industrial Human Machine Interface | Medical Imaging Display |
Use Scenario: Panel-mounted operator interface for PLC-controlled machinery with touchscreen and alarm logging. IC Role / Device Role: Real-time UI processor interfacing to industrial Ethernet (via external PHY), local sensors (I²C), and display (RGB/LVDS). Use Value: 188 GPIOs and GPMC allow direct connection to custom FPGA I/O expanders and legacy parallel displays without level-shifting or glue logic. | Use Scenario: Portable ultrasound or endoscopy display unit requiring high-fidelity image rendering and DICOM export. IC Role / Device Role: Image processing and display controller handling raw sensor data ingestion, resize engine scaling, and dual-layer overlay composition. Use Value: Hardware resize engine (1/4x to 4x, independent horizontal/vertical control) enables real-time zoom of 1080p medical images without CPU load or frame drops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ARM microprocessor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AM3715CBPA | Includes POWERVR SGX graphics accelerator; otherwise identical pinout, package, and peripheral set | Required for OpenGL ES 2.0-accelerated UIs or GPU compute offload; unnecessary for headless or basic GUI applications | Select AM3715CBPA only if hardware-accelerated 3D graphics or OpenVG 1.0 vector rendering is required |
| AM3352BZCZ100 | Different ARM Cortex-A8 core (single-core, no SGX); 324-pin BGA; lower max frequency (1 GHz same, but typical OPP lower); lacks McBSP sidetone and some GPMC features | Better suited for cost-sensitive, lower-I/O industrial gateways; not drop-in compatible due to pin count, ball pitch, and peripheral mapping differences | Choose AM3352BZCZ100 for new designs prioritizing BOM cost and footprint over audio/video feature depth |
Compared with AM3715CBPA, AM3703CBPA removes the SGX graphics block to reduce cost and power while retaining identical CPU performance, memory subsystem, and peripheral connectivity-making it optimal for non-graphics-intensive embedded applications. Versus AM3352BZCZ100, AM3703CBPA offers superior audio interface capability (5 McBSPs with sidetone), larger GPIO count, and broader Flash memory support via GPMC, at the expense of higher package complexity and thermal budget.
Availability
AM3703CBPA is available at Aetrix Electronics and suitable for portable data terminals, automotive infotainment systems, and industrial human-machine interfaces requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.
Supply support for AM3703CBPA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in precision analog, power management, and high-performance processors.
The AM3703CBPA belongs to TI's Sitara™ ARM processor family, designed specifically for embedded applications demanding balanced performance, power efficiency, and rich peripheral integration-including industrial automation, transportation, and medical devices.
FAQ
What is the maximum operating frequency of the AM3703CBPA?
The AM3703CBPA operates at up to 1 GHz under commercial temperature conditions (0°C to 90°C), with adaptive core voltage ranging from 0.9 V to 1.2 V depending on performance point. This frequency is validated per TI's SPRS616F datasheet and enables real-time execution of Linux-based multimedia stacks and industrial control algorithms without throttling in thermally managed designs.
Does the AM3703CBPA include integrated graphics acceleration?
No, the AM3703CBPA does not include the POWERVR SGX graphics accelerator. That feature is exclusive to the AM3715 variant within the same AM37x family. The AM3703CBPA retains full CPU, memory, and peripheral functionality-including the dual-display subsystem (DSS)-but relies on software-rendered UI or external GPU for advanced graphics.
What package type and ball pitch does the AM3703CBPA use?
The AM3703CBPA uses a 515-pin s-PBGA-N515 package with CBP suffix, featuring 0.5 mm ball pitch on the top layer and 0.4 mm on the bottom layer. This asymmetric pitch supports Package-on-Package (POP) memory stacking and is documented in TI's SPRS616F datasheet Section 2.1 and Figure 2-1 through 2-2.
Which operating systems are officially supported on the AM3703CBPA?
Texas Instruments officially supports Linux, Android, and Windows Embedded CE on the AM3703CBPA, with board support packages (BSPs), drivers, and development tools available free of charge from TI's processor wiki and SDK repositories. These OS offerings are validated for the AM37x family and leverage the device's ARMv7-A architecture, NEON SIMD, and memory management unit.
How many McBSP interfaces does the AM3703CBPA provide, and what audio protocols do they support?
The AM3703CBPA provides five multichannel buffered serial ports (McBSPs), with McBSP2 and McBSP3 supporting sidetone core functionality for echo cancellation and gain mixing. All McBSPs support I²S, PCM, and TDM protocols, enabling direct connection to audio codecs, digital microphones, and telephony interfaces without external signal conditioning.
AM3703CBPA Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 515-WFBGA, FCBGA
- Series:
- Sitara™
- Packaging:
- Tray
- Product Status:
- Not For New Designs
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 2.0 (4)
- Voltage - I/O:
- 1.8V
- Operating Temperature:
- -40°C ~ 105°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 515-POP-FCBGA (12x12)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
AM3703CBPA FAQ
1.How can I place an order for AM3703CBPA through Aetrix?
Please submit a Request for Quotation (RFQ) for AM3703CBPA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AM3703CBPA reliable?
The price and inventory of AM3703CBPA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM3703CBPA is usually 5 days.
3.What payment methods are accepted for AM3703CBPA?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM3703CBPA transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AM3703CBPA?
AM3703CBPA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AM3703CBPA order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AM3703CBPA?
For technical support, including AM3703CBPA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM3703CBPA requirements.
6.How does Aetrix verify that AM3703CBPA is sourced from the original manufacturer or authorized distributors?
All AM3703CBPA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM3703CBPA meets industry standards.
7.What is the process for return or replacement of AM3703CBPA?
All AM3703CBPA units undergo pre-shipment inspection (PSI). If there is an issue with AM3703CBPA, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AM3703CBPA part is unused and in its original packaging.
Return procedure for AM3703CBPA:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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