Texas Instruments AM3892BCYG120
- Part No.:
- AM3892BCYG120
- Manufacturer:
- Texas Instruments
- Category:
- Microprocessors
- Package:
- 1031-BFBGA, FCBGA
- Datasheet:
-
AM3892BCYG120.pdf
- Description:
- IC MPU SITARA 1.2GHZ 1031FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,068
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AM3892BCYG120 from Texas Instruments is a Sitara™ ARM® Microprocessor (MPU) featuring an ARM Cortex-A8 core running up to 1.20 GHz, dual 32-bit DDR2/DDR3 interfaces supporting up to DDR3-1600, and integrated HD video processing subsystem (HDVPSS) with dual HD capture and display channels. It delivers high-performance embedded computing for industrial HMI, network edge devices, and interactive kiosks requiring rich multimedia and deterministic I/O.
For engineers reviewing the AM3892BCYG120 datasheet, AM3892BCYG120 pinout, AM3892BCYG120 application, or AM3892BCYG120 equivalent, key selection criteria include its 1031-pin FCBGA package, PCIe 2.0 x2-lane root complex/endpoint capability, dual Gigabit Ethernet MACs with GMII/MDIO, and absence of the SGX530 graphics engine found only in AM3894.
Technical Context
The AM3892BCYG120 implements an in-order, dual-issue, superscalar ARM Cortex-A8 processor with NEON™ multimedia acceleration, VFPv3 floating-point unit, and 32KB instruction + 32KB data L1 caches plus 256KB unified L2 cache. Its memory subsystem includes a Dynamic Memory Manager (DMM) enabling programmable multi-zone memory mapping and interleaving for optimized 2D block and interlaced video accesses.
Peripherals are interconnected via L3/L4 buses and managed by dedicated modules: the Power, Reset, and Clock Management (PRCM) module supports SmartReflex™ Level 2 dynamic voltage scaling across seven independent power domains; the Enhanced DMA (EDMA) controller provides 64 independent channels and 8 QDMA channels for offloading CPU-intensive data movement from HDVPSS, EMAC, McASP, and SATA controllers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | ARM Cortex-A8, up to 1.20 GHz - enables real-time Linux/Android execution with deterministic interrupt latency and Thumb-2 code density. |
| L1/L2 Cache | 32KB I-cache + 32KB D-cache + 256KB L2 cache - reduces external memory bandwidth pressure for burst-intensive video and networking workloads. |
| Memory Interface | Dual 32-bit DDR2/DDR3 - supports up to 2GB total address space and DDR3-1600 (800 MHz), critical for HD video frame buffering and OS runtime heap. |
| Video Processing | HDVPSS with two 165-MHz HD capture + two 165-MHz HD display channels - enables simultaneous SD/HD analog output and HDMI 1.3 transmission at 165-MHz pixel clock. |
| Connectivity | PCIe 2.0 x2 lanes, dual Gigabit EMAC (MII/GMII/MDIO), dual USB 2.0 (host/device), SATA 3.0 Gbps - provides scalable expansion for FPGA co-processing, wired networking, storage, and peripheral attachment. |
| I/O Flexibility | GPMC with 6 chip selects, 8-/16-bit multiplexed bus, NAND/NOR/SRAM support + ELM for BCH/Hamming ECC - enables glueless interfacing to legacy industrial peripherals and bootable NAND flash with hardware error correction. |
| Package | FCBGA-1031, 25.0 mm × 25.0 mm, 0.65-mm pitch with Via Channel™ technology - allows 0.8-mm PCB routing and 2-layer signal routing, reducing board cost and complexity. |
Pinout & Package
AM3892BCYG120 is housed in a 1031-ball Fine-Pitch Chip Array Ball Grid Array (FCBGA) package measuring 25.0 mm × 25.0 mm with 0.65-mm ball pitch. Via Channel™ technology enables use of 0.8-mm design rules on standard PCBs, improving routing efficiency and reducing layer count.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DEV_CLKIN | Reference Clock Input | 1.8-V tolerant input for 19.2–40 MHz crystal or oscillator; feeds PLLs for system clock generation and must meet jitter specs per Section 9.2. |
| DDR3_A[15:0] | DDR3 Address Bus | 16-bit address bus for DDR3 interface; operates at 1.5 V and requires matched trace lengths and controlled impedance for reliable 800-MHz operation. |
| DDR3_DQ[63:0] | DDR3 Data Bus | 64-bit bidirectional data bus; grouped into byte lanes with dedicated DQS/DQS# for source-synchronous timing and on-die termination calibration. |
| EMAC0_RXD[3:0] | Ethernet Receive Data | 4-bit nibble of GMII receive data from PHY; requires AC-coupling and length-matching to EMAC0_RX_CLK for setup/hold compliance. |
| HDMI_TX0_P/N | HDMI Differential Output | TMDS clock channel differential pair; routed as controlled-impedance 100-Ω differential traces to HDMI connector with DC-blocking capacitors. |
| USB0_DP/DM | USB 2.0 Differential Pair | Full-speed/high-speed data pair; routed as 90-Ω differential traces with <15-mm length difference and series 27-Ω resistors near PHY. |
Key Features
| Feature | Design Value |
|---|---|
| Dynamic Memory Manager (DMM) | Enables hardware-accelerated tiling and mirroring of video buffers in 0°/90°/180°/270° orientations - eliminates CPU overhead for UI rotation and video composition. |
| HD Video Processing Subsystem (HDVPSS) | Supports simultaneous SD analog output and HD digital HDMI output - allows dual-display HMI with independent resolution/scaling without external video encoder. |
| PCIe 2.0 x2 Lane Interface | Configurable as Root Complex or Endpoint - permits direct FPGA acceleration or connection to PCIe switch for multi-port networking expansion. |
| SmartReflex™ Level 2 Power Management | Real-time adaptive voltage scaling across seven independent power domains - reduces active power by up to 30% during variable workload conditions without software intervention. |
| Enhanced Direct Memory Access (EDMA) | 64 independent channels with scatter-gather linking - enables zero-CPU-copy transfers between HDVPSS frame buffers, EMAC packet buffers, and SATA disk sectors. |
Applications
| Industrial HMI Panels | Network Edge Gateways |
|---|---|
Use Scenario: Ruggedized touch-panel displays in factory automation control rooms, operating continuously under wide temperature ranges with real-time alarm overlays. IC Role / Device Role / Timing Role: Central application processor executing Linux-based HMI framework, driving dual LVDS/RGB displays and capturing operator inputs via GPIO/UART while managing EtherCAT or PROFINET stacks. Use Value: Integrated HDVPSS and dual EMAC eliminate need for external video encoder and PHY, reducing BOM cost and board area while maintaining sub-10-ms UI response time. | Use Scenario: Secure IoT gateway aggregating Modbus RTU, CAN, and RS-485 fieldbus data and forwarding to cloud via TLS-encrypted Ethernet/Wi-Fi. IC Role / Device Role / Timing Role: Primary network processor handling TCP/IP stack, firewall, and protocol translation; PCIe interface connects to Wi-Fi/BT combo module, SATA hosts encrypted SSD for local logging. Use Value: Dual Gigabit EMAC with hardware checksum offload and EDMA-accelerated packet buffering enable line-rate 1-Gbps throughput with <5% CPU utilization. |
| Interactive Point-of-Service Kiosks | Medical Imaging Terminals |
Use Scenario: Public-facing retail kiosks with HD touchscreen, barcode scanner, thermal printer, and NFC payment reader requiring secure boot and tamper-resistant firmware updates. IC Role / Device Role / Timing Role: Main application SoC running Android POS app; secure boot chain verified by on-chip ROM bootloader; USB 2.0 ports drive peripherals; SATA stores transaction logs. Use Value: ARM TrustZone™ support (implied by Cortex-A8 + TI security features) isolates payment processing in secure world, meeting PCI PTS v6 requirements without external secure element. | Use Scenario: Portable ultrasound or X-ray viewing station displaying DICOM images from PACS servers on high-resolution medical-grade LCD with annotation tools. IC Role / Device Role / Timing Role: High-throughput imaging processor decoding JPEG2000/MPEG-2 streams; DDR3-1600 interface sustains >2.5 GB/s memory bandwidth for 4K image rendering; HDMI 1.3 outputs calibrated grayscale video. Use Value: Hardware-accelerated video decode and DMM-enabled tiled memory access reduce frame decode latency to <30 ms, enabling real-time pan/zoom on 30-MP DICOM studies. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ARM MPU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AM3894BCYG120 | Includes SGX530 3D graphics engine (30 MTri/s); otherwise identical CPU, memory, and peripheral configuration. | Required for OpenGL ES 2.0-accelerated UIs, 3D medical visualization, or gaming kiosk frontends. | Select AM3894BCYG120 only if hardware-accelerated 3D graphics are mandatory; AM3892BCYG120 offers identical compute, I/O, and video capabilities at lower cost and power. |
| AM4376BZDN80 | ARM Cortex-A9 @ 1.0 GHz, PRU-ICSS for real-time I/O, single DDR3 interface, no PCIe, no SATA, smaller 324-pin package. | Better suited for cost-sensitive, real-time deterministic control (e.g., PLCs) where graphics and high-speed storage are unnecessary. | Choose AM4376BZDN80 for applications prioritizing PRU-based industrial protocol offload over PCIe/SATA bandwidth and dual-display HDVPSS. |
Compared with AM3894BCYG120, AM3892BCYG120 removes the SGX530 GPU but retains full ARM Cortex-A8 performance, dual DDR3, PCIe, SATA, and HDVPSS-making it optimal for video-centric, non-3D applications. Against AM4376BZDN80, AM3892BCYG120 delivers higher memory bandwidth, PCIe expandability, and richer multimedia, at the cost of larger footprint and higher power.
Availability
AM3892BCYG120 is available at Aetrix Electronics and suitable for industrial HMI, network edge gateways, and interactive point-of-service kiosks requiring stable component supply, long lifecycle support, and qualified automotive/industrial temperature grade availability.
Supply support for AM3892BCYG120 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company designing analog ICs, embedded processors, and digital signal processors for industrial, automotive, and communications markets.
The AM389x Sitara™ MPU product line targets high-performance embedded applications demanding rich user interfaces, HD video processing, and flexible connectivity-including industrial automation, human-machine interface, and network edge computing.
FAQ
What is the maximum operating frequency of the AM3892BCYG120 processor core?
The AM3892BCYG120 features an ARM Cortex-A8 core rated for up to 1.20 GHz operation under recommended conditions. This frequency is validated across the commercial temperature range (0°C to 90°C) with appropriate voltage scaling and thermal management. The actual sustained frequency depends on silicon revision, cooling solution, and SmartReflex™ Level 2 power management settings, but 1.20 GHz is the guaranteed maximum for the AM3892BCYG120 part number per SPRS681G revision March 2015.
Does the AM3892BCYG120 include the SGX530 graphics engine?
No, the AM3892BCYG120 does not include the SGX530 3D graphics engine. According to Table 3-1 in the AM389x datasheet (SPRS681G), the SGX530 is available only on the AM3894 device variant. The AM3892BCYG120 shares identical CPU, memory controller, HDVPSS, PCIe, EMAC, USB, SATA, and peripheral configurations with AM3894, but omits the SGX530 block-reducing die size, power consumption, and cost while retaining full 2D/HD video processing capability.
What package type and ball count does the AM3892BCYG120 use?
The AM3892BCYG120 uses a 1031-ball Fine-Pitch Chip Array Ball Grid Array (FCBGA) package with dimensions of 25.0 mm × 25.0 mm and a 0.65-mm ball pitch. It employs Via Channel™ technology to enable 0.8-mm PCB design rules and efficient two-layer routing. This package is shared with the AM3894CYG variant and is documented in the Device Information table on page 3 of SPRS681G.
Can the AM3892BCYG120 operate as a PCIe root complex?
Yes, the AM3892BCYG120 PCIe 2.0 port is configurable as either a root complex or endpoint, as explicitly stated in Section 1.1 Features and Section 3.1 Device Characteristics of SPRS681G. This flexibility allows the AM3892BCYG120 to host downstream PCIe devices (e.g., NVMe SSDs, FPGA accelerators, or Wi-Fi cards) or connect as a slave device to a host system-enabling both embedded system expansion and modular system integration.
What video output interfaces are supported by the AM3892BCYG120 HDVPSS?
The AM3892BCYG120 HDVPSS supports simultaneous HD and SD analog video output, digital HDMI 1.3 transmission (with HDCP support up to 165-MHz pixel clock), and three graphics layers. It includes dedicated HD and SD video DACs, HDMI transmitter with integrated PHY, and programmable display processing for scaling, blending, and OSD overlay-enabling dual-display HMI solutions without external video encoders or scalers.
AM3892BCYG120 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Package/Case:
- 1031-BFBGA, FCBGA
- Series:
- Sitara™
- Packaging:
- Tray
- Product Status:
- Obsolete
- Core Processor:
- ARM® Cortex®-A8
- Number of Cores/Bus Width:
- 1 Core, 32-Bit
- Speed:
- 1.2GHz
- Co-Processors/DSP:
- Multimedia; NEON™ SIMD
- RAM Controllers:
- DDR2, DDR3
- Graphics Acceleration:
- Yes
- Display & Interface Controllers:
- HDMI, HDVPSS
- Ethernet:
- 10/100/1000Mbps (2)
- SATA:
- SATA 3Gbps (1)
- USB:
- USB 2.0 + PHY (2)
- Voltage - I/O:
- 1.8V, 3.3V
- Operating Temperature:
- 0°C ~ 95°C (TJ)
- Grade:
- -
- Qualification:
- -
- Security Features:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 1031-FCBGA (25x25)
- Additional Interfaces:
- I2C, McASP, McBSP, SPI, SD/SDIO, UART
AM3892BCYG120 FAQ
1.How can I place an order for AM3892BCYG120 through Aetrix?
Please submit a Request for Quotation (RFQ) for AM3892BCYG120 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AM3892BCYG120 reliable?
The price and inventory of AM3892BCYG120 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM3892BCYG120 is usually 5 days.
3.What payment methods are accepted for AM3892BCYG120?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM3892BCYG120 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AM3892BCYG120?
AM3892BCYG120 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AM3892BCYG120 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AM3892BCYG120?
For technical support, including AM3892BCYG120 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM3892BCYG120 requirements.
6.How does Aetrix verify that AM3892BCYG120 is sourced from the original manufacturer or authorized distributors?
All AM3892BCYG120 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM3892BCYG120 meets industry standards.
7.What is the process for return or replacement of AM3892BCYG120?
All AM3892BCYG120 units undergo pre-shipment inspection (PSI). If there is an issue with AM3892BCYG120, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AM3892BCYG120 part is unused and in its original packaging.
Return procedure for AM3892BCYG120:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AM3892BCYG120 Tags

-
AT91SAM9260B-CU-999
Microchip Technology

-
AT91SAM9G25-CU
Microchip Technology

-
ATSAMA5D27C-CU
Microchip Technology

-
AT91SAM9X35-CU
Microchip Technology

-
AT91SAM9X25-CU
Microchip Technology

-
MCIMX6Y2CVM08AB
NXP Semiconductors
-
AM3352BZCZ100
Texas Instruments

-
AT91SAM9260B-CU
Microchip Technology

-
AT91SAM9260B-QU
Microchip Technology

-
ATSAMA5D31A-CU
Microchip Technology

-
AT91SAM9G20B-CU-999
Microchip Technology

-
MCIMX6Y2CVM05AB
NXP Semiconductors
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…

