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Home > Products > Integrated Circuits (ICs) > Embedded > Microprocessors

Texas Instruments AM5729BABCX

Name: AM5729BABCX
Brand: Texas Instruments
SKU: AM5729BABCX
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: AM5729BABCX

Manufacturer:: Texas Instruments

Category:: Microprocessors

Package:: 760-BFBGA, FCBGA

Datasheet:: AM5729BABCX.pdf

Description:: IC MPU SITARA 1.5GHZ 760FCBGA

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Product details

Overview

AM5729BABCX from Texas Instruments is a high-performance Sitara™ Arm applications processor featuring dual Cortex-A15 CPU cores, two C66x VLIW DSPs, four Embedded Vision Engines (EVEs), dual-core PowerVR SGX544 3D GPU, and IVA-HD video subsystem supporting 4K@15fps H.264 encode/decode. It integrates dual PRU-ICSS, PCIe Gen2, SATA Gen2, dual Gigabit Ethernet, and up to 247 GPIOs for industrial HMI and vision analytics systems.

For engineers reviewing the AM5729BABCX datasheet, AM5729BABCX pinout, AM5729BABCX application, or AM5729BABCX equivalent, this page delivers verified technical context, package mapping, real-world use cases, and validated alternative options - all grounded in TI's SPRS953G silicon revision 2.0 documentation and orderable device specifications.

Technical Context

The AM5729BABCX implements a heterogeneous multi-processor architecture with tightly coupled memory subsystems: dual Cortex-A15 cores run at up to 1.5 GHz, each with Neon and VFPv4 extensions; two C66x DSPs deliver up to 32 × 16-bit fixed-point multiplies per cycle; and four EVEs provide dedicated vision acceleration. The IVA-HD subsystem handles full-HD (1920×1080p60) and 4K@15fps video processing with hardware codec support.

Memory hierarchy includes 2.5 MB on-chip L3 OCMC RAM with ECC, dual DDR3/DDR3L EMIF controllers supporting up to DDR3-1066 and 2 GB per channel, and GPMC for NAND/NOR/async memory. Connectivity comprises PCIe Gen2 (2×5-Gbps lanes), dual DCAN (CAN 2.0B), USB 3.0/2.0 dual-role, six McASP audio interfaces, and eight MMC/SD/SDIO ports - all managed via centralized PRCM and debug-enabled CTools infrastructure.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Cores	Dual Arm Cortex-A15 @ up to 1.5 GHz - enables Linux RTOS execution with deterministic control + application partitioning.
DSP Cores	Two TI C66x VLIW floating-point DSPs - supports object-code compatibility with C64x+/C67x and 32×16-bit multiply/cycle throughput.
On-Chip RAM	2.5 MB OCMC RAM with ECC - provides low-latency, error-corrected shared memory for MPU/DSP/GPU/IVA coherency.
Video Acceleration	IVA-HD + 4× EVEs - enables concurrent 4K@15fps H.264 encode/decode and real-time embedded vision analytics.
Graphics	Dual-core PowerVR SGX544 GPU + BB2D (Vivante GC320) - supports OpenGL ES 2.0/3.0 and 2D compositing for rich HMI rendering.
Memory Interface	Dual DDR3/DDR3L EMIF - supports up to DDR3-1066, 2 GB per channel, interleaved addressing for bandwidth optimization.
Connectivity	PCIe Gen2 (2×5-Gbps), SATA Gen2, dual GMAC (MII/RMII/RGMII), USB 3.0 DRD + USB 2.0 DRD - enables high-throughput peripheral expansion and storage.
Package	760-pin FCBGA (ABC), 23 mm × 23 mm, 0.8-mm pitch - requires controlled-impedance PCB layout with 10+ layer stackup for signal integrity.

Pinout & Package

AM5729BABCX uses a 23 mm × 23 mm, 0.8-mm pitch, 760-ball FCBGA (ABC) package with mechanical ball grid defined in TI SPRS953G Figure 4-1. Unused balls include AF7, AF10, AF13, AF16, AF19, AE4, AE25, AB26, W3, W26, T3, T26, N3, N26, K3, K26, G3, D4, D25, C10, C13, C16, C19, C22 (not populated); reserved balls Y5, Y10, K14, B28, A27 must remain unconnected.

Pin/Terminal	Circuit Role	Design Meaning
dcan1_rx	Controller Area Network input	Receives CAN 2.0B-compliant differential signals; requires external termination and isolation for industrial bus noise immunity.
ddr1_ck / ddr1_nck	DDR3 clock pair	Differential clock inputs for EMIF1; routed as matched-length, 100-Ω differential pair with tight skew control (<5 ps).
mmc2_sdwp	eMMC write-protect input	Active-low signal indicating eMMC write protection status; pulled high internally unless externally overridden.
uart8_txd	Universal Asynchronous Receiver/Transmitter output	Drives RS-232/RS-485 level-shifted TX data; supports IrDA/CIR modes via software configuration.
sata1_led	SATA activity indicator output	Open-drain LED driver for SATA link activity; requires external current-limiting resistor (typically 220 Ω to 3.3 V).
hdmi1_cec	HDMI Consumer Electronics Control	Bi-directional 1-wire bus for system-wide remote control interoperability; shares I/O buffer with other CEC-capable peripherals.

Key Features

Feature	Design Value
Dual PRU-ICSS	Two independent programmable real-time units with industrial protocol offload (EtherCAT, PROFINET, Ethernet/IP) - eliminates host CPU overhead for deterministic I/O.
Crypto Accelerators	Hardware AES-128/256, SHA-1/256, DES/3DES, and RNG - enables secure boot, encrypted storage, and TLS offload without software library dependency.
VPE + VIP Subsystem	Video Processing Engine with three Video Input Ports supporting simultaneous 1080p60 capture - enables multi-camera machine vision preprocessing in real time.
EDMA + sDMA	Enhanced Direct Memory Access controller with 64 channels and system DMA - enables zero-CPU-copy data movement between peripherals, memory, and accelerators.
Power Management	PRCM with dynamic voltage/frequency scaling (DVFS) across MPU, DSP, GPU, IVA, and EVE domains - reduces active power by >40% during partial workload operation.
Debug Infrastructure	CTools-enabled JTAG/SWD interface with CoreSight trace - supports non-intrusive instruction tracing, real-time variable monitoring, and hardware breakpoint debugging across all cores.

Applications

Industrial HMI	Smart Camera Analytics
Use Scenario: High-resolution touchscreen panel in factory automation with real-time PLC communication and local video playback. IC Role / Device Role / Timing Role: Central applications processor executing Qt-based GUI, managing dual-display HDMI/LCD output, and coordinating PRU-ICSS for EtherCAT I/O synchronization. Use Value: Single-chip integration of graphics, vision, and industrial networking eliminates FPGA+MPU co-design complexity and reduces BOM cost by 35%.	Use Scenario: Edge AI camera for defect detection in semiconductor wafer inspection using multi-spectral imaging. IC Role / Device Role / Timing Role: Vision analytics hub running CNN inference on EVEs while streaming synchronized 1080p60 video from three VIP channels to DDR via EDMA. Use Value: Hardware-accelerated vision pipeline achieves <12 ms end-to-end latency - enabling sub-millisecond response for closed-loop robotic correction.
Energy Substation Gateway	Medical Imaging Workstation
Use Scenario: IEC 61850-compliant substation gateway aggregating data from multiple IEDs and presenting SCADA visualization over web UI. IC Role / Device Role / Timing Role: Secure communications processor handling TLS 1.2 encryption, dual DCAN for legacy relay interfacing, and PCIe-connected FPGA for protocol bridging. Use Value: Crypto accelerators reduce TLS handshake time by 70%, while dual GMAC ensures redundant 1 Gbps fiber uplinks meet IEC 62443-3-3 security requirements.	Use Scenario: Portable ultrasound workstation requiring real-time beamforming, DICOM export, and touch-based image annotation. IC Role / Device Role / Timing Role: Multi-domain SoC managing RF front-end timing via PRU-ICSS, GPU-accelerated image rendering, and USB 3.0 host for SSD-based DICOM archive. Use Value: Integrated VPE + BB2D enables 60 fps ultrasound video overlay with <5 ms display pipeline latency - critical for clinical responsiveness.

Industrial HMI

Smart Camera Analytics

Use Scenario: High-resolution touchscreen panel in factory automation with real-time PLC communication and local video playback.

IC Role / Device Role / Timing Role: Central applications processor executing Qt-based GUI, managing dual-display HDMI/LCD output, and coordinating PRU-ICSS for EtherCAT I/O synchronization.

Use Value: Single-chip integration of graphics, vision, and industrial networking eliminates FPGA+MPU co-design complexity and reduces BOM cost by 35%.

Use Scenario: Edge AI camera for defect detection in semiconductor wafer inspection using multi-spectral imaging.

IC Role / Device Role / Timing Role: Vision analytics hub running CNN inference on EVEs while streaming synchronized 1080p60 video from three VIP channels to DDR via EDMA.

Use Value: Hardware-accelerated vision pipeline achieves <12 ms end-to-end latency - enabling sub-millisecond response for closed-loop robotic correction.

Energy Substation Gateway

Medical Imaging Workstation

Use Scenario: IEC 61850-compliant substation gateway aggregating data from multiple IEDs and presenting SCADA visualization over web UI.

IC Role / Device Role / Timing Role: Secure communications processor handling TLS 1.2 encryption, dual DCAN for legacy relay interfacing, and PCIe-connected FPGA for protocol bridging.

Use Value: Crypto accelerators reduce TLS handshake time by 70%, while dual GMAC ensures redundant 1 Gbps fiber uplinks meet IEC 62443-3-3 security requirements.

Use Scenario: Portable ultrasound workstation requiring real-time beamforming, DICOM export, and touch-based image annotation.

IC Role / Device Role / Timing Role: Multi-domain SoC managing RF front-end timing via PRU-ICSS, GPU-accelerated image rendering, and USB 3.0 host for SSD-based DICOM archive.

Use Value: Integrated VPE + BB2D enables 60 fps ultrasound video overlay with <5 ms display pipeline latency - critical for clinical responsiveness.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance industrial applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
AM5728BABCX	Omits EVEs, IVA-HD, HDMI, VOUT2/VOUT3, and BB2D - lacks 4K video and embedded vision acceleration.	Suitable for HMI-only or control-focused designs without multi-camera analytics or 4K display.	Select when vision acceleration and 4K decode are unnecessary; reduces thermal load and simplifies PMIC design.
AM5749BABCX	Adds dual Cortex-R5 safety lockstep cores, ISO 26262 ASIL-B support, and enhanced ECC coverage on L3 RAM and DDR interfaces.	Required for automotive ADAS domain controllers or medical devices needing functional safety certification.	Choose only when ASIL-B compliance, lockstep R5 cores, or safety-certified bootloader are mandatory design requirements.

Compared with AM5728BABCX, AM5729BABCX adds full vision acceleration and 4K video capability at higher power; compared with AM5749BABCX, it omits safety cores and certification artifacts - making AM5729BABCX optimal for non-safety-critical industrial vision and HMI where performance density matters most.

Availability

AM5729BABCX is available at Aetrix Electronics and suitable for industrial HMI, smart camera analytics, energy substation gateways, and medical imaging workstations requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for AM5729BABCX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets since 1930.

The AM5729BABCX belongs to TI's Sitara™ Arm processor family, designed specifically for high-performance embedded applications demanding integrated vision, graphics, real-time control, and industrial connectivity - targeting HMI, robotics, and edge analytics.

FAQ

What is the maximum operating frequency of the Cortex-A15 cores in AM5729BABCX?

The AM5729BABCX features dual Arm Cortex-A15 microprocessor cores rated for operation up to 1.5 GHz under recommended thermal and voltage conditions specified in TI's SPRS953G datasheet Section 5.5. This frequency is achievable with proper cooling, compliant DDR3-1066 memory timing, and stable 1.05 V core supply. The AM5729BABCX does not support overclocking beyond this specification.

Does AM5729BABCX support PCIe Gen3 or only Gen2?

The AM5729BABCX implements a PCIe subsystem compliant with PCI Express Base Specification Revision 2.1 - i.e., Gen2 (5 Gbps per lane). It supports either one 2-lane Gen2 port or two independent 1-lane Gen2 ports, but does not support Gen3 signaling. This is confirmed in Section 1.1 Features and Table 3-1 of the SPRS953G datasheet.

How many video input channels does AM5729BABCX support simultaneously?

The AM5729BABCX integrates three Video Input Port (VIP) modules - VIP1, VIP2, and VIP3 - each capable of handling dual-channel parallel video input (e.g., vin1a/vin1b). This enables concurrent capture from up to six independent camera sensors at resolutions up to 1080p60, as documented in Section 1.1 and Table 3-1 of SPRS953G.

Is AM5729BABCX pin-compatible with AM5728BABCX?

Yes, AM5729BABCX is mechanically and electrically pin-compatible with AM5728BABCX and AM5726BABCX - all share the identical 760-ball FCBGA (ABC) package, 23 mm × 23 mm body size, and 0.8-mm pitch. Signal multiplexing and ball functions match across the AM572x family, enabling drop-in replacement where feature set alignment permits.

What power management features are integrated into AM5729BABCX?

The AM5729BABCX includes a comprehensive Power, Reset, and Clock Management (PRCM) subsystem supporting dynamic voltage and frequency scaling (DVFS) across MPU, DSP, GPU, IVA, and EVE domains; independent power rail control; thermal monitoring with junction temperature reporting; and configurable power states including OS-initiated suspend/resume. These capabilities are detailed in Section 1.1 and Chapter 5 of SPRS953G.

AM5729BABCX Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Package/Case:: 760-BFBGA, FCBGA

Series:: Sitara™

Packaging:: Tray

Product Status:: Active

Core Processor:: ARM® Cortex®-A15

Number of Cores/Bus Width:: 2 Core, 32-Bit

Speed:: 1.5GHz

Co-Processors/DSP:: DSP, BB2D, IPU, IVA, GPU, VPE

RAM Controllers:: DDR3, SRAM

Graphics Acceleration:: Yes

Display & Interface Controllers:: -

Ethernet:: GbE (2)

SATA:: SATA 3Gbps (1)

USB:: USB 2.0 (1), USB 3.0 (1)

Voltage - I/O:: 1.8V, 3.3V

Operating Temperature:: 0°C ~ 90°C (TJ)

Grade:: -

Qualification:: -

Security Features:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 760-FCBGA (23x23)

Additional Interfaces:: CAN, EBI/EMI, HDQ/1-Wire®, I2C, McASP, McSPI, MMC/SD/SDIO, PCIe, QSPI, UART

AM5729BABCX FAQ

1.How can I place an order for AM5729BABCX through Aetrix?

Please submit a Request for Quotation (RFQ) for AM5729BABCX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AM5729BABCX reliable?

The price and inventory of AM5729BABCX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM5729BABCX is usually 5 days.

3.What payment methods are accepted for AM5729BABCX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM5729BABCX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AM5729BABCX?

AM5729BABCX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AM5729BABCX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AM5729BABCX?

For technical support, including AM5729BABCX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM5729BABCX requirements.

6.How does Aetrix verify that AM5729BABCX is sourced from the original manufacturer or authorized distributors?

All AM5729BABCX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM5729BABCX meets industry standards.

7.What is the process for return or replacement of AM5729BABCX?

All AM5729BABCX units undergo pre-shipment inspection (PSI). If there is an issue with AM5729BABCX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AM5729BABCX part is unused and in its original packaging.

Return procedure for AM5729BABCX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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