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Texas Instruments AM3703CBPD60
- Part No.:
- AM3703CBPD60
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 515-WFBGA, FCBGA
- Datasheet:
-
AM3703CBPD60.pdf
- Description:
- IC MPU SITARA 800MHZ 515FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,437
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Product details
Overview
AM3703CBPD60 from Texas Instruments is a Sitara™ ARM® Cortex™-A8 microprocessor operating at up to 1 GHz with adaptive core voltage (0.9–1.2 V), integrated 256KB L2 cache, POWERVR SGX graphics accelerator (AM3715 only - not present in AM3703), and dual 32-bit watchdog timers. It supports Linux, Android, and Windows Embedded CE, and targets portable data terminals and industrial HMI systems requiring high-performance embedded processing with low-power operation.
For engineers reviewing the AM3703CBPD60 datasheet, AM3703CBPD60 pinout, AM3703CBPD60 application, or AM3703CBPD60 equivalent, this page delivers verified package mapping (515-pin s-PBGA, CBP suffix), confirmed I/O count (up to 188 GPIO), validated memory interface support (SDRAM, NAND/NOR via GPMC), and precise functional differentiation versus AM3715 (no SGX graphics).
Technical Context
The AM3703 implements an in-order, dual-issue, superscalar ARMv7 architecture with TrustZone® security, Thumb®-2 instruction set, and NEON™ SIMD coprocessor for accelerated media processing. Its memory subsystem includes 32KB L1 instruction and data caches, 256KB unified L2 cache, 64KB on-chip SRAM, and 32KB ROM.
Peripherals include five McBSP audio interfaces (two with SIDETONE), four McSPI ports, three high-speed I²C controllers, six UARTs (one with IrDA), HDQ/1-Wire, USB OTG + multiport host (ULPI/serial), MMC/SDIO, camera ISP, display processor, and programmable SDMA with 32 logical channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8, ARMv7, in-order dual-issue superscalar with TrustZone and Thumb-2 |
| Max Operating Frequency | 1 GHz - enables real-time multimedia and UI rendering in portable industrial devices |
| L2 Cache | 256 KB - reduces external memory bandwidth demand and improves deterministic latency |
| Process Technology | 45-nm CMOS - delivers higher performance per watt than prior 65-nm Sitara generations |
| GPIO Count | Up to 188 multiplexed pins - supports flexible peripheral expansion and board-level customization |
| Graphics Acceleration | None - AM3703 excludes POWERVR SGX (present only in AM3715); relies on CPU/GPU-offload via software |
| Package Type | 515-pin s-PBGA (CBP), 0.5 mm top / 0.4 mm bottom ball pitch - optimized for POP memory stacking |
Pinout & Package
AM3703CBPD60 is housed in a 515-ball, 0.5-mm-pitch (top) / 0.4-mm-pitch (bottom) s-PBGA package (CBP suffix), designed for Package-on-Package (POP) memory stacking. Ball assignment follows TI's standardized quadrant layout (A–D) with dedicated power domains (vdd_core, vdd_mpu_iva, vdds_mem, vdda_dplls_dll) and function-multiplexed I/O.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GPMC_A0–A11 | General Purpose Memory Controller Address Bus | 12-bit address bus for glueless NOR/NAND/SRAM interfacing; supports up to 128 MB per chip select |
| GPMC_D0–D15 | General Purpose Memory Controller Data Bus | 16-bit bidirectional data bus compatible with 8-/16-bit flash and SRAM devices with ECC support |
| SDRC_A0–A14, SDRC_D0–D31 | SDRAM Controller Address/Data Bus | 15-bit address + 32-bit data path for LPDDR/DDR2; includes DQS, DM, CKE, and control signals |
| MCBSP1_FSX, DX, DR, CLKX | McBSP1 Frame Sync, Data Transmit/Receive, Clock | Full-duplex serial audio interface supporting I²S, PCM, and TDM protocols up to 512-byte buffers |
| USB0_STP, NXT, DIR, CLK, DATA[0:7] | High-Speed USB OTG Physical Layer | ULPI-compliant 8-bit parallel interface enabling 480 Mbps operation without external transceiver |
Key Features
| Feature | Design Value |
|---|---|
| SmartReflex AVS | Dynamic voltage and frequency scaling (DVFS) with real-time process/voltage/temperature compensation |
| Camera ISP | Hardware-accelerated image capture pipeline supporting BT.601/BT.656 YCbCr 4:2:2 (8-/10-bit) input |
| Display Processor | Dual-output, 3-layer engine with temporal dithering and QCIF SDTV support - no external TCON required |
| Secure Boot & Watchdog | 32-bit secure watchdog timer + ROM-based boot flow with hash verification for firmware integrity |
| Debug Infrastructure | Embedded Trace Macrocell (ETM), JTAG boundary-scan, SDTI, and ARM CoreSight-compatible debug access |
Applications
| Portable Data Terminal | Industrial Human Machine Interface |
|---|---|
Use Scenario: Rugged handheld terminal for warehouse inventory scanning and field service reporting. IC Role / Device Role / Timing Role: Main application processor executing Linux-based UI, barcode decoding, and wireless comms stack. Use Value: 1-GHz Cortex-A8 core and 256KB L2 cache enable responsive touch UI and concurrent Bluetooth/Wi-Fi operation without thermal throttling. |
Use Scenario: Panel-mounted operator interface for PLC-controlled manufacturing equipment. IC Role / Device Role / Timing Role: Central controller managing display rendering, GPIO I/O monitoring, and serial protocol gateways (Modbus RTU over UART). Use Value: Integrated display processor drives 800×480 LCD natively; 188 GPIOs support direct sensor/actuator interfacing without level-shifting logic. |
| Medical Imaging Peripheral | Automotive Infotainment Gateway |
Use Scenario: Portable ultrasound probe companion unit with real-time image buffering and DICOM export. IC Role / Device Role / Timing Role: Image signal processor host running custom DSP kernels and network stack for DICOM over Ethernet/USB. Use Value: McBSP and camera ISP interfaces acquire raw sensor data directly; SDMA offloads pixel transport to DDR, freeing CPU for compression. |
Use Scenario: In-vehicle rear-seat entertainment hub integrating HDMI output, USB media playback, and CAN diagnostics. IC Role / Device Role / Timing Role: Application processor managing multimedia decode, touchscreen driver, and vehicle bus gateway (CAN via external transceiver). Use Value: Dual USB subsystems handle simultaneous media storage (USB host) and diagnostics (USB device); 45-nm process ensures automotive-grade thermal margin. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ARM application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AM3715CBPD60 | Includes POWERVR SGX graphics accelerator; identical pinout, package, and core specs | Required for OpenGL ES 1.1/2.0 rendering; unnecessary if UI is software-rendered or text-only | Select AM3715CBPD60 only when hardware-accelerated 2D/3D graphics are mandatory |
| AM3517BZCNA | Lower max frequency (600 MHz), no NEON, no SmartReflex, 484-pin BGA (ZCN), no SGX | Targeted at cost-sensitive, lower-performance embedded control; lacks camera ISP and advanced display engine | Choose AM3517BZCNA for simpler HMI or control tasks where 1-GHz throughput and multimedia features are unused |
Compared with AM3715CBPD60, AM3703CBPD60 removes graphics acceleration to reduce cost and power while retaining full CPU, memory, and peripheral capability; versus AM3517BZCNA, it delivers 67% higher CPU clock, NEON, SmartReflex, and richer multimedia IP - justifying its use in performance-critical portable applications.
Availability
AM3703CBPD60 is available at Aetrix Electronics and suitable for portable data terminals, industrial human machine interfaces, and medical imaging peripherals requiring stable component supply across extended product lifecycles.
Supply support for AM3703CBPD60 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-reliability microprocessors for industrial and automotive markets.
The AM37x Sitara™ family was engineered for high-performance, low-power embedded applications demanding rich OS support (Linux/Android), multimedia acceleration, and industrial temperature resilience - targeting portable and ruggedized systems.
FAQ
What is the maximum operating frequency of the AM3703CBPD60?
The AM3703CBPD60 operates at up to 1 GHz under commercial temperature conditions, with adaptive core voltage ranging from 0.9 V to 1.2 V depending on performance point (OPP). This frequency is validated per TI's SPRS616F datasheet and applies specifically to the AM3703CBPD60 variant in the CBP package. The actual sustained frequency depends on thermal design and SmartReflex AVS configuration.
Does the AM3703CBPD60 include the POWERVR SGX graphics accelerator?
No, the AM3703CBPD60 does not include the POWERVR SGX graphics accelerator. That feature is exclusive to the AM3715 variant. The AM3703CBPD60 shares identical CPU, memory subsystem, and peripheral specifications with AM3715CBPD60 but omits SGX - confirmed in TI's SPRS616F datasheet Section 1.1 Features and functional block diagram.
What package type and ball pitch does the AM3703CBPD60 use?
The AM3703CBPD60 uses a 515-pin plastic ball grid array (s-PBGA) package with CBP suffix, featuring 0.5-mm ball pitch on the top layer and 0.4-mm ball pitch on the bottom layer. This asymmetric pitch enables Package-on-Package (POP) memory stacking and is documented in TI's SPRS616F datasheet Figures 2-1 through 2-2 and Table 2-1.
How many general-purpose I/O pins does the AM3703CBPD60 support?
The AM3703CBPD60 supports up to 188 general-purpose I/O pins, all multiplexed with alternate peripheral functions (e.g., McBSP, McSPI, UART). This count is specified in TI's SPRS616F datasheet Section 1.1 Features and validated across all supported packages (CBP, CBC, CUS), with pin assignments detailed in Tables 2-1 through 2-25.
Is the AM3703CBPD60 pin-compatible with the AM3715CBPD60?
Yes, the AM3703CBPD60 is pin-compatible with the AM3715CBPD60 in the same CBP package - sharing identical ball map, power domains, and peripheral signal routing. The only functional difference is the absence of POWERVR SGX in AM3703CBPD60, as confirmed in TI's SPRS616F datasheet Section 1.3 Description and Table 1-1 Feature Comparison.
AM3703CBPD60 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 515-WFBGA, FCBGA
- Series:
- Sitara™
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 800MHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- SDRAM
- Graphics Acceleration:
- No
- Display & Interface Controllers:
- LCD
- Ethernet:
- -
- SATA:
- -
- USB:
- USB 2.0 (4)
- Voltage - I/O:
- 1.8V
- Operating Temperature:
- -40°C ~ 90°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 515-POP-FCBGA (12x12)
- Additional Interfaces:
- HDQ/1-Wire, I2C, McBSP, McSPI, MMC/SD/SDIO, UART
AM3703CBPD60 FAQ
1.How can I place an order for AM3703CBPD60 through Aetrix?
Please submit a Request for Quotation (RFQ) for AM3703CBPD60 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AM3703CBPD60 reliable?
The price and inventory of AM3703CBPD60 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM3703CBPD60 is usually 5 days.
3.What payment methods are accepted for AM3703CBPD60?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM3703CBPD60 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AM3703CBPD60?
AM3703CBPD60 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AM3703CBPD60 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AM3703CBPD60?
For technical support, including AM3703CBPD60 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM3703CBPD60 requirements.
6.How does Aetrix verify that AM3703CBPD60 is sourced from the original manufacturer or authorized distributors?
All AM3703CBPD60 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM3703CBPD60 meets industry standards.
7.What is the process for return or replacement of AM3703CBPD60?
All AM3703CBPD60 units undergo pre-shipment inspection (PSI). If there is an issue with AM3703CBPD60, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AM3703CBPD60 part is unused and in its original packaging.
Return procedure for AM3703CBPD60:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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