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Texas Instruments AM5K2E02ABDA25

Part No.:
AM5K2E02ABDA25
Manufacturer:
Texas Instruments
Category:
Microprocessors
Package:
1089-BFBGA, FCBGA
Datasheet:
AetrixAM5K2E02ABDA25.pdf
Description:
IC MPU SITARA 1.25GHZ 1089FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,908

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Product details

Overview

AM5K2E02ABDA25 from Texas Instruments is a dual-core ARM Cortex-A15 KeyStone II System-on-Chip (SoC) operating at up to 1.4 GHz, integrating 4 MB shared L2 cache, 2 MB MSMC SRAM, and a 72-bit DDR3/DDR3L interface supporting 1600 MTPS. It delivers 8 Gbps total Ethernet bandwidth via eight SGMII ports and supports IEEE 1588 v2 with Annex D/E/F for precision time synchronization in industrial and networking infrastructure.

For engineers reviewing the AM5K2E02ABDA25 datasheet, AM5K2E02ABDA25 pinout, AM5K2E02ABDA25 application, or AM5K2E02ABDA25 equivalent, key selection considerations include dual-core Cortex-A15 performance, integrated network coprocessor with packet acceleration, hardware security engine (AES/SHA/3DES), and extended temperature support (–40°C to +100°C) for ruggedized deployments.

Technical Context

The AM5K2E02ABDA25 implements TI's KeyStone II architecture centered on TeraNet-a non-blocking multipoint-to-multipoint switch fabric-and the Multicore Shared Memory Controller (MSMC), which provides low-latency access to 2 MB on-chip SRAM and external DDR3 memory. Its ARM CorePac includes two Cortex-A15 cores with full ARMv7-A compliance, LPAE, virtualization extensions, and ACE coherency support.

Network processing is offloaded via dedicated hardware blocks: a 9-port Ethernet switch subsystem (eight 1-GbE SGMII + one 10-GbE XFI), Network Coprocessor with Packet Accelerator (supporting IPsec, GTP-U, SCTP, PDCP), and Security Accelerator enabling up to 6.4 Gbps IPSec and 3 Gbps air ciphering. The device uses SmartReflex voltage scaling and three on-chip PLLs for dynamic power management.

Key Specifications

Parameter Value and Actual Design Meaning
Core Count & Type Dual ARM Cortex-A15 cores, out-of-order superscalar pipeline with Neon/VFPv4, LPAE, and virtualization support
Max Core Frequency 1.4 GHz - enables real-time Layer 2–4 packet processing and control-plane execution without thermal throttling under sustained load
L2 Cache 4 MB unified, shared by both cores - reduces inter-core cache coherency traffic and improves throughput for multi-threaded workloads
On-Chip Memory 2 MB MSMC SRAM - serves as low-latency L3 cache or scratchpad for real-time firmware, bypassing DDR3 latency
DDR3 Interface 72-bit bus (64-bit data + 8-bit ECC) at 1600 MTPS - supports up to 12.8 GB/s peak bandwidth with error correction for mission-critical reliability
Ethernet Ports Eight 1-GbE SGMII + one 10-GbE XFI - enables wire-rate switching and MACSEC encryption across all ports simultaneously
Temperature Range –40°C to +100°C (extended case) - qualified for deployment in avionics, defense, and industrial edge systems without active cooling

Pinout & Package

AM5K2E02ABDA25 is housed in a 1089-pin Flip-Chip Plastic BGA (FCBGA) package designated ABD, measuring 27 mm × 27 mm with 0.8 mm ball pitch. The package supports high-speed signal integrity for DDR3, PCIe Gen2, SGMII/XFI, and HyperLink interfaces, and includes dedicated power/ground ball arrays per I/O bank and core domain.

Pin/Terminal Circuit Role Design Meaning
DDR3_DQ[0:63] DDR3 Data Bus 64-bit bidirectional data path with byte-level DQS strobes - enables full-width burst transfers aligned to DDR3-1600 timing requirements
DDR3_ADDR[0:15] DDR3 Address & Command 16-bit address/command bus with BA[0:2] - supports up to 32 GB addressing with bank-interleaved access patterns
SGMII_TX[0:7]/RX[0:7] SGMII Serial Interface Eight differential pairs for 1.25 Gbps serial links - each pair connects directly to an internal PHY with embedded clock recovery and auto-negotiation
XFI_TX/XFI_RX 10-GbE Serial Interface Differential pair supporting 10.3125 Gbps line rate - connects to external 10GBASE-R PHY or optical module with IEEE 802.3ae compliance
HYPERLINK_TX[0:3]/RX[0:3] Chip-to-Chip Interconnect Four differential lanes at 12.5 Gbaud per lane - enables 50 GBaud aggregate bandwidth for deterministic low-latency expansion with other KeyStone II devices
ARM_JTAG_TCK/TMS/TDI/TDO JTAG Debug Interface IEEE 1149.1-compliant boundary scan and core debug - supports real-time trace, breakpoint injection, and secure boot verification during development

Key Features

Feature Design Value
ARMv7-A Architecture Compliance Full implementation including Thumb-2, NEON SIMD, VFPv4, TrustZone security, and Large Physical Address Extension (LPAE) for >4 GB RAM support
Multicore Navigator Queuing 8,192 hardware-managed queues with zero-overhead packet DMA - eliminates software polling and enables lock-free inter-core communication
Hardware Security Acceleration Integrated crypto engine supporting AES-128/256, SHA-1/256, HMAC, GMAC, RSA-2048, and 3GPP air ciphering (Kasumi/SNOW3G) at up to 6.4 Gbps IPSec throughput
IEEE 1588 v2 Time Stamping Hardware timestamping at ingress/egress of all Ethernet ports with Annex D/E/F support - achieves sub-100 ns timestamp resolution for TSN and PTP grandmaster applications
SmartReflex Dynamic Voltage Scaling Real-time core voltage adjustment based on workload and temperature - reduces active power by up to 30% while maintaining 1.4 GHz operation within thermal limits

Applications

Industrial Edge Gateway Avionics Data Concentrator

Use Scenario: Real-time aggregation and protocol translation of CAN, ARINC 429, and MIL-STD-1553 sensor data into deterministic Ethernet streams for flight control systems.

IC Role / Device Role / Timing Role: Central SoC executing deterministic Linux RT, managing time-synchronized packet forwarding, and enforcing DO-178C-compliant safety partitions via ARM TrustZone.

Use Value: Dual Cortex-A15 cores deliver guaranteed CPU cycles for safety-critical tasks while hardware accelerators offload encryption and timestamping-meeting <10 µs jitter requirements for fly-by-wire networks.

Use Scenario: High-integrity data routing between cockpit displays, radar processors, and maintenance diagnostics over deterministic 10GbE backplane links.

IC Role / Device Role / Timing Role: Time-aware switch controller with IEEE 1588 Annex E/F hardware timestamping and TSN-aware queue scheduling for synchronized sensor fusion.

Use Value: Sub-50 ns timestamp accuracy and hardware-based traffic shaping ensure deterministic latency across 8× SGMII and 1× XFI ports-enabling compliance with ARINC 664 Part 7 (AFDX) end-system timing budgets.

5G Radio Unit Controller Enterprise SD-WAN Appliance

Use Scenario: Baseband processing coordination and fronthaul transport (eCPRI/CPRI) between FPGA-based radio processing units and centralized BBU pools.

IC Role / Device Role / Timing Role: Control-plane processor interfacing with PCIe Gen2 FPGAs, managing eCPRI encapsulation, and synchronizing to SyncE/PTP clocks via hardware timestamping.

Use Value: Integrated 10-GbE XFI port and 8× SGMII enable simultaneous fronthaul aggregation and backhaul termination-reducing component count versus discrete switch + controller solutions.

Use Scenario: Multi-WAN branch router performing encrypted tunneling (IPsec/GRE), application-aware QoS, and deep packet inspection at line rate.

IC Role / Device Role / Timing Role: Forwarding engine leveraging Network Coprocessor for stateless NAT, TCP segmentation offload, and hardware-accelerated TLS 1.3 termination.

Use Value: 6.4 Gbps IPSec throughput and 1.5 Mpps packet processing eliminate software bottlenecks-enabling full 10-GbE WAN link utilization with end-to-end encryption and zero CPU overhead.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multicore ARM SoC applications.

Alternative Part Technical Difference Application Difference Selection Advice
AM5K2E04ABDA25 Quad-core Cortex-A15 (vs. dual-core); identical package, peripherals, and memory subsystem - adds 100% more compute headroom for control-plane scaling Preferred for cloud-native NFV workloads requiring >2 virtual machines or concurrent real-time analytics pipelines Select when application demands >2.8 GHz aggregate CPU capacity or requires independent core partitioning for ASIL-D isolation
Xilinx Zynq UltraScale+ MPSoC ZU19EG FPGA fabric + quad-core Cortex-A53 + dual-core R5; no native 10-GbE XFI or hardware 1588 Annex E/F - relies on PL-side soft IP for timing features Better suited for adaptive compute workloads (e.g., AI inference acceleration, custom protocol stacks) where reconfigurable logic adds value Choose when hardware-defined flexibility (e.g., custom packet parsing, dynamic function offload) outweighs deterministic timing and integrated network acceleration

Compared with AM5K2E02ABDA25, the AM5K2E04ABDA25 offers higher core density without changing footprint or thermal envelope, while the ZU19EG trades fixed-function network acceleration for programmable logic - making AM5K2E02ABDA25 optimal for deterministic, standards-compliant time-sensitive networking where hardware timestamping and packet acceleration are non-negotiable.

Availability

AM5K2E02ABDA25 is available at Aetrix Electronics and suitable for industrial edge gateways, avionics data concentrators, 5G radio unit controllers, and enterprise SD-WAN appliances requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for AM5K2E02ABDA25 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and communications markets since 1930.

The AM5K2E02ABDA25 belongs to TI's KeyStone II multicore SoC family, designed specifically for high-performance, power-efficient infrastructure applications demanding integrated networking, security, and deterministic real-time processing - especially in avionics, defense, and enterprise networking.

FAQ

What is the maximum DDR3 memory bandwidth supported by the AM5K2E02ABDA25?

The AM5K2E02ABDA25 supports a 72-bit DDR3/DDR3L interface operating at up to 1600 MTPS, delivering a theoretical peak bandwidth of 12.8 GB/s (64-bit data path × 1600 MHz ÷ 8). The 8-bit ECC lane ensures data integrity without reducing usable bandwidth, and the MSMC controller minimizes latency for critical code/data fetches. This bandwidth is fully utilized by the dual Cortex-A15 cores and network coprocessor in sustained packet-forwarding scenarios.

Does the AM5K2E02ABDA25 support IEEE 1588 Precision Time Protocol in hardware?

Yes, the AM5K2E02ABDA25 includes full hardware implementation of IEEE 1588 v2 with Annex D, E, and F support. Timestamping occurs at the physical layer for all eight SGMII and the single XFI Ethernet ports, achieving sub-100 ns resolution. Hardware timestamp registers are accessible via memory-mapped I/O, and the device supports transparent clock and boundary clock modes - eliminating software-induced jitter in time-critical applications like TSN and AFDX.

What security acceleration capabilities does the AM5K2E02ABDA25 provide?

The AM5K2E02ABDA25 integrates a dedicated Security Accelerator supporting AES-128/256 (ECB/CBC/CTR/GCM), SHA-1/256, HMAC, GMAC, RSA-2048, and 3GPP air ciphering (Kasumi, SNOW3G) with throughput up to 6.4 Gbps for IPSec and 3 Gbps for air interface encryption. These functions operate independently of the ARM cores, enabling full-line-rate encrypted tunneling without CPU overhead - verified in TI's SPRS864D datasheet Section 1.1 and Table 3-1.

Is the AM5K2E02ABDA25 pin-compatible with the AM5K2E04ABDA25?

Yes, the AM5K2E02ABDA25 and AM5K2E04ABDA25 share identical 1089-pin ABD package dimensions, ball map, power sequencing, and peripheral pinouts - including DDR3, SGMII, XFI, PCIe, USB, and JTAG interfaces. The only functional difference is core count (dual vs. quad Cortex-A15); all other subsystems, memory controllers, and accelerators are architecturally identical and electrically compatible.

What development tools are officially supported for the AM5K2E02ABDA25?

Texas Instruments officially supports Code Composer Studio (CCS) IDE with full debug, trace, and profiling for the AM5K2E02ABDA25, alongside TI's Processor SDK Linux and RTOS offerings. Hardware tools include the XDS200/XDS560v2 emulators and the AM5K2E0x Evaluation Module (EVM). GNU GCC toolchains and open-source Linux distributions (e.g., Yocto Project) are validated per SPRS864D Section 3.2.1 and TI's KeyStone II documentation suite.

AM5K2E02ABDA25 Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Package/Case:
1089-BFBGA, FCBGA
Series:
Sitara™
Packaging:
Tray
Product Status:
Active
Core Processor:
ARM® Cortex®-A15
Number of Cores/Bus Width:
2 Core, 32-Bit
Speed:
1.25GHz
Co-Processors/DSP:
Network
RAM Controllers:
DDR3, SRAM
Graphics Acceleration:
No
Display & Interface Controllers:
-
Ethernet:
1GBE (8)
SATA:
-
USB:
USB 3.0 (2)
Voltage - I/O:
1.35V, 1.5V, 1.8V, 3.3V
Operating Temperature:
-40°C ~ 100°C (TC)
Grade:
-
Qualification:
-
Security Features:
-
Mounting Type:
Surface Mount
Supplier Device Package:
1089-FCBGA (27x27)
Additional Interfaces:
EBI/EMI, I2C, PCIe, SPI, TSIP, UART, USIM

AM5K2E02ABDA25 FAQ

1.How can I place an order for AM5K2E02ABDA25 through Aetrix?

Please submit a Request for Quotation (RFQ) for AM5K2E02ABDA25 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AM5K2E02ABDA25 reliable?

The price and inventory of AM5K2E02ABDA25 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM5K2E02ABDA25 is usually 5 days.

3.What payment methods are accepted for AM5K2E02ABDA25?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM5K2E02ABDA25 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for AM5K2E02ABDA25?

AM5K2E02ABDA25 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AM5K2E02ABDA25 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AM5K2E02ABDA25?

For technical support, including AM5K2E02ABDA25 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM5K2E02ABDA25 requirements.

6.How does Aetrix verify that AM5K2E02ABDA25 is sourced from the original manufacturer or authorized distributors?

All AM5K2E02ABDA25 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM5K2E02ABDA25 meets industry standards.

7.What is the process for return or replacement of AM5K2E02ABDA25?

All AM5K2E02ABDA25 units undergo pre-shipment inspection (PSI). If there is an issue with AM5K2E02ABDA25, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AM5K2E02ABDA25 part is unused and in its original packaging.

Return procedure for AM5K2E02ABDA25:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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