Texas Instruments AM4376BZDNA100

Overview

AM4376BZDNA100 from Texas Instruments is a high-performance Sitara™ ARM® Cortex®-A9 processor operating at 800 MHz, integrating dual 12-bit SAR ADCs (867 kSPS), six eHRPWM modules, three eQEP modules, PRU-ICSS for EtherCAT/PROFINET offload, and PowerVR SGX530 3D graphics (20 MTri/s). It supports LPDDR2/DDR3/DDR3L memory, dual USB 2.0 with PHY, dual Gigabit Ethernet with IEEE 1588v2, and industrial I/O including CAN, McASP, McSPI, and QSPI - deployed in programmable logic controllers and HMI terminals.

For engineers reviewing the AM4376BZDNA100 datasheet, AM4376BZDNA100 pinout, AM4376BZDNA100 application, or AM4376BZDNA100 equivalent, this page delivers verified technical context, validated pin functions, real-world use cases for industrial automation and embedded vision, and confirmed alternative parts with documented functional and packaging differences.

Technical Context

The AM4376BZDNA100 implements a dual-core-capable ARM Cortex-A9 subsystem with 32KB L1 instruction/data cache and configurable 256KB L2 cache or L3 RAM, paired with a dedicated PRU-ICSS subsystem containing two 200-MHz PRU cores per ICSS, each with parity-protected 12KB instruction RAM and 8KB data RAM. Its interconnect architecture uses L3/L4 buses to coordinate DMA transfers via a 64-channel EDMA controller across MPU, graphics, peripherals, and external memory interfaces.

It integrates dual independent 12-bit SAR ADCs (ADC0/ADC1) with 8-input multiplexing and touch-screen controller capability on ADC0, alongside six eHRPWM modules supporting single-ended, dual-edge symmetric, or asymmetric outputs - all synchronized to a shared 32-kHz synctimer for deterministic timing in motor control and encoder feedback loops.

Key Specifications

Pinout & Package

NFBGA-491 package (ZDN suffix), 17 mm × 17 mm body size, 0.65 mm ball pitch, with via-channel array for simplified layer routing and thermal management.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ARM-based industrial processor applications.

Compared with AM4379BZDNA100 and AM4372BZDNA600, the AM4376BZDNA100 delivers optimal balance of real-time determinism (via PRU-ICSS), graphics throughput (SGX530), and power efficiency - making it the preferred choice for mid-tier industrial HMIs and motion controllers where 2000 MIPS is sufficient and thermal envelope is moderate.

Availability

AM4376BZDNA100 is available at Aetrix Electronics and suitable for industrial automation, HMI terminals, and barcode scanner designs requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for AM4376BZDNA100 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies for industrial, automotive, and consumer markets.

The AM437x product line delivers scalable ARM Cortex-A9 processors with integrated PRU-ICSS and SGX530 graphics - designed specifically for deterministic industrial communication, rich HMI, and real-time control in factory automation and edge equipment.

FAQ

What is the maximum operating frequency of the AM4376BZDNA100 processor core?

The AM4376BZDNA100 features an ARM Cortex-A9 processor core rated for operation at 800 MHz, delivering 2000 MIPS of computational performance. This frequency is validated across the full industrial temperature range (–40°C to +105°C) and supports Dynamic Voltage and Frequency Scaling (DVFS) for power optimization. The AM4376BZDNA100 maintains this speed under sustained thermal conditions when implemented with TI-recommended power delivery and thermal management per the AM437x datasheet.

Does the AM4376BZDNA100 support secure boot functionality?

No, the AM4376BZDNA100 does not support secure boot. Secure boot is only available on AM437x High-Security (HS) variants, such as the AM4376BZDNA100HS or AM4379BZDNA100HS, which include dedicated security keys, secure watchdog, and cryptographic acceleration enabled at factory fuse programming. The standard AM4376BZDNA100 lacks the hardware security module (HSM) and one-time programmable fuses required for authenticated boot chain enforcement.

Which display interfaces are supported by the AM4376BZDNA100 Display Subsystem (DSS)?

The AM4376BZDNA100 Display Subsystem supports parallel RGB/YUV interfaces up to 2048×2048 resolution, with programmable pixel formats including RGB16/RGB24, YUV422, and palletized modes. It includes hardware overlay, gamma correction, and partial refresh via RFBI - but does not support MIPI DSI or LVDS native output. External bridge ICs are required for conversion to those standards. The DSS is fully integrated with ADC0 for resistive touchscreen controller functionality.

Can the AM4376BZDNA100 simultaneously run EtherCAT and PROFINET protocols?

Yes, the AM4376BZDNA100 can run EtherCAT and PROFINET concurrently using its dual PRU-ICSS subsystems: PRU-ICSS0 handles EtherCAT slave communication while PRU-ICSS1 executes PROFINET device stack. Each PRU core operates at 200 MHz with dedicated instruction/data RAM and hardware accelerators for protocol-specific frame processing - enabling deterministic, low-latency operation without CPU intervention or OS scheduling jitter.

What memory types and configurations does the AM4376BZDNA100 support through its external interfaces?

The AM4376BZDNA100 supports 32-bit LPDDR2 (266 MHz), DDR3/DDR3L (400 MHz), NAND/NOR/SRAM via GPMC with up to 16-bit ECC, and serial NOR flash via QSPI with execute-in-place (XIP) capability. It does not support LPDDR3, DDR4, or PCIe-based storage. Memory mapping is managed by the EMIF and GPMC controllers, with OCMC RAM providing 256 KB of low-latency on-chip memory accessible by all masters for critical real-time buffers.