My Inquiry
My Account
Alpha & Omega Semiconductor Inc. AOZ1327DI-02
- Part No.:
- AOZ1327DI-02
- Manufacturer:
- Alpha & Omega Semiconductor Inc.
- Package:
- 12-VFDFN Exposed Pad
- Datasheet:
-
AOZ1327DI-02.pdf
- Description:
- IC PWR SWITCH N-CHAN 1:1 12DFN
- Quantity:
- Payment:
- Shipping:
Inventory:3,834
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
AOZ1327DI-02 from Alpha and Omega Semiconductor is a latch-off high-side protection switch with True Reverse Current Blocking (TRCB), 20 mΩ typical RON, 8 A continuous current rating, and 3.4–22 V input voltage range - designed for USB Type-C PD power delivery in docking stations and portable computing systems.
For engineers reviewing the AOZ1327DI-02 datasheet, pinout, applications, or equivalent options, key selection criteria include fault recovery mode (latch-off), programmable OVP threshold (5.8 V or 24 V), TRCB threshold (26 mV), soft-start control via external capacitor, and thermal shutdown at 140°C with 30°C hysteresis.
Technical Context
The AOZ1327DI-02 integrates two back-to-back N-channel MOSFETs to enable bidirectional isolation and true reverse-current blocking. Its control logic monitors VIN, VOUT, and die temperature continuously, triggering immediate turn-off on over-voltage (OVP), reverse-bias (VOUT > VIN + 26 mV), or over-temperature (>140°C) events.
Unlike auto-restart variants, the AOZ1327DI-02 remains latched off after any fault until ENB is toggled or VIN is cycled. Its soft-start ramp time (e.g., 20 ms typical with CSS = 5.6 nF) is programmable via external capacitor on SS pin, limiting inrush into highly capacitive loads while operating in linear mode during startup.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Input Voltage Range | 3.4 V to 22 V - supports full USB PD 3.0 voltage range including 20 V profiles. |
| RON (Typical) | 20 mΩ at VIN = 20 V - enables <160 mW conduction loss at 8 A, minimizing thermal stress. |
| Fault Recovery | Latch-off - requires explicit ENB toggle or VIN cycle to clear FLTB and re-enable; prevents uncontrolled restarts in safety-critical paths. |
| OVP Threshold | Selectable: 5.8 V (POVP open) or 24 V (POVP grounded) - configurable for legacy 5 V rails or USB PD 20 V operation. |
| TRCB Threshold | 26 mV (VOUT − VIN) - blocks reverse current before parasitic body diode conduction begins, eliminating leakage in dual-power-domain systems. |
| Thermal Shutdown | 140°C with 30°C hysteresis - ensures safe derating under sustained 8 A load with DFN3x3-12L package θJA = 36°C/W. |
| Soft-Start Control | Programmable via external CSS capacitor - sets 10%–90% VOUT ramp time (e.g., ~20 ms with 5.6 nF), limiting inrush into 68 µF+ output capacitance. |
Pinout & Package
AOZ1327DI-02 is housed in a thermally enhanced 3 mm × 3 mm DFN-12L package (DFN3x3B-12L) with exposed thermal pad (EXP) electrically isolated and required for thermal performance. The package operates from −40°C to +85°C ambient and supports ≥8 A continuous current with proper PCB copper layout.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VIN (Pins 11, 12) | Power input terminal | Accepts 3.4–22 V supply; rated to 28 V absolute max; connects to upstream adapter or PD controller. |
| VOUT (Pins 1, 2) | Power output terminal | Delivers switched power to downstream load; isolated from VIN when off; supports TRCB detection. |
| ENB (Pin 5) | Active-low enable input | Logic low (≤0.6 V) enables switch; high (≥1.4 V) disables; 10 µA internal pull-down ensures default-off state. |
| FLTB (Pin 4) | Open-drain fault indicator | Active-low signal asserts within 1 µs of OVP/TRCB/thermal fault; requires external pull-up for system monitoring. |
| POVP (Pin 3) | OVP threshold select | GND selects 24 V OVP; open selects 5.8 V OVP; internal 8 µA bias sets threshold via resistor divider if used. |
| SS (Pin 7) | Soft-start timing node | Connect external capacitor (≥0.23 nF) to GND to set linear VOUT ramp time; controls inrush into COUT. |
| GND (Pin 6) | Reference ground | System ground reference for all analog comparators, logic, and thermal sensing; must be low-impedance. |
| NC (Pins 8, 9, 10) | No-connect terminals | Internally unconnected; must remain floating - no routing or soldering allowed. |
| EXP (Exposed Pad) | Common drain / thermal node | Electrically isolated common drain of back-to-back MOSFETs; must connect to large isolated copper pour via multiple vias for thermal dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| True Reverse Current Blocking (TRCB) | 26 mV detection threshold with sub-500 ns response - eliminates body-diode conduction and prevents backfeed in dual-supply or hot-swap systems. |
| Programmable Over-Voltage Protection | Two-point OVP selection (5.8 V or 24 V) via POVP pin - avoids false trips during USB PD voltage transitions while protecting downstream 5 V or 20 V circuitry. |
| Configurable Fault Recovery Mode | Latch-off behavior ensures persistent disable after fault - mandatory for systems requiring manual reset or host-controlled recovery (e.g., certified docking stations). |
| Adjustable Soft-Start Slew Rate | External CSS capacitor sets VOUT ramp time (e.g., 20 ms typical) - limits peak inrush into 68 µF+ bulk capacitance without external series resistors. |
| Robust ESD & Surge Immunity | ±8 kV IEC 61000-4-2 on VIN, 40 V IEC 61000-4-5 on VOUT (no input capacitor required) - reduces need for external TVS in compact USB-C designs. |
Applications
| USB-C Docking Station Power Switch | Portable Laptop PD Input Protection |
|---|---|
|
Use Scenario: A Thunderbolt 4 docking station routes up to 100 W (20 V/5 A) from host laptop to peripherals while supporting reverse charging. IC Role / Device Role / Timing Role: High-side protection switch enabling/disabling VBUS path with TRCB to prevent backfeed from dock peripherals to laptop during disconnect. Use Value: Latch-off fault response prevents automatic re-engagement after overvoltage event (e.g., faulty cable), ensuring host system remains protected until user intervention. |
Use Scenario: A thin-and-light notebook implements USB-C PD as primary input, requiring robust overvoltage and reverse-current protection against non-compliant chargers. IC Role / Device Role / Timing Role: Primary input protection switch placed between USB-C receptacle and system PMIC, with programmable 24 V OVP matching PD spec. Use Value: 20 mΩ RON minimizes voltage drop and self-heating at 8 A, preserving battery runtime and thermal margin in space-constrained chassis. |
| Desktop Monitor VBUS Management | USB-C Dongle Power Path Control |
|
Use Scenario: A 4K monitor accepts 60 W PD input for display and USB hub functionality, with strict requirements for surge immunity and fault containment. IC Role / Device Role / Timing Role: Front-end power switch with IEC 61000-4-5 40 V surge tolerance on VOUT and ±8 kV ESD on VIN - eliminates need for discrete TVS diodes. Use Value: Exposed thermal pad design enables reliable 8 A operation on 2-layer PCBs using standard FR-4, reducing BOM count and layout complexity. |
Use Scenario: A compact USB-C to HDMI/USB-A dongle draws power from host laptop and must avoid backfeeding or latch-up during plug/unplug cycles. IC Role / Device Role / Timing Role: Single-chip solution integrating UVLO, OVP, TRCB, and thermal shutdown - replaces discrete protection FET + comparator + logic. Use Value: 3 mm × 3 mm DFN-12L footprint fits within tight dongle mechanical envelope while delivering full protection coverage per USB-IF compliance requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-side protection switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AOZ1327DI-01 | Auto-restart fault recovery (64 ms interval); identical pinout, RON, OVP, TRCB, and thermal specs. | Suitable for non-safety-critical consumer ports where automatic recovery after transient fault is acceptable. | Select AOZ1327DI-01 only if system firmware can tolerate brief power interruption and uncontrolled restarts. |
| TPS25750RWER | Integrated USB PD controller + protection switch; supports PD communication, CC logic, and programmable current limiting - not a standalone switch. | Replaces both PD controller and protection switch in new USB-C designs; requires firmware integration and CC line routing. | Choose TPS25750RWER only when full PD negotiation (e.g., variable voltage, role swap) is required - AOZ1327DI-02 is simpler for fixed-voltage pass-through. |
Compared with AOZ1327DI-02, the AOZ1327DI-01 offers identical protection features but lacks deterministic fault holdoff, making it unsuitable for certified docking stations. The TPS25750RWER adds protocol intelligence at the cost of design complexity and higher BOM cost - AOZ1327DI-02 delivers focused, verified protection with minimal footprint and zero firmware dependency.
Availability
AOZ1327DI-02 is available at Aetrix Electronics and suitable for USB-C docking stations, portable laptop power input stages, and desktop monitor VBUS management requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for AOZ1327DI-02 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Alpha and Omega Semiconductor (AOS) is a fabless power semiconductor company specializing in high-efficiency MOSFETs, power ICs, and advanced packaging for power conversion and protection.
The AOZ1327DI product line delivers ECPower™ high-side switches optimized for USB Type-C PD applications, combining low RON, precise fault detection, and thermally robust DFN packaging for compact, high-reliability power path control.
FAQ
What fault conditions trigger latch-off behavior in the AOZ1327DI-02?
The AOZ1327DI-02 enters latch-off state upon detection of VIN over-voltage (exceeding programmed OVP threshold), VOUT exceeding VIN by 26 mV (TRCB event), or junction temperature reaching 140°C (thermal shutdown). Once latched, the device remains disabled until ENB is toggled low-high or VIN is cycled - no automatic recovery occurs. This behavior is intrinsic to the AOZ1327DI-02 variant and is confirmed in the Rev. 1.4 datasheet Section "Auto-restart vs. Latch-off".
How does the AOZ1327DI-02 implement True Reverse Current Blocking (TRCB)?
The AOZ1327DI-02 uses an internal comparator to monitor the differential voltage between VOUT and VIN. When VOUT exceeds VIN by 26 mV (typical), the power switch turns off within 500 ns and pulls FLTB low. This action blocks reverse current before the body diodes of the back-to-back N-MOSFETs conduct, ensuring zero reverse leakage. The TRCB function operates independently of ENB state and is active during startup, steady-state, and fault conditions - a core feature of the AOZ1327DI-02.
Can the AOZ1327DI-02 be used with 5 V-only USB-C applications?
Yes - the AOZ1327DI-02 supports 5 V operation via its selectable OVP feature: leaving POVP open configures OVP at 5.8 V, providing 0.8 V headroom above nominal 5 V VBUS. Its 3.4–22 V input range, 20 mΩ RON, and ±8 kV IEC 61000-4-2 ESD rating make it suitable for legacy 5 V USB-C designs. The AOZ1327DI-02 also meets USB-IF surge immunity requirements without external components, simplifying 5 V-only implementations.
What is the minimum recommended soft-start capacitor value for the AOZ1327DI-02?
The AOZ1327DI-02 requires a minimum soft-start capacitor (CSS) of 0.23 nF on the SS pin to ensure stable ramp control. Typical designs use 2.7 nF to 5.6 nF to achieve 0.9–20 ms 10%–90% VOUT ramp times depending on VIN and OVP setting. Using less than 0.23 nF risks uncontrolled inrush and potential device stress during startup. This requirement is specified in the Rev. 1.4 datasheet Section "Soft-Start Slew-Rate Control" and validated across temperature and process corners.
How should the exposed thermal pad (EXP) of the AOZ1327DI-02 be connected on the PCB?
The EXP pad of the AOZ1327DI-02 must be electrically isolated and connected to a dedicated, floating copper pour on the top layer, then stitched to inner-layer thermal islands and bottom-layer thermal pads using ≥8 vias (0.3 mm diameter minimum). All connected copper areas must be isolated from other nets. This configuration achieves optimal thermal resistance (θJA = 36°C/W) and sustains 8 A continuous current. Layout guidelines are detailed in the Rev. 1.4 datasheet Pages 11–12 and Figure 24–27.
AOZ1327DI-02 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Alpha & Omega Semiconductor Inc.
- Package/Case:
- 12-VFDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Switch Type:
- USB Switch
- Number of Outputs:
- 1
- Ratio - Input:Output:
- 1:1
- Output Configuration:
- High Side
- Output Type:
- N-Channel
- Interface:
- On/Off
- Voltage - Load:
- 3.4V ~ 22V
- Voltage - Supply (Vcc/Vdd):
- Not Required
- Current - Output (Max):
- 8A
- Rds On (Typ):
- 20mOhm
- Input Type:
- Non-Inverting
- Features:
- Slew Rate Controlled, Status Flag
- Fault Protection:
- Over Temperature, Over Voltage, Short Circuit, UVLO
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 12-DFN (3x3)
AOZ1327DI-02 FAQ
1.How can I place an order for AOZ1327DI-02 through Aetrix?
Please submit a Request for Quotation (RFQ) for AOZ1327DI-02 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for AOZ1327DI-02 reliable?
The price and inventory of AOZ1327DI-02 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for AOZ1327DI-02 is usually 5 days.
3.What payment methods are accepted for AOZ1327DI-02?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for AOZ1327DI-02 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for AOZ1327DI-02?
AOZ1327DI-02 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your AOZ1327DI-02 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for AOZ1327DI-02?
For technical support, including AOZ1327DI-02 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your AOZ1327DI-02 requirements.
6.How does Aetrix verify that AOZ1327DI-02 is sourced from the original manufacturer or authorized distributors?
All AOZ1327DI-02 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that AOZ1327DI-02 meets industry standards.
7.What is the process for return or replacement of AOZ1327DI-02?
All AOZ1327DI-02 units undergo pre-shipment inspection (PSI). If there is an issue with AOZ1327DI-02, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The AOZ1327DI-02 part is unused and in its original packaging.
Return procedure for AOZ1327DI-02:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
AOZ1327DI-02 Tags
-
TPS22919DCKR
Texas Instruments
-
MIC2091-1YM5-TR
Microchip Technology
-
MIC2090-1YM5-TR
Microchip Technology
-
TPS22995RZFR
Texas Instruments
-
TPS22975DSGR
Texas Instruments
-
SIP32510DT-T1-GE3
Vishay Siliconix
-
ULN2003D1013TR
STMicroelectronics
-
MIC2005A-1YM5-TR
Microchip Technology
-
MIC2005A-1YM6-TR
Microchip Technology
-
TPS22916BYFPR
Texas Instruments
-
TPS22917DBVR
Texas Instruments
-
ULN2003APWR
Texas Instruments
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
