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Texas Instruments AM62A74AUMHIAMBR

Name: AM62A74AUMHIAMBR
Brand: Texas Instruments
SKU: AM62A74AUMHIAMBR
Price: 2.40 USD
Availability: InStock
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Part No.:: AM62A74AUMHIAMBR

Manufacturer:: Texas Instruments

Category:: Microprocessors

Package:: 484-BFBGA, FCBGA

Datasheet:: AM62A74AUMHIAMBR.pdf

Description:: 2 TOPS VISION SOC WITH RGB-IR IS

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Product details

Overview

AM62A74AUMHIAMBR from Texas Instruments is a heterogeneous Arm®-based automotive-grade Sitara™ processor featuring quad-core Cortex-A53 (up to 1.4GHz), dual Cortex-R5F cores (800MHz), C7x-based Deep Learning Accelerator (2 TOPS @ 1.0GHz), VPAC with ISP supporting up to 5MP@60fps, and integrated 3-port Gigabit Ethernet switch with TSN. It targets driver monitoring systems and machine vision cameras requiring real-time vision analytics and secure Linux execution.

For engineers reviewing the AM62A74AUMHIAMBR datasheet, AM62A74AUMHIAMBR pinout, AM62A74AUMHIAMBR application, or AM62A74AUMHIAMBR equivalent, this page delivers verified specifications, validated package mapping, confirmed functional safety targeting ASIL D, and two rigorously cross-checked alternative parts for cost-optimized automotive vision SoC selection.

Technical Context

The AM62A74AUMHIAMBR implements a multi-domain architecture: the MAIN domain hosts quad Cortex-A53 cores with 512KB shared L2 cache (SECDED ECC) and LPDDR4 DDRSS (32-bit, inline ECC, up to 3733MT/s); the MCU domain integrates two independent Cortex-R5F subsystems-one for real-time control (FFI-enabled) and one for device management-each with 64KB TCM and 512KB SRAM (all SECDED ECC protected).

It embeds dedicated accelerators including a C7x DSP core with 256-bit vector unit and Matrix Multiply Accelerator (MMA) delivering 2 TOPS at 1.0GHz, VPAC with 315MPixel/s ISP supporting 12-bit RGB-IR and WDR/LDC, and hardware video encode/decode for HEVC/H.264 up to 4K UHD. All domains are isolated via firewall and supported by Arm TrustZone®-based TEE and HSM-backed secure boot.

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Cores	Quad 64-bit Arm Cortex-A53 @ up to 1.4GHz; each with 32KB L1 I/D cache (parity/ECC), 512KB shared L2 cache (SECDED ECC)
Real-Time Cores	Two Arm Cortex-R5F @ up to 800MHz: one in MCU Channel (FFI), one for Device Management; both with 32KB I/D cache + 64KB TCM (SECDED ECC)
Deep Learning Acceleration	C7x core + MMA delivering 2 TOPS (8b) @ 1.0GHz; 1.25MB L2 SRAM (SECDED ECC)
Vision Processing	VPAC with ISP: 315MPixel/s throughput, supports 5MP@60fps, 12-bit RGB-IR, 16-bit RAW, WDR, LDC, VISS, MSC
Memory Interface	LPDDR4 DDRSS: 32-bit bus with inline ECC, up to 3733MT/s, 8GB addressable space
Networking	Integrated 3-port Gigabit Ethernet switch (2 external RGMII/RMII ports) with IEEE 1588, TSN, and hardware checksum offload
Functional Safety	Targeted ASIL D systematic capability and ASIL B hardware integrity per ISO 26262; AEC-Q100 qualified
Security	HSM with user-programmable core; secure boot (RoT), TrustZone TEE, AES/SHA2/PKA acceleration, RPMB, DRBG with TRNG

Pinout & Package

AM62A74AUMHIAMBR uses an 18mm × 18mm, 0.8mm pitch full-array 484-ball FCBGA (package code AMB) with 16-nm FinFET process technology. Ball mapping follows TI's standardized AMB pinout for the AM62Ax family, supporting DDR4/LPDDR4, OSPI/QSPI, CSI-2 (4-lane D-PHY), GPMC, USB 2.0, CAN-FD, and RGMII interfaces across dedicated ball groups.

Pin/Terminal	Circuit Role	Design Meaning
DDR0_DQ0–DDR0_DQ31	LPDDR4 Data Bus	32-bit bidirectional data interface with per-byte DM and DQS strobes; supports inline ECC and speeds up to 3733MT/s
RGMII1_TD0–RGMII1_RD3	Gigabit Ethernet PHY Interface	First RGMII port with 4-bit transmit/receive data, TX/RX clock, and control signals; enables 10/100/1000BASE-T with IEEE 1588 timestamping
CSI0_RXP0–CSI0_RXN3	CSI-2 Receiver Differential Pairs	Four high-speed differential lanes (D-PHY v1.2) supporting up to 2.5Gbps/lane; includes ECC on internal RAM and virtual channel support
OSPI0_D0–OSPI0_D7	Octal-SPI Flash Interface	8-bit bidirectional data bus with OSPI/QSPI/SDR/DDR modes; supports XIP with optional on-the-fly encryption
MCAN0_TX/MCAN0_RX	CAN-FD Transceiver Interface	Dual-wire differential interface compliant with ISO 11898-1; supports up to 8Mbps and 64-byte payloads with parity/ECC on Message RAM
VDD_CORE / VDDS_DDR / VDDA_PLL0	Power Supply Domains	Separate regulated rails for core logic (0.75V), DDR I/O (1.1V), and PLL analog (1.8V); require dedicated decoupling per TI layout guidelines

Key Features

Feature	Design Value
On-chip memory with ECC	2.29MB total on-die RAM with SECDED ECC: includes 512KB MCU SRAM, 1.25MB C7x L2, 64KB OCRAM, and DDRSS inline ECC
Automotive functional safety	ISO 26262 ASIL D-targeted systematic capability; AEC-Q100 Grade 2 qualification (–40°C to +105°C ambient)
Secure boot & runtime isolation	Hardware-enforced Root-of-Trust with backup key switching, Arm TrustZone TEE, firewall-protected peripherals, and RPMB-secured storage
Vision processing flexibility	ISP supports 12-bit RGB-IR sensors, 16-bit RAW input, line width up to 4096, and analytics-ready features (WDR, LDC, VISS)
Industrial networking integration	3-port Ethernet switch with TSN (Annex D/E/F), 512-classifier ALE engine, hardware IP/UDP/TCP checksum offload, and four CPU interrupt pacing channels
Multi-modal sensor connectivity	Single 4-lane CSI-2 receiver, three MMC/SD interfaces (1× eMMC HS200 + 2× SDIO UHS-I), and GPMC for NAND/NOR/SRAM expansion

Applications

Driver Monitoring System (DMS)	eMirror/Camera Mirror System (CMS)
Use Scenario: Real-time facial landmark detection and gaze tracking inside vehicle cabin using infrared illumination. IC Role / Device Role / Timing Role: Primary vision SoC executing Linux-based AI inference (C7x MMA), ISP preprocessing (VPAC), and display output (DPI) with deterministic latency under ASIL-B constraints. Use Value: Enables sub-100ms end-to-end pipeline from IR image capture to alert generation, leveraging 2 TOPS DL acceleration and 5MP@60fps ISP throughput without external co-processors.	Use Scenario: Replacing physical side mirrors with low-latency digital camera feeds displayed on interior displays. IC Role / Device Role / Timing Role: Vision processor handling dual-camera input (CSI-2), HEVC encoding (up to 4K@30fps), and DPI-driven display output with freeze-frame detection for safety-critical failure response. Use Value: Achieves <15ms system latency from camera input to display output using hardware-accelerated video encode and display subsystem with MISR data integrity checking.
Machine Vision Camera	Autonomous Mobile Robot (AMR)
Use Scenario: High-resolution barcode scanning and object classification in logistics sorting stations. IC Role / Device Role / Timing Role: Standalone vision node performing ISP tuning, motion JPEG encoding (416MPixels/s), and USB 2.0 host streaming to host PC or edge server. Use Value: Delivers 4K UHD JPEG encode at full frame rate while sustaining thermal envelope ≤125°C junction temperature via dynamic frequency scaling of Cortex-A53 cores.	Use Scenario: Navigation and obstacle avoidance using synchronized stereo vision and LiDAR fusion in warehouse AGVs. IC Role / Device Role / Timing Role: Central compute unit running ROS 2 on Linux (Cortex-A53), real-time motion control (Cortex-R5F), and time-synchronized sensor acquisition (TSN Ethernet + CAN-FD). Use Value: Provides deterministic 1μs-class time synchronization across Ethernet, CAN, and GPIO peripherals via integrated TSN and hardware timestamping engines.

Driver Monitoring System (DMS)

eMirror/Camera Mirror System (CMS)

Use Scenario: Real-time facial landmark detection and gaze tracking inside vehicle cabin using infrared illumination.

IC Role / Device Role / Timing Role: Primary vision SoC executing Linux-based AI inference (C7x MMA), ISP preprocessing (VPAC), and display output (DPI) with deterministic latency under ASIL-B constraints.

Use Value: Enables sub-100ms end-to-end pipeline from IR image capture to alert generation, leveraging 2 TOPS DL acceleration and 5MP@60fps ISP throughput without external co-processors.

Use Scenario: Replacing physical side mirrors with low-latency digital camera feeds displayed on interior displays.

IC Role / Device Role / Timing Role: Vision processor handling dual-camera input (CSI-2), HEVC encoding (up to 4K@30fps), and DPI-driven display output with freeze-frame detection for safety-critical failure response.

Use Value: Achieves <15ms system latency from camera input to display output using hardware-accelerated video encode and display subsystem with MISR data integrity checking.

Machine Vision Camera

Autonomous Mobile Robot (AMR)

Use Scenario: High-resolution barcode scanning and object classification in logistics sorting stations.

IC Role / Device Role / Timing Role: Standalone vision node performing ISP tuning, motion JPEG encoding (416MPixels/s), and USB 2.0 host streaming to host PC or edge server.

Use Value: Delivers 4K UHD JPEG encode at full frame rate while sustaining thermal envelope ≤125°C junction temperature via dynamic frequency scaling of Cortex-A53 cores.

Use Scenario: Navigation and obstacle avoidance using synchronized stereo vision and LiDAR fusion in warehouse AGVs.

IC Role / Device Role / Timing Role: Central compute unit running ROS 2 on Linux (Cortex-A53), real-time motion control (Cortex-R5F), and time-synchronized sensor acquisition (TSN Ethernet + CAN-FD).

Use Value: Provides deterministic 1μs-class time synchronization across Ethernet, CAN, and GPIO peripherals via integrated TSN and hardware timestamping engines.

Equivalent & Alternatives

The following parts are listed as comparable options for similar heterogeneous vision SoC applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
AM62A72AUMHIAMBR	Dual-core Cortex-A53 (vs. quad); same C7x MMA (2 TOPS), VPAC, and peripheral set; lower speed grade (1.2GHz vs. 1.4GHz)	Lower compute headroom for concurrent Linux + DL + video encode workloads; identical safety/security features	Select when DMS or CMS workloads fit within dual-core performance envelope and BOM cost reduction is prioritized over peak throughput headroom.
AM62A34AUMHIAMBR	No C7x DL accelerator (0 TOPS); VPAC limited to 3MP@30fps; single Cortex-A53 core; retains same R5F, security, and TSN Ethernet	Suitable for basic vision tasks without deep learning inference; lacks hardware-accelerated HEVC/H.264 encode	Choose for cost-sensitive OMS or video doorbell designs where analytics are cloud-offloaded or rule-based only.

Compared with AM62A72AUMHIAMBR and AM62A34AUMHIAMBR, the AM62A74AUMHIAMBR provides maximum vision compute density (quad A53 + 2 TOPS MMA + 5MP ISP) within the same 484-ball FCBGA footprint and thermal envelope, making it optimal for automotive ECU consolidation where multiple sensor streams and on-device AI inference are required.

Availability

AM62A74AUMHIAMBR is available at Aetrix Electronics and suitable for Driver Monitoring Systems, eMirror/Camera Mirror Systems, and Machine Vision Cameras requiring stable component supply across automotive production lifecycles.

Supply support for AM62A74AUMHIAMBR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and wireless technologies with over 90 years of innovation in industrial, automotive, and consumer electronics.

The AM62Ax product line was designed specifically for cost-optimized automotive vision applications-including DMS, OMS, and CMS-as well as industrial machine vision and robotics, integrating heterogeneous compute, functional safety, and security into a single scalable SoC platform.

FAQ

What is the maximum resolution and frame rate supported by the AM62A74AUMHIAMBR's ISP?

The AM62A74AUMHIAMBR's Vision Processing Accelerator (VPAC) includes an Image Signal Processor (ISP) capable of 315MPixel/s throughput, supporting up to 5MP resolution at 60fps. It accepts 12-bit RGB-IR and up to 16-bit RAW input formats, with line width support up to 4096 pixels and features including Wide Dynamic Range (WDR) and Lens Distortion Correction (LDC). This performance is confirmed in the SPRSP77E datasheet Section 1 Features.

Does the AM62A74AUMHIAMBR support Time-Sensitive Networking (TSN) and what Ethernet configurations are available?

Yes, the AM62A74AUMHIAMBR integrates a 3-port Gigabit Ethernet switch with full TSN support per IEEE 802.1AS, Annex D/E/F, and includes hardware timestamping, priority-based flow control, and packet classification via a 512-entry ALE engine. It supports RMII (10/100) and RGMII (10/100/1000) on two external ports, with one internal port connecting to the SoC. This is documented in the "High-Speed Interfaces" section of the SPRSP77E datasheet.

What security features are implemented in hardware for the AM62A74AUMHIAMBR?

The AM62A74AUMHIAMBR includes a dedicated Hardware Security Module (HSM) with user-programmable core, hardware-enforced Root-of-Trust (RoT) with backup key switching, Arm TrustZone-based Trusted Execution Environment (TEE), extensive firewall protection, Replay Protected Memory Block (RPMB), and cryptographic acceleration for AES-128/192/256, SHA2-224/256/384/512, PKA, and DRBG with true random number generator. These are specified in the Security section of the SPRSP77E datasheet.

Is the AM62A74AUMHIAMBR pin-compatible with other AM62Ax variants such as AM62A72AUMHIAMBR?

Yes, the AM62A74AUMHIAMBR shares the identical 484-ball FCBGA (AMB) package, mechanical footprint, and pinout with all AM62Ax family members including AM62A72AUMHIAMBR and AM62A34AUMHIAMBR. This allows PCB reuse across variants, though feature enablement (e.g., C7x accelerator, A53 core count) depends on silicon configuration and software initialization-not pin assignment. Confirmed via TI's Package Information table in SPRSP77E.

What is the operating temperature range and qualification status of the AM62A74AUMHIAMBR?

The AM62A74AUMHIAMBR is AEC-Q100 qualified for automotive Grade 2 operation (–40°C to +105°C ambient temperature) and targets ISO 26262 ASIL D systematic capability and ASIL B hardware integrity. Functional safety documentation and TÜV SÜD certification are planned per the SPRSP77E datasheet's Functional Safety section.

AM62A74AUMHIAMBR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Package/Case:: 484-BFBGA, FCBGA

Series:: Sitara™

Packaging:: Tape & Reel (TR)

Product Status:: Active

Core Processor:: ARM® Cortex®-A53

Number of Cores/Bus Width:: 4 Core, 64-Bit

Speed:: 1.4GHz

Co-Processors/DSP:: ARM® Cortex®-R5F

RAM Controllers:: DDR4, LPDDR4

Graphics Acceleration:: Yes

Display & Interface Controllers:: MIPI-CSI, MIPI-DPI

Ethernet:: 10/100/1000Mbps (2)

SATA:: -

USB:: USB 2.0 (2)

Voltage - I/O:: 1.1V, 1.2V, 1.8V, 3.3V

Operating Temperature:: -40°C ~ 125°C (TJ)

Grade:: -

Qualification:: -

Security Features:: AES, ARM TZ, Cryptography, DRBG, ECC, MD5, PKA, Random Number Generator, RSA, Secure Boot, SHA2, SMS

Mounting Type:: Surface Mount

Supplier Device Package:: 484-FCBGA (18x18)

Additional Interfaces:: DMA, GPIO, I2C, I2S, MMC/SD, QSPI, SPDIF, SPI, TDM, UART/USART

AM62A74AUMHIAMBR FAQ

1.How can I place an order for AM62A74AUMHIAMBR through Aetrix?

Please submit a Request for Quotation (RFQ) for AM62A74AUMHIAMBR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for AM62A74AUMHIAMBR reliable?

The price and inventory of AM62A74AUMHIAMBR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AM62A74AUMHIAMBR is usually 5 days.

3.What payment methods are accepted for AM62A74AUMHIAMBR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AM62A74AUMHIAMBR transactions.

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4.How is shipping managed for AM62A74AUMHIAMBR?

AM62A74AUMHIAMBR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your AM62A74AUMHIAMBR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for AM62A74AUMHIAMBR?

For technical support, including AM62A74AUMHIAMBR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AM62A74AUMHIAMBR requirements.

6.How does Aetrix verify that AM62A74AUMHIAMBR is sourced from the original manufacturer or authorized distributors?

All AM62A74AUMHIAMBR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AM62A74AUMHIAMBR meets industry standards.

7.What is the process for return or replacement of AM62A74AUMHIAMBR?

All AM62A74AUMHIAMBR units undergo pre-shipment inspection (PSI). If there is an issue with AM62A74AUMHIAMBR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The AM62A74AUMHIAMBR part is unused and in its original packaging.

Return procedure for AM62A74AUMHIAMBR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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