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Texas Instruments AM3715CBPNB
- Part No.:
- AM3715CBPNB
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- -
- Datasheet:
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AM3715CBPNB.pdf
- Description:
- AM3715CBP (NO B/I),DSP
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Product details
Overview
AM3715CBPNB from Texas Instruments is a high-performance Sitara™ ARM® Cortex™-A8 microprocessor with up to 1-GHz operation, 256KB L2 cache, POWERVR SGX graphics accelerator (AM3715 only), 45-nm CMOS process, and support for Linux, Android, and Windows Embedded CE. It integrates SDRAM controller, GPMC, USB OTG/host, McSPI, McBSP, MMC/SDIO, and camera ISP - deployed in portable data terminals, automotive infotainment, and medical imaging systems.
For engineers reviewing the AM3715CBPNB datasheet, AM3715CBPNB pinout, AM3715CBPNB application, or AM3715CBPNB equivalent, key selection considerations include its 515-pin s-PBGA (CBP) package, adaptive core voltage (0.9–1.2 V), SmartReflex™ AVS power management, and compatibility with OMAP™3 architecture for legacy migration paths.
Technical Context
The AM3715CBPNB implements an in-order, dual-issue, superscalar ARMv7-A architecture with TrustZone® security, Thumb®-2 instruction set, and NEON™ SIMD coprocessor. Its memory subsystem includes 32KB L1 instruction/data caches, 256KB unified L2 cache, 64KB on-chip SRAM, and 32KB ROM - all backed by a hierarchical L3/L4 interconnect supporting concurrent high-bandwidth peripherals.
Graphics acceleration is delivered via the tile-based POWERVR SGX engine (exclusive to AM3715), enabling up to 20 MPoly/sec and supporting OpenGLES 1.1/2.0 and OpenVG 1.0. The device features dedicated hardware blocks for camera image signal processing (ISP), display pipeline (dual-output 3-layer), and video decode acceleration (BT.601/BT.656 YCbCr 4:2:2 interface).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Core Architecture | ARM Cortex-A8, ARMv7-A, TrustZone®, Thumb-2 - enables secure real-time OS execution and binary compatibility with OMAP3. |
| Max Operating Frequency | 1 GHz - delivers >2× ARMv6 SIMD performance; supports OPP-based DVFS scaling down to 300/600/800 MHz for thermal/power optimization. |
| L2 Cache | 256 KB - reduces external memory bandwidth demand and improves deterministic latency for multimedia workloads. |
| Graphics Engine | POWERVR SGX - provides hardware-accelerated 3D rendering, programmable shaders, and industry-standard API support (OpenGLES/OpenVG). |
| Process Technology | 45-nm CMOS - enables low static/dynamic power consumption while sustaining high clock rates and integration density. |
| Package Type | 515-pin s-PBGA (CBP), 0.5 mm top / 0.4 mm bottom ball pitch - optimized for POP memory stacking and industrial thermal reliability. |
| Operating Temperature | –40°C to +105°C (extended grade) - qualified for automotive infotainment and industrial control environments. |
Pinout & Package
The AM3715CBPNB uses a 515-ball s-PBGA package (CBP suffix), with top-side 0.5 mm and bottom-side 0.4 mm ball pitch. This package supports Package-on-Package (POP) memory stacking and is mechanically distinct from the CBC (0.65/0.5 mm) and CUS (423-ball) variants.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| vdd_mpu_iva | MPU & IVA Subsystem Core Supply | Adaptive 0.9–1.2 V supply for Cortex-A8 core and IVA subsystem; regulated via SmartReflex AVS for dynamic voltage scaling. |
| sdrc_dqs0–sdrc_dqs3 | SDRAM Data Strobe | Differential DQS pairs for 32-bit wide DDR/DDR2 SDRAM interface; critical for timing closure in high-speed memory access. |
| gpmc_a0–gpmc_a11 | GPMC Address Bus | 12-bit multiplexed address bus for glueless interfacing to NOR/NAND flash, SRAM, and FPGA logic with up to 128 MB per chip select. |
| dss_data0–dss_data23 | Display Subsystem Data Bus | 24-bit parallel RGB/YUV video data path supporting dual independent display outputs (LCD + TV/CVBS/S-Video). |
| cam_pclk, cam_hs, cam_vs | Camera Interface Timing Signals | Pixel clock, horizontal sync, and vertical sync inputs for direct connection to CMOS/CCD imagers without external logic. |
| usb0_clk, usb0_stp, usb0_dir | USB OTG ULPI Interface | 12-pin ULPI physical layer interface supporting high-speed (480 Mbps) USB OTG operation with minimal board routing complexity. |
Key Features
| Feature | Design Value |
|---|---|
| SmartReflex™ AVS | Real-time adaptive voltage scaling across MPU and IVA domains - reduces dynamic power by up to 40% versus fixed-voltage operation. |
| Integrated Camera ISP | Hardware-accelerated image capture pipeline with BT.601/BT.656 8-/10-bit YCbCr 4:2:2 input, resize engine, and SIDETONE audio mixing. |
| Multi-protocol Serial Interfaces | 5 McBSP ports (2 with SIDETONE), 4 McSPI, 3 I2C, 4 UARTs (1 with IrDA) - enables simultaneous audio, sensor, display, and peripheral connectivity. |
| Memory Controller Flexibility | SDRC supports LPDDR/DDR/DDR2; GPMC supports NAND (with Hamming ECC), NOR, SRAM, and FPGA glueless interfaces - simplifies BOM and layout. |
| Debug & Trace Infrastructure | Embedded Trace Macrocell (ETM), SDTI, JTAG boundary-scan - enables cycle-accurate software profiling and hardware validation in production debug scenarios. |
Applications
| Portable Data Terminal | Automotive Infotainment |
|---|---|
Use Scenario: Rugged handheld terminal for warehouse logistics with barcode scanning, GPS navigation, and wireless data upload. IC Role / Device Role / Timing Role: Central application processor executing Linux-based HMI, managing camera-based barcode decode, USB host for peripheral docking, and SDIO for cellular/Wi-Fi modules. Use Value: Integrated ISP and McBSP enable direct camera/audio interface; 1-GHz Cortex-A8 ensures responsive UI and real-time location services without external co-processors. |
Use Scenario: In-vehicle head unit supporting navigation, media playback, rear-seat video, and Bluetooth hands-free calling. IC Role / Device Role / Timing Role: Primary SoC running Android Automotive OS, driving dual-display output (LCD instrument cluster + HDMI rear monitor), and processing CAN bus telemetry via serial interfaces. Use Value: POWERVR SGX graphics render smooth 3D maps; dual-display pipeline eliminates need for external TCON; extended temperature grade ensures reliability under dashboard thermal stress. |
| Medical Imaging Device | Industrial Human Machine Interface |
Use Scenario: Portable ultrasound or endoscopy system requiring real-time image acquisition, edge enhancement, and HDMI output to clinical monitors. IC Role / Device Role / Timing Role: Image processing hub receiving raw sensor data via parallel camera interface, applying hardware-accelerated resize and filtering, then outputting via DSS to HDMI encoder. Use Value: Dedicated ISP and resize engine offload CPU from pixel-level operations; 256KB L2 cache minimizes frame buffer latency; 45-nm process maintains low thermal footprint in sealed enclosures. |
Use Scenario: Factory-floor operator panel with touchscreen GUI, PLC communication, and real-time diagnostics logging. IC Role / Device Role / Timing Role: Real-time embedded controller running Linux RT kernel, interfacing to Modbus/RS-485 via UART/McBSP, and rendering vector-based HMI using OpenGL ES. Use Value: TrustZone isolation secures firmware updates; GPMC enables direct connection to industrial flash storage; 188 GPIO pins support custom I/O expansion without CPLD. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ARM application processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AM3703CBPNB | No POWERVR SGX graphics; identical core, memory, and peripheral configuration otherwise. | Suitable where 2D GUI or video playback suffices without 3D acceleration or OpenGLES compute workloads. | Select AM3703CBPNB when graphics requirements are limited to basic display composition and cost reduction is prioritized. |
| AM3517CZDN | Lower 600-MHz max frequency; no SGX; 423-pin CUS package; lacks camera ISP and some McBSP channels. | Targeted at cost-sensitive industrial control and single-display HMI where full AM3715 feature set is unnecessary. | Choose AM3517CZDN for simplified design, reduced PCB layer count, and lower thermal envelope - but verify peripheral count sufficiency. |
Compared with AM3703CBPNB and AM3517CZDN, the AM3715CBPNB uniquely delivers 1-GHz Cortex-A8 performance plus POWERVR SGX graphics and full camera ISP - making it the only option among the three for demanding multimedia, dual-display, or real-time imaging applications requiring hardware-accelerated pixel processing.
Availability
AM3715CBPNB is available at Aetrix Electronics and suitable for portable data terminals, automotive infotainment systems, and medical imaging devices requiring stable component supply across extended product lifecycles.
Supply support for AM3715CBPNB includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and digital signal technologies - with over 50 years of innovation in high-reliability microelectronics.
The AM3715CBPNB belongs to TI's Sitara™ ARM processor family, designed specifically for high-performance, low-power embedded applications requiring rich multimedia, real-time connectivity, and industrial-grade robustness.
FAQ
What is the maximum operating frequency of the AM3715CBPNB?
The AM3715CBPNB operates at up to 1 GHz under specified thermal and voltage conditions. It also supports lower operational points at 300 MHz, 600 MHz, and 800 MHz via Dynamic Voltage and Frequency Scaling (DVFS), allowing system designers to optimize power consumption based on real-time workload demands. This flexibility is managed through SmartReflex™ AVS and is fully supported in TI's Linux SDK for AM3715CBPNB.
Does the AM3715CBPNB include integrated graphics acceleration?
Yes, the AM3715CBPNB integrates the POWERVR SGX graphics accelerator, delivering up to 20 MPoly/sec and supporting OpenGLES 1.1/2.0 and OpenVG 1.0 APIs. This capability is exclusive to the AM3715 variant - the AM3703CBPNB omits SGX. The AM3715CBPNB's graphics engine enables hardware-accelerated 3D user interfaces, video compositing, and GPU compute tasks without requiring external graphics ICs.
What package type does the AM3715CBPNB use, and is it POP-capable?
The AM3715CBPNB uses a 515-pin s-PBGA package with CBP suffix, featuring 0.5 mm ball pitch on the top side and 0.4 mm on the bottom side. This mechanical configuration explicitly supports Package-on-Package (POP) implementation for stacked memory integration - a key differentiator from the CBC (0.65/0.5 mm) and CUS (423-pin) variants. TI documentation confirms POP compatibility for DDR2/LPDDR memory stacking with AM3715CBPNB.
Which operating systems are officially supported on the AM3715CBPNB?
Texas Instruments provides official, free-of-charge support for Linux, Android, and Windows Embedded CE on the AM3715CBPNB. These OS offerings include validated BSPs, drivers, and development tools through TI's Processor SDK. The AM3715CBPNB's ARMv7-A architecture and TrustZone® security extensions ensure compatibility with modern real-time and general-purpose embedded OS kernels.
How does the AM3715CBPNB handle camera image processing?
The AM3715CBPNB includes a dedicated Camera Image Signal Processor (ISP) that supports parallel CCD/CMOS sensors via BT.601/BT.656 8-/10-bit YCbCr 4:2:2 interfaces. It performs hardware-accelerated functions including resizing (1/4x to 4x), pixel format conversion, and SIDETONE audio mixing - all without CPU intervention. This ISP is confirmed in the AM3715CBPNB datasheet and distinguishes it from lower-tier Sitara processors like AM3517CZDN.
AM3715CBPNB Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- -
- Series:
- *
- Packaging:
- Bulk
- Product Status:
- Active
- Core Processor:
- -
- Number of Cores/Bus Width:
- -
- Speed:
- -
- Co-Processors/DSP:
- -
- RAM Controllers:
- -
- Graphics Acceleration:
- -
- Display & Interface Controllers:
- -
- Ethernet:
- -
- SATA:
- -
- USB:
- -
- Voltage - I/O:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
- Additional Interfaces:
- -
AM3715CBPNB FAQ
1.How can I place an order for AM3715CBPNB through Aetrix?
Please submit a Request for Quotation (RFQ) for AM3715CBPNB on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AM3715CBPNB reliable?
The price and inventory of AM3715CBPNB are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM3715CBPNB is usually 5 days.
3.What payment methods are accepted for AM3715CBPNB?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM3715CBPNB transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AM3715CBPNB?
AM3715CBPNB orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AM3715CBPNB order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AM3715CBPNB?
For technical support, including AM3715CBPNB datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM3715CBPNB requirements.
6.How does Aetrix verify that AM3715CBPNB is sourced from the original manufacturer or authorized distributors?
All AM3715CBPNB products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM3715CBPNB meets industry standards.
7.What is the process for return or replacement of AM3715CBPNB?
All AM3715CBPNB units undergo pre-shipment inspection (PSI). If there is an issue with AM3715CBPNB, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AM3715CBPNB part is unused and in its original packaging.
Return procedure for AM3715CBPNB:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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