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Texas Instruments AM3894BCYG120

Part No.:
AM3894BCYG120
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
1031-BFBGA, FCBGA
Datasheet:
AetrixAM3894BCYG120.pdf
Description:
IC MPU SITARA 1.2GHZ 1031FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,082

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Product details

Overview

AM3894BCYG120 from Texas Instruments is a high-performance Sitara™ ARM® microprocessor (MPU) built around an ARM Cortex-A8 core operating up to 1.20 GHz, featuring 32-KB instruction and data caches, 256-KB L2 cache, and integrated SGX530 3D graphics engine. It delivers simultaneous HD/SD video capture and display, dual Gigabit Ethernet MACs, PCIe 2.0 x2 lanes, SATA 3.0 Gbps, and dual DDR2/DDR3 interfaces - enabling rich UI and real-time media processing in industrial HMI and embedded computing systems.

For engineers reviewing the AM3894BCYG120 datasheet, AM3894BCYG120 pinout, AM3894BCYG120 application, or AM3894BCYG120 equivalent, key selection considerations include its 1031-pin FCBGA package, 1.2-GHz CPU frequency, SGX530 GPU availability (exclusive to AM3894), dual EMAC with GMII/MDIO, and HDVPSS support for HDMI 1.3 output with HDCP.

Technical Context

The AM3894BCYG120 implements an in-order, dual-issue, superscalar ARM Cortex-A8 core compliant with ARMv7 architecture and NEON multimedia extensions, paired with a dedicated HD Video Processing Subsystem (HDVPSS) supporting two 165-MHz HD capture channels and two HD display channels. Its memory subsystem includes dual 32-bit DDR2/DDR3 interfaces supporting up to DDR3-1600 and a flexible General-Purpose Memory Controller (GPMC) with error locator module (ELM) for NAND flash.

System-level interconnect uses L3 and L4 buses with Dynamic Memory Manager (DMM) enabling programmable multi-zone memory mapping and interleaving. Power management leverages SmartReflex™ Level 2 with seven independent core power domains, while clocking supports PCIe 2.0, SATA, USB 2.0 PHYs, and multiple PLLs for domain-specific frequency synthesis.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreARM Cortex-A8, up to 1.20 GHz - enables Linux/Android execution with deterministic real-time response for industrial control tasks.
L1 Cache32-KB instruction + 32-KB data - reduces instruction fetch and data access latency for tight-loop control and media decode.
L2 Cache256-KB unified - improves throughput for multi-threaded OS services and graphics rendering pipelines.
Graphics EngineSGX530 (30 MTriangles/s) - offloads OpenGL ES 2.0 and OpenVG 1.1 rendering from CPU, enabling smooth GUI compositing.
Video I/OTwo 165-MHz HD capture + two HD display channels - supports dual independent video streams (e.g., HDMI output + analog SD preview).
ConnectivityDual EMAC (10/100/1000 Mbps), PCIe 2.0 x2, SATA 3.0 Gbps - enables high-bandwidth peripheral expansion and storage without external bridges.
Memory InterfaceDual 32-bit DDR2/DDR3 (up to DDR3-1600) + GPMC with ELM - allows ≥2 GB system RAM plus glueless NAND/NOR/SRAM interfacing with hardware ECC.
PackageFCBGA-1031, 25.0 mm × 25.0 mm, 0.65-mm pitch with Via Channel™ - supports cost-effective 2-layer PCB routing and thermal reliability in fanless enclosures.

Pinout & Package

AM3894BCYG120 is housed in a 1031-pin Flip-Chip Ball Grid Array (FCBGA) package measuring 25.0 mm × 25.0 mm with 0.65-mm ball pitch and Via Channel™ technology enabling 0.8-mm PCB feature sizes. Pin functions are multiplexed across 14 functional groups including DDR, EMAC, HDMI, McASP, McBS, PCIe, SATA, USB, and GPIO banks. Full pin assignment and terminal function details are documented in Section 4 of SPRS681G (pages 28–45), covering ball-to-signal mapping, I/O voltage domains (1.5 V, 1.8 V, 3.3 V), and configurable pull-up/down states.

Pin/TerminalCircuit RoleDesign Meaning
DDR3_DQ[0:31]DDR3 Data Bus (Lower/Upper)32-bit bidirectional data path for DDR3-1600 operation; requires matched trace lengths and on-die termination calibration.
EMAC0_RXD[0:3]Gigabit Ethernet Receive Data4-bit nibble interface for MII/GMII; supports 1000BASE-T via external PHY or RGMII timing with internal delay compensation.
HDMI_TX0/1/2/CLKHDMI 1.3 TMDS OutputDifferential pixel clock and RGB data lanes driving HDMI 1.3 transmitter with integrated HDCP encryption engine.
PCIe_REFCLK+/−PCIe 2.0 Reference Clock Input100-MHz differential reference clock required for PCIe link training; must meet jitter <1.5 ps RMS per PCIe 2.0 spec.
USB0_DRVVBUSUSB 2.0 Host VBUS ControlOpen-drain output enabling/disabling 5-V VBUS supply to downstream devices; supports hot-plug detection via USB0_ID.
GPIO_0–63General-Purpose I/O64 pins configurable as inputs/outputs with programmable pull-up/down, slew rate, and drive strength (2/4/6/8 mA).

Key Features

FeatureDesign Value
Dynamic Memory Manager (DMM)Enables hardware-accelerated 2D block accesses and tiled object orientation (0°/90°/180°/270°) for efficient video frame buffer management.
HD Video Processing Subsystem (HDVPSS)Integrates dual HD capture/display paths, three HD/SD DACs, HDMI 1.3 transmitter with HDCP, and simultaneous SD analog output - eliminating need for external video encoder/decoder ICs.
SmartReflex™ Level 2Delivers adaptive voltage scaling across seven independent power domains, reducing dynamic power by up to 30% during low-activity periods without software intervention.
Enhanced DMA (EDMA)64 independent channels + 8 QDMA channels enable zero-CPU-overhead data movement between peripherals (e.g., McASP → DDR → SGX530) and concurrent scatter-gather transfers.
Via Channel™ PackagingAllows 0.8-mm PCB design rules in a 0.65-mm pitch BGA, reducing layer count to two signal layers and cutting board cost by ~25% versus conventional BGAs.
ARMv7 + NEON + VFPv3Supports IEEE 754-compliant floating-point math and SIMD acceleration for real-time audio processing, image filtering, and sensor fusion algorithms.

Applications

Industrial HMI PanelsNetwork-Attached Media Gateways

Use Scenario: Fanless, DIN-rail-mounted operator interface running Qt-based GUI with live camera feed overlay and remote diagnostics via Ethernet.

IC Role / Device Role / Timing Role: Central application processor executing Linux, managing touch input, rendering OpenGL ES 2.0 UI, capturing HD video via parallel CSI, and streaming over dual EMAC.

Use Value: SGX530 GPU handles UI compositing at 60 fps while Cortex-A8 runs control logic; HDVPSS enables direct HDMI output to panel and SD analog loopback for local preview - no external video ICs required.

Use Scenario: Rack-mount media converter bridging legacy SDI cameras to IP video networks using RTSP/H.264 encoding and time-synchronized NTP timestamps.

IC Role / Device Role / Timing Role: System-on-chip host for dual-channel HD video ingest, hardware-accelerated H.264 encode (via HDVPSS + DSP offload), and packetized streaming over dual Gigabit Ethernet with precise PTP timestamping.

Use Value: Dual 165-MHz HD capture channels accept uncompressed YUV422; PCIe 2.0 x2 connects to FPGA-based SDI receiver; SATA 3.0 stores metadata logs locally - all within single-chip footprint.

Interactive Point-of-Service KiosksSingle-Board Computing Platforms

Use Scenario: Retail kiosk with capacitive touchscreen, dual-display output (HDMI + LVDS), NFC payment interface, and thermal receipt printer - deployed in 24/7 unattended environments.

IC Role / Device Role / Timing Role: Main processor executing Android OS, driving dual displays via HDMI and HDVPSS LCD controller, managing USB peripherals (NFC reader, printer), and handling secure boot via ARM TrustZone.

Use Value: Integrated USB 2.0 PHYs eliminate external transceivers; 64 GPIOs support custom I/O expansion; SmartReflex™ extends thermal headroom for silent fanless operation under sustained load.

Use Scenario: Compact, low-power edge AI inference platform using TI's C66x DSP co-processor (via inter-processor mailbox) for real-time object detection on HD video streams.

IC Role / Device Role / Timing Role: Primary ARM host coordinating workload distribution, managing DDR3 memory coherency, synchronizing DSP execution via spinlock-protected shared buffers, and feeding results to Ethernet or PCIe-connected host.

Use Value: Mailbox module provides hardware-interrupt-driven IPC with four-message FIFO per channel; spinlock module offers 64 hardware semaphores for lock-free resource arbitration - eliminating software mutex overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM MPU applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AM3892BCYG120Omits SGX530 3D graphics engine; identical CPU, memory, and peripheral set otherwise.Suitable where OpenGL ES 2.0 rendering is unnecessary (e.g., text-only HMIs, headless gateways).Select AM3892BCYG120 when GPU acceleration is not required to reduce BOM cost and simplify thermal design.
AM4379BZDNA80Newer 45-nm ARM Cortex-A9 (1.0 GHz), PRU-ICSS for real-time I/O, no SGX530 but PowerVR SGX544 GPU (higher fill rate), single EMAC.Better real-time I/O determinism via PRUs; lower power at equivalent throughput; lacks dual EMAC and PCIe.Choose AM4379BZDNA80 for applications needing deterministic GPIO/bit-banging (e.g., industrial fieldbus masters) and lower active power, accepting trade-offs in connectivity bandwidth.

Compared with AM3892BCYG120, the AM3894BCYG120 adds critical GPU capability for rich UIs; versus AM4379BZDNA80, it retains PCIe and dual EMAC for high-throughput expansion - making AM3894BCYG120 optimal for media-rich, network-intensive embedded computing where graphics and bandwidth are non-negotiable.

Availability

AM3894BCYG120 is available at Aetrix Electronics and suitable for industrial automation, human machine interface, and network communications processing requiring stable component supply across extended product lifecycles.

Supply support for AM3894BCYG120 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets since 1930.

The AM389x Sitara™ MPU family was designed specifically for high-performance, graphics-rich embedded applications - combining ARM Cortex-A8 processing, HD video acceleration, and industrial-grade connectivity in a single die to accelerate development of intelligent edge devices.

FAQ

What is the maximum operating frequency of the AM3894BCYG120 CPU core?

The AM3894BCYG120 features an ARM Cortex-A8 core rated for operation up to 1.20 GHz under recommended conditions, as confirmed in the SPRS681G datasheet revision March 2015. This frequency is achievable with proper thermal management and AVS (Adaptive Voltage Scaling) enabled via SmartReflex™ Level 2. The AM3894BCYG120 does not support the earlier 1.35-GHz rating found in pre-2015 revisions.

Does the AM3894BCYG120 include an integrated graphics processing unit?

Yes, the AM3894BCYG120 integrates the PowerVR SGX530 3D graphics engine - delivering up to 30 million triangles per second and supporting OpenGL ES 1.1/2.0, OpenVG 1.1, and Direct3D Mobile APIs. This GPU is exclusive to the AM3894 variant; the AM3892BCYG120 omits it entirely, as documented in Table 3-1 of SPRS681G.

What video interfaces does the AM3894BCYG120 support for display output?

The AM3894BCYG120 supports HDMI 1.3 output with integrated PHY and HDCP encryption, plus analog SD video (CVBS) and HD video (YPbPr) via integrated DACs. Its HDVPSS includes one 16-/24-/30-bit HD display channel and one 16-bit HD channel, enabling simultaneous HDMI and analog outputs - all without external video encoder ICs.

How many Ethernet MACs does the AM3894BCYG120 integrate, and what speeds do they support?

The AM3894BCYG120 integrates two fully independent Ethernet MACs (EMAC0 and EMAC1), each supporting 10 Mbps, 100 Mbps, and 1000 Mbps operation with IEEE 802.3 compliance. Both support MII and GMII interfaces and include integrated MDIO modules for PHY management - enabling dual-gigabit network redundancy or segregated control/data plane traffic.

What package type and pin count does the AM3894BCYG120 use?

The AM3894BCYG120 uses a 1031-ball Flip-Chip BGA (FCBGA) package with 25.0 mm × 25.0 mm body size and 0.65-mm ball pitch. It employs Via Channel™ technology to enable 0.8-mm PCB design rules, reducing layer count and routing complexity. This package is shared with the AM3892BCYG120 and is documented in Section 11.1 of SPRS681G.

AM3894BCYG120 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
1031-BFBGA, FCBGA
Series:
Sitara™
Packaging:
Tray
Product Status:
Obsolete
Core Processor:
ARM® Cortex®-A8
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.2GHz
Co-Processors/DSP:
Multimedia; NEON™ SIMD
RAM Controllers:
DDR2, DDR3
Graphics Acceleration:
Yes
Display & Interface Controllers:
HDMI, HDVPSS
Ethernet:
10/100/1000Mbps (2)
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 + PHY (2)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
0°C ~ 95°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
1031-FCBGA (25x25)
Additional Interfaces:
I2C, McASP, McBSP, SPI, SD/SDIO, UART

AM3894BCYG120 FAQ

1.How can I place an order for AM3894BCYG120 through Aetrix?

Please submit a Request for Quotation (RFQ) for AM3894BCYG120 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AM3894BCYG120 reliable?

The price and inventory of AM3894BCYG120 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM3894BCYG120 is usually 5 days.

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AM3894BCYG120 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AM3894BCYG120 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AM3894BCYG120?

For technical support, including AM3894BCYG120 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM3894BCYG120 requirements.

6.How does Aetrix verify that AM3894BCYG120 is sourced from the original manufacturer or authorized distributors?

All AM3894BCYG120 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM3894BCYG120 meets industry standards.

7.What is the process for return or replacement of AM3894BCYG120?

All AM3894BCYG120 units undergo pre-shipment inspection (PSI). If there is an issue with AM3894BCYG120, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AM3894BCYG120 part is unused and in its original packaging.

Return procedure for AM3894BCYG120:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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