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Texas Instruments AM5726BABCXA

Part No.:
AM5726BABCXA
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
760-BFBGA, FCBGA
Datasheet:
AetrixAM5726BABCXA.pdf
Description:
IC MPU SITARA 1.5GHZ 760FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,684

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Product details

Overview

AM5726BABCXA from Texas Instruments is a high-performance Sitara™ Arm applications processor featuring dual Cortex-A15 CPUs, two C66x DSPs, 2.5MB on-chip L3 RAM, dual DDR3/DDR3L memory interfaces supporting up to DDR3-1066, and 247 GPIO pins. It delivers programmable video processing and cryptographic acceleration (AES, SHA, RNG) for industrial HMI and automation systems requiring real-time vision analytics and secure connectivity.

For engineers reviewing the AM5726BABCXA datasheet, AM5726BABCXA pinout, AM5726BABCXA application, or AM5726BABCXA equivalent, key selection considerations include its lack of HDMI, IVA-HD, EVEs, SGX544 GPU, and BB2D hardware acceleration-distinguishing it from AM5728/AM5729-and its fixed 760-pin FCBGA (ABC) package with 23 mm × 23 mm body size and 0.8-mm pitch.

Technical Context

The AM5726BABCXA implements a heterogeneous multicore architecture with dual Arm Cortex-A15 RISC CPUs, two TI C66x VLIW floating-point DSPs, and dual Cortex-M4 coprocessors (IPU1/IPU2), enabling parallel execution of control, signal, and real-time tasks. Its memory subsystem includes two independent EMIF controllers supporting up to 2GB DDR3/DDR3L per interface and 2.5MB on-chip OCMC RAM with ECC.

Peripheral integration includes dual PRU-ICSS for industrial protocol offload, six McASP modules (16+4×4 serializers), four McSPI, five I²C, ten UART, dual DCAN (CAN 2.0B), PCIe gen2 (two 1-lane or one 2-lane port), SATA gen2, USB 3.0/2.0 dual-role, and three VIP modules-all accessible via a high-speed interconnect fabric with EDMA and system DMA support.

Key Specifications

Parameter Value and Actual Design Meaning
CPU Cores Dual Arm Cortex-A15 @ up to 1.5 GHz - enables Linux-based real-time OS deployment with SMP support.
DSP Cores Two C66x VLIW floating-point DSPs - provides object-code compatibility with C64x+/C67x and 32×16-bit fixed-point multiply capability per cycle.
On-chip RAM 2.5MB OCMC RAM with ECC - serves as low-latency shared memory for MPU, DSP, and DMA initiators without external DRAM access penalty.
Memory Interface Dual DDR3/DDR3L EMIF - supports up to DDR3-1066 and 2GB per channel; enables interleaved access for bandwidth-critical vision or analytics workloads.
Video Acceleration VPE only (no EVE, IVA-HD, or SGX544 GPU) - supports full-HD video processing pipeline but excludes 4K encode/decode and hardware-accelerated computer vision.
Package 760-pin FCBGA (ABC), 23 mm × 23 mm, 0.8-mm pitch - requires precise PCB layout with thermal vias under die and strict power delivery for 28-nm process node.
Crypto Engines AES, SHA, RNG, DES, 3DES hardware accelerators - offloads encryption/decryption from CPU, reducing latency in secure boot and data-in-transit scenarios.

Pinout & Package

AM5726BABCXA uses a 760-ball FCBGA (ABC) package with 23 mm × 23 mm body size and 0.8-mm ball pitch. Ball assignment follows TI's standardized ABC footprint; unused balls (e.g., AF7, AE4, AB26) are NC, while reserved balls (Y5, K14, B28) must remain unconnected. Power and ground balls require dedicated decoupling per TI's recommended layout guidelines.

Pin/Terminal Circuit Role Design Meaning
AB17 (rtc_porz) RTC power-on reset input Must connect to VSS when RTC is unused; alternative tie to PORZ (F22) requires level translation.
AF14 (rtc_iso) RTC isolation control Connect to corresponding power supply via external pull resistor if unused; or tie to PORZ (F22) when RTC disabled.
K9, Y14, R20, J16 LD0 bypass capacitors Capacitor terminals for vbbldo_dspeve, vbbldo_gpu, vbbldo_iva, vbbldo_mpu - require low-ESR ceramic caps per power rail spec.
L9–P19, Y13–T20 DDR core/voltage decoupling Capacitor pads for vddram_core1–core5, vddram_dspeve1/2, vddram_gpu, vddram_iva, vddram_mpu1/2 - critical for DDR signal integrity and timing margin.
G19 DCAN1 receive input High-impedance CAN bus receiver with internal pullup enabled - connects directly to differential CAN transceiver output.
Y15 MMC2 SD write-protect input Active-low signal indicating physical SD card write protection status - routed to eMMC/SDIO connector WP pin.

Key Features

Feature Design Value
Dual Cortex-M4 IPU subsystems Offloads real-time industrial communication stack processing (e.g., EtherCAT, Profinet) from main A15 cores, preserving deterministic latency.
Dual PRU-ICSS Enables custom real-time I/O handling and protocol implementation (e.g., IO-Link, TSN edge functions) without CPU intervention or OS scheduling jitter.
Video Processing Engine (VPE) Hardware-accelerated scaling, color space conversion, and deinterlacing for single-pipeline HD video capture and display - reduces CPU load by >70% vs. software-only path.
PCIe gen2 subsystem Configurable as two 1-lane or one 2-lane port - supports high-bandwidth expansion for FPGA co-processing, NVMe storage, or real-time data acquisition cards.
EDMA and System DMA Enables zero-CPU-copy data movement between peripherals, memory, and accelerators - essential for sustained throughput in multi-channel audio/video pipelines.

Applications

Industrial HMI Gateway Smart PLC Controller

Use Scenario: Edge gateway aggregating fieldbus data (Modbus RTU, CANopen) and presenting web-based visualization via local touchscreen.

IC Role / Device Role / Timing Role: Central applications processor executing Linux, managing dual Ethernet ports, running OPC UA server, and driving LVDS display interface.

Use Value: Dual A15 cores handle concurrent UI rendering and protocol translation; PRU-ICSS manages time-critical CAN/DCAN frame scheduling without OS interference.

Use Scenario: Programmable logic controller with motion control loop closure, analog I/O conditioning, and safety monitoring via dual DCAN.

IC Role / Device Role / Timing Role: Real-time deterministic controller using Cortex-M4 IPUs for servo loop execution and A15 for supervisory logic, diagnostics, and cloud telemetry.

Use Value: Hardware crypto engines enable secure firmware updates; VPE processes camera feed for visual anomaly detection alongside control tasks.

Embedded Vision Analytics Node Ruggedized Network Appliance

Use Scenario: Compact machine vision system capturing 1080p60 video from three cameras via VIP modules and performing object classification using C66x DSP kernels.

IC Role / Device Role / Timing Role: Vision accelerator host with VPE preprocessing, C66x DSP offloading neural network inference, and DDR3 bandwidth optimized for streaming buffers.

Use Value: 2.5MB OCMC RAM stores frame metadata and intermediate tensors; dual EMIF ensures sustained 12.8 GB/s memory bandwidth for multi-camera ingestion.

Use Scenario: Secure industrial firewall with deep packet inspection, TLS termination, and redundant Gigabit Ethernet failover.

IC Role / Device Role / Timing Role: Networking processor running DPDK-accelerated packet forwarding, crypto offload for IPsec/IKEv2, and watchdog-monitored system health.

Use Value: AES/SHA hardware accelerators achieve line-rate 1 Gbps encrypted throughput; GMAC_SW supports MII/RMII/RGMII PHY configurations for flexible PHY selection.

Equivalent & Alternatives

The following parts are listed as comparable options for similar applications processor applications.

Alternative Part Technical Difference Application Difference Selection Advice
AM5728BABCXA Includes HDMI encoder, IVA-HD subsystem, SGX544 GPU, BB2D, and four EVEs - adds 4K video encode/decode and embedded vision acceleration. Required for HMI with HDMI output, 3D graphics UI, or real-time computer vision (e.g., defect detection). Select AM5728BABCXA when display output, GPU rendering, or EVE-based analytics are mandatory; AM5726BABCXA suffices for headless or LVDS-only systems.
AM5718BABCXA Single Cortex-A15 core, no C66x DSPs, reduced peripheral count (e.g., one PRU-ICSS, four McASP), 1.5MB OCMC RAM - lower cost and power envelope. Suitable for cost-sensitive HMIs or gateways where DSP compute and dual-core A15 are unnecessary. Choose AM5718BABCXA for simpler control applications with lighter multimedia demands; AM5726BABCXA retains full dual-A15/C66x capability for future scalability.

Compared with AM5728BABCXA, AM5726BABCXA removes HDMI, GPU, EVEs, and IVA-HD to reduce BOM cost and thermal load while retaining identical CPU/DSP compute, memory bandwidth, and industrial I/O - making it optimal for headless or LVDS-based automation nodes. Against AM5718BABCXA, it doubles A15 cores and adds full C66x DSPs for demanding signal processing without sacrificing peripheral richness.

Availability

AM5726BABCXA is available at Aetrix Electronics and suitable for industrial HMI gateways, smart PLC controllers, embedded vision analytics nodes, and ruggedized network appliances requiring stable component supply across extended product lifecycles.

Supply support for AM5726BABCXA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company designing analog ICs, embedded processors, and digital signal processors for industrial, automotive, and communications markets.

The AM5726BABCXA belongs to the Sitara™ AM572x processor family, engineered for high-performance embedded applications requiring heterogeneous multicore processing, industrial connectivity, and hardware-accelerated vision and security functions.

FAQ

What is the maximum DDR3 speed supported by AM5726BABCXA?

AM5726BABCXA supports DDR3-1066 operation across both EMIF channels. Each interface can drive up to 2GB of DDR3/DDR3L memory, and the unified L3 memory map allows up to 2GB of interleaved SDRAM space accessible by all initiators including MPU, DSP, and DMA. The device datasheet specifies timing parameters compliant with JEDEC DDR3-1066 standards under recommended operating conditions.

Does AM5726BABCXA include HDMI or GPU functionality?

No, AM5726BABCXA does not include HDMI encoder, SGX544 GPU, BB2D 2D accelerator, or IVA-HD subsystem. These features are explicitly excluded per the AM572x device comparison table. The display subsystem supports only LVDS and parallel RGB outputs via its three video pipelines - making AM5726BABCXA suitable for headless or non-HDMI industrial displays.

How many PRU-ICSS units does AM5726BABCXA have?

AM5726BABCXA includes two fully functional Programmable Real-Time Unit and Industrial Communication SubSystems (PRU-ICSS1 and PRU-ICSS2). Each unit contains dual 32-bit RISC cores, dedicated instruction/data RAM, and programmable I/O registers - enabling deterministic real-time I/O handling, industrial protocol stacks, and custom peripheral emulation without CPU involvement.

What video acceleration capabilities are present in AM5726BABCXA?

AM5726BABCXA integrates the Video Processing Engine (VPE) for hardware-accelerated scaling, color space conversion (YUV↔RGB), and deinterlacing of HD video streams. It lacks Embedded Vision Engines (EVEs), IVA-HD subsystem, and SGX544 GPU - meaning it supports only single-pipeline 1080p60 video processing without 4K encode/decode or computer vision acceleration.

Is AM5726BABCXA pin-compatible with AM5728BABCXA or AM5729BABCXA?

Yes, AM5726BABCXA shares identical 760-pin FCBGA (ABC) package dimensions, ball pitch, and mechanical footprint with AM5728BABCXA and AM5729BABCXA. All three devices use the same ABC package variant, enabling PCB reuse across the AM572x family - though functional differences (e.g., missing HDMI, EVEs, GPU) require software and peripheral design validation.

AM5726BABCXA Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
760-BFBGA, FCBGA
Series:
Sitara™
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.5GHz
Co-Processors/DSP:
DSP, IPU, VPE
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
GbE
SATA:
SATA 3Gbps (1)
USB:
USB 2.0 (1), USB 3.0 (1)
Voltage - I/O:
1.8V, 3.3V
Operating Temperature:
-40°C ~ 105°C (TJ)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
760-FCBGA (23x23)
Additional Interfaces:
-

AM5726BABCXA FAQ

1.How can I place an order for AM5726BABCXA through Aetrix?

Please submit a Request for Quotation (RFQ) for AM5726BABCXA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AM5726BABCXA reliable?

The price and inventory of AM5726BABCXA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM5726BABCXA is usually 5 days.

3.What payment methods are accepted for AM5726BABCXA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM5726BABCXA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AM5726BABCXA?

AM5726BABCXA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AM5726BABCXA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AM5726BABCXA?

For technical support, including AM5726BABCXA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM5726BABCXA requirements.

6.How does Aetrix verify that AM5726BABCXA is sourced from the original manufacturer or authorized distributors?

All AM5726BABCXA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM5726BABCXA meets industry standards.

7.What is the process for return or replacement of AM5726BABCXA?

All AM5726BABCXA units undergo pre-shipment inspection (PSI). If there is an issue with AM5726BABCXA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AM5726BABCXA part is unused and in its original packaging.

Return procedure for AM5726BABCXA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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