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Texas Instruments AM5718AZBOXEM

Part No.:
AM5718AZBOXEM
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
780-BGA, FCBGA
Datasheet:
AetrixAM5718AZBOXEM.pdf
Description:
IC MPU SITARA 1.5GHZ 780FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,362

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Product details

Overview

AM5718AZBOXEM from Texas Instruments is a high-performance Sitara™ ARM applications processor integrating an ARM Cortex-A15 CPU, C66x VLIW DSP, dual Cortex-M4 coprocessors, IVA-HD video accelerator, SGX544 3D GPU, and PRU-ICSS for industrial real-time control. It supports DDR3-1333 memory, HDMI 1.4a, dual CAN 2.0B, PCIe Gen2, USB 3.0/2.0, and up to 215 GPIOs - deployed in HMI, automation, and embedded vision systems.

For engineers reviewing the AM5718AZBOXEM datasheet, AM5718AZBOXEM pinout, AM5718AZBOXEM application, or AM5718AZBOXEM equivalent, key selection criteria include heterogeneous core partitioning (A15 + DSP + M4), on-chip 512KB L3 RAM with ECC, 760-pin FCBGA (ZBO) package, and support for full-HD video processing at 1080p60 with hardware-accelerated VPE and BB2D.

Technical Context

The AM5718AZBOXEM implements a tightly coupled heterogeneous architecture: the Cortex-A15 handles OS and control tasks, the C66x DSP executes vision/audio algorithms, and dual Cortex-M4 cores manage real-time I/O and safety-critical functions. Its L3/L4 interconnect enables coherent data sharing across subsystems including IPU1/IPU2, VPE, and PRU-ICSS.

Memory subsystem includes a 32-bit DDR3/DDR3L EMIF supporting up to 2GB at 667 MHz, 512KB on-chip OCMC RAM with ECC, and GPMC for NAND/NOR/async memory. Peripheral integration spans dual DCAN, six McASP channels, four McSPI, QSPI, SATA Gen2, and dual 5-Gbps PCIe lanes configurable as one 2-lane or two 1-lane ports.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreSingle ARM Cortex-A15 @ up to 1.5 GHz - provides Linux-capable application processing with Neon and VFPv4 support
DSP CoreSingle C66x VLIW floating-point DSP - delivers up to 32 × 16-bit fixed-point multiplies/cycle, object-code compatible with C64x+/C67x
Real-Time CoresDual ARM Cortex-M4 @ up to 212.8 MHz - dedicated for deterministic I/O, PRU-ICSS offload, and safety monitoring
Video AccelerationIVA-HD + VPE + BB2D (Vivante GC320) - enables 1080p60 encode/decode and 2D graphics compositing without CPU load
Memory InterfaceDDR3/DDR3L EMIF @ 1333 MT/s (667 MHz) - supports up to 2GB across single chip select with DMM-based address remapping
On-Chip RAM512KB OCMC RAM with ECC - low-latency, error-corrected scratchpad for critical code/data in MPU, DSP, or M4 domains
Package760-pin FCBGA (ZBO), 23 mm × 23 mm, 0.8-mm pitch - thermal and signal-integrity optimized for industrial PCB layouts

Pinout & Package

AM5718AZBOXEM uses a 23 mm × 23 mm, 0.8-mm pitch, 760-ball FCBGA package designated ZBO. Ball assignment follows TI's standardized pinout for the AM5718-HIREL family, with dedicated power/ground banks, DDR3 signal groups (ddr1_a[15:0], ddr1_ba[2:0], ddr1_d[31:0], ddr1_dqs[3:0]), dual CSI2 interfaces (csi2_0_dx/dy[4:0], csi2_1_dx/dy[2:0]), and multiplexed peripheral signals including DCAN, McASP, McSPI, and UART.

Pin/TerminalCircuit RoleDesign Meaning
G19DCAN1_RXPrimary CAN 2.0B receive input - supports automotive/industrial bus communication with programmable bit timing
G20DCAN1_TXPrimary CAN 2.0B transmit output - differential signaling compliant with ISO 11898-2 when paired with external transceiver
AD20–AD22DDR1_A[0:2]Address lines for DDR3 channel 1 - routed with matched length and controlled impedance for reliable 667 MHz operation
AF25–AE23DDR1_D[0:7]Data bus byte lane 0 - includes associated DQS/DQSN for source-synchronous capture with per-bit deskew capability
AF17–AB18DDR1_BA[0:2]Bank address inputs for DDR3 - determine active memory bank during read/write commands
AG24DDR1_CKDifferential clock input for DDR3 - requires 90° phase-aligned complementary CK/CK# pair for timing closure

Key Features

FeatureDesign Value
Heterogeneous Core PartitioningARM Cortex-A15 (Linux), C66x DSP (vision/audio), dual Cortex-M4 (real-time I/O) - enables workload isolation and deterministic response
Hardware Video PipelineIVA-HD + VPE + BB2D - processes 1080p60 video with hardware scaling, blending, deinterlacing, and color space conversion
Industrial Real-Time SubsystemTwo PRU-ICSS modules - each with dual 32-bit RISC cores, 12KB SRAM, and programmable I/O for EtherCAT, PROFINET, or custom protocols
Secure Boot & DebugOn-chip debug with CTools, secure ROM boot, and hardware crypto accelerators - supports secure firmware updates and trace-based validation
Thermal & Reliability QualificationAEC-Q100 Grade 3 qualified (–40°C to +105°C), 28-nm CMOS process - validated for extended life in harsh industrial environments

Applications

Industrial HMISmart Camera System

Use Scenario: Touch-enabled operator interface in factory automation panels with real-time PLC communication and local video rendering.

IC Role / Device Role / Timing Role: AM5718AZBOXEM serves as main application processor running Linux Qt UI, while PRU-ICSS handles CANopen/EtherCAT fieldbus timing and IVA-HD decodes camera feeds.

Use Value: Single-chip integration eliminates external FPGA or co-processor, reducing BOM cost and board area while maintaining <100 µs I/O latency via PRU-ICSS.

Use Scenario: Embedded vision node capturing dual MIPI CSI-2 camera streams, performing real-time object detection, and streaming encoded video over Gigabit Ethernet.

IC Role / Device Role / Timing Role: AM5718AZBOXEM acts as vision SoC: CSI2_0/CSI2_1 ingest raw sensor data, C66x DSP runs CNN inference, VPE encodes output, GMAC_SW transmits via TCP/IP.

Use Value: Hardware-accelerated VPE achieves 1080p60 H.264 encoding at <500 mW, avoiding thermal throttling in fanless enclosures.

Programmable Logic ControllerMedical Imaging Gateway

Use Scenario: DIN-rail mounted PLC executing motion control loops, reading analog I/O, and communicating via Modbus TCP and CAN bus.

IC Role / Device Role / Timing Role: AM5718AZBOXEM hosts real-time Linux PREEMPT_RT kernel on Cortex-A15, while dual Cortex-M4 cores run deterministic servo control and safety shutdown logic.

Use Value: Dual M4 isolation ensures SIL2-compliant fail-safe behavior independent of OS stability; GPIO and PWMSS support direct motor driver interfacing.

Use Scenario: Portable ultrasound device acquiring RF data from transducer arrays, applying beamforming on DSP, and rendering B-mode images on HDMI display.

IC Role / Device Role / Timing Role: AM5718AZBOXEM functions as medical imaging SoC: McASP interfaces with ADC/DAC, C66x performs real-time beamforming, SGX544 GPU renders overlay graphics.

Use Value: On-chip 512KB OCMC RAM with ECC stores critical beamforming coefficients, eliminating external SRAM and meeting IEC 62304 data integrity requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous processor applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
AM5728AZDKDSame silicon revision and core configuration, but rated for commercial temperature (0°C to 90°C) and uses different package (ZCE, 17×17 mm)Lacks AEC-Q100 qualification and industrial thermal rating; not suitable for extended ambient or safety-critical deploymentsSelect AM5728AZDKD only for cost-sensitive, non-industrial designs where thermal margin and automotive qualification are unnecessary
AM6548ABNPANewer 16nm process, quad Cortex-A53 + dual Cortex-R5F, no C66x DSP, adds TSN Ethernet and enhanced security (HSM)Targets next-gen industrial networking with time-sensitive networking; lacks legacy DSP-based vision accelerationChoose AM6548ABNPA for TSN-based control networks or when migrating from DSP-centric algorithms to Arm-native AI inference

Compared with AM5728AZDKD and AM6548ABNPA, AM5718AZBOXEM uniquely combines AEC-Q100 qualification, C66x DSP for legacy vision libraries, and PRU-ICSS for deterministic fieldbus - making it optimal for retrofitting industrial vision systems requiring long-term reliability and algorithm continuity.

Availability

AM5718AZBOXEM is available at Aetrix Electronics and suitable for industrial HMI, smart camera systems, and programmable logic controllers requiring stable component supply across extended product lifecycles.

Supply support for AM5718AZBOXEM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in industrial, automotive, and communications markets.

The AM5718AZBOXEM belongs to TI's Sitara™ ARM processor family, designed specifically for high-performance embedded applications demanding heterogeneous processing, real-time I/O, and integrated video acceleration in harsh environments.

FAQ

What is the operating temperature range for AM5718AZBOXEM?

AM5718AZBOXEM is rated for –40°C to +105°C ambient operation and qualified to AEC-Q100 Grade 3 standards. This extended thermal range supports deployment in uncontrolled industrial cabinets, outdoor kiosks, and transportation equipment without forced cooling. The device's thermal design includes dedicated thermal pads and power management features that maintain functional stability across the full range, as verified in TI's SPRS999 production data sheet.

Does AM5718AZBOXEM include on-chip memory with error correction?

Yes, AM5718AZBOXEM integrates 512KB of on-chip OCMC RAM with single-bit error correction and double-bit error detection (SECDED) ECC. This memory is accessible by all major processing domains - Cortex-A15, C66x DSP, and Cortex-M4 cores - and is used for critical firmware, real-time buffers, and safety-critical variables. ECC enforcement is hardware-managed and cannot be disabled, ensuring data integrity in mission-critical applications.

How many MIPI CSI-2 camera interfaces does AM5718AZBOXEM support?

AM5718AZBOXEM supports two independent MIPI CSI-2 receivers: CSI2_0 and CSI2_1. CSI2_0 accepts up to five data lanes (dx0–dx4, dy0–dy4), and CSI2_1 supports three data lanes (dx0–dx2, dy0–dy2). Both interfaces operate at up to 1.5 Gbps per lane and are directly connected to the CAL (Camera Adaptation Layer) for seamless integration with image signal processors and VPE, enabling dual-camera synchronous capture in AM5718AZBOXEM-based vision systems.

Is AM5718AZBOXEM pin-compatible with other AM57xx devices?

No, AM5718AZBOXEM is not pin-compatible with other AM57xx variants such as AM5728 or AM5748. While all share the ZBO 760-ball FCBGA footprint, ball functionality differs significantly - for example, AM5728 repurposes several PRU-ICSS and IVA-HD signals as general-purpose I/O or additional McASP channels. Migration requires PCB redesign and software adaptation due to differences in peripheral mapping, power domain routing, and reset sequencing.

What development tools are officially supported for AM5718AZBOXEM?

Texas Instruments officially supports Code Generation Tools (C/C++ compilers for ARM and C66x), SYS/BIOS and TI-RTOS for real-time scheduling, Processor SDK Linux for Linux-based application development, and CCS (Code Composer Studio) v10+ with full debug visibility into Cortex-A15, C66x, and Cortex-M4 cores. TI also provides reference designs like the AM571x IDK and industrial SDKs with PRU-ICSS firmware examples, all validated for AM5718AZBOXEM silicon revision 2.0.

AM5718AZBOXEM Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
780-BGA, FCBGA
Series:
Sitara™
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, BB2D, IPU, IVA, GPU, VPE
RAM Controllers:
DDR3, DDR3L
Graphics Acceleration:
Yes
Display & Interface Controllers:
-
Ethernet:
-
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (2), USB 3.0 (2) + PHY (2)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
-55°C ~ 125°C
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
780-FCBGA (23x23)
Additional Interfaces:
CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART

AM5718AZBOXEM FAQ

1.How can I place an order for AM5718AZBOXEM through Aetrix?

Please submit a Request for Quotation (RFQ) for AM5718AZBOXEM on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AM5718AZBOXEM reliable?

The price and inventory of AM5718AZBOXEM are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM5718AZBOXEM is usually 5 days.

3.What payment methods are accepted for AM5718AZBOXEM?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM5718AZBOXEM transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AM5718AZBOXEM?

AM5718AZBOXEM orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AM5718AZBOXEM order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AM5718AZBOXEM?

For technical support, including AM5718AZBOXEM datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM5718AZBOXEM requirements.

6.How does Aetrix verify that AM5718AZBOXEM is sourced from the original manufacturer or authorized distributors?

All AM5718AZBOXEM products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM5718AZBOXEM meets industry standards.

7.What is the process for return or replacement of AM5718AZBOXEM?

All AM5718AZBOXEM units undergo pre-shipment inspection (PSI). If there is an issue with AM5718AZBOXEM, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AM5718AZBOXEM part is unused and in its original packaging.

Return procedure for AM5718AZBOXEM:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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