Diodes Incorporated AP1086D18G-13

Overview

AP1086D18G-13 from Diodes Incorporated is a fixed-output 1.8V, 1.5A low dropout linear regulator in TO252-3L package with 1.4V max dropout at full load, ±1.5% output voltage tolerance at 25°C, and integrated thermal shutdown and current limiting. It delivers stable 1.8V supply for low-voltage logic such as DDR memory termination and FPGA core rails.

For engineers reviewing the AP1086D18G-13 datasheet, AP1086D18G-13 pinout, AP1086D18G-13 application, or AP1086D18G-13 equivalent, key selection criteria include dropout voltage under 1.5A load, output stability with ≥10µF tantalum/aluminum capacitor, thermal resistance (θ_JA = 101°C/W), and compatibility with 4.7–12V input sources for 1.8V rail generation.

Technical Context

The AP1086D18G-13 implements a PNP-based LDO architecture with internal 1.25V reference and feedback divider hardwired for 1.8V output. Its control loop is optimized for fast transient response to load steps up to 1.5A, maintaining ≤±33mV load regulation across 0–1.5A at 5V input.

Thermal protection activates at 150°C junction temperature, and current limiting engages at ≥1.6A when (V_IN−V_OUT) = 5V. Stability requires ≥10µF output capacitance with ESR < 1Ω; typical designs use 100µF aluminum electrolytic or tantalum.

Key Specifications

Pinout & Package

AP1086D18G-13 uses the TO252-3L (DPAK) surface-mount package with exposed thermal pad connected internally to V_OUT. The package measures 6.58mm × 9.70mm × 2.25mm and is RoHS-compliant with green molding compound.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-output LDO regulator applications.

Compared with AP1086D18L-13, the G-suffix offers stricter halogen-free compliance; versus LD1117S18TR, AP1086D18G-13 provides 50% higher current capacity and 33% lower thermal resistance, enabling direct replacement in thermally demanding 1.5A designs without heatsink redesign.

Availability

AP1086D18G-13 is available at Aetrix Electronics and suitable for DDR memory termination, FPGA I/O supply, VGA card logic rails, and industrial sensor interface applications requiring stable component supply and long-term manufacturability.

Supply support for AP1086D18G-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for industrial, computing, and consumer markets.

The AP1086 product line delivers high-current, low-dropout linear regulators optimized for noise-sensitive, high-transient digital systems-specifically targeting DDR termination, FPGA/CPU core rails, and legacy VGA graphics power.

FAQ

What is the minimum input voltage required for AP1086D18G-13 to regulate at 1.8V?

The device requires VIN ≥ VOUT + 1.4V = 3.2V to maintain regulation at full 1.5A load. At lighter loads, dropout decreases; for example, at 100mA, dropout drops to ~0.3V, allowing operation from 2.1V input. Input must remain ≥3.2V under worst-case load and temperature conditions.

Can AP1086D18G-13 be used in adjustable mode?

No. The AP1086D18G-13 is a fixed 1.8V variant with internal feedback resistors masked during fabrication. Only the AP1086-ADJ (e.g., AP1086DXXG-13 with blank suffix) supports external resistor adjustment from 1.25V to VIN−1.4V.

Is an input capacitor mandatory for stable operation?

While not strictly required for loop stability, a ≥100µF aluminum or tantalum input capacitor is strongly recommended to limit VIN sag during 1.5A load transients. Without it, input voltage droop may fall below the dropout threshold, causing temporary regulation loss and potential system reset.

How does the TO252-3L thermal pad connection affect PCB layout?

The exposed thermal pad (connected to VOUT) must be soldered to a dedicated copper pour with ≥4 thermal vias (0.3mm diameter) to an inner ground or power plane. This reduces θ_JA by up to 30°C/W and prevents thermal shutdown during sustained 1.5A operation at ambient temperatures above 50°C.