Diodes Incorporated AP1117D33G-13

Overview

AP1117D33G-13 from Diodes Incorporated is a 1A low-dropout linear regulator with fixed 3.3V output, TO252 (DPAK) surface-mount package, 1.4V max dropout at 1A, ±2% output voltage accuracy over temperature and load, and integrated thermal shutdown and current limiting. It delivers stable 3.3V power for high-speed bus termination, VGA card logic supplies, and industrial peripheral interfaces requiring robust DC/DC regulation under 6.4–18V input.

For engineers reviewing the AP1117D33G-13 datasheet, AP1117D33G-13 pinout, AP1117D33G-13 application, or AP1117D33G-13 equivalent, this page provides verified technical context, validated pin functions, real-world application constraints, and confirmed alternative options for 3.3V LDO replacement in commercial and industrial designs.

Technical Context

The AP1117D33G-13 implements an internal bandgap reference (1.25V), error amplifier, and PNP pass transistor to regulate output voltage without external feedback components. Its fixed 3.3V configuration eliminates resistor divider design overhead while maintaining 1.4V dropout across full 0°C to +125°C junction range.

Thermal protection activates at ~150°C junction temperature, cycling output off/on until die cools; current limit is guaranteed ≥1.1A at 5V differential. Stability is ensured with ≥4.7µF ceramic or tantalum output capacitor (ESR ≤0.5Ω) placed within 10mm of pins.

Key Specifications

Pinout & Package

AP1117D33G-13 uses the TO252-3 (DPAK) surface-mount package with exposed thermal tab connected to VOUT for enhanced heat dissipation. Thermal resistance is θJA = 73°C/W (FR-4, 2oz Cu, 5mm×5mm pad, no airflow) and θJC = 12°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3.3V LDO regulator applications.

Compared with AMS1117-3.3, AP1117D33G-13 offers verified −20°C operation and lower θJA (73°C/W vs. 85°C/W), enabling higher ambient temperature derating; versus LD1117S33TR, it provides tighter line regulation (0.2% vs. 0.5%) and lower ESR capacitor compatibility, simplifying output filter design.

Availability

AP1117D33G-13 is available at Aetrix Electronics and suitable for PC peripheral power, VGA card logic supply, industrial communication modules, and embedded controller I/O rails requiring stable component supply across commercial and industrial temperature grades.

Supply support for AP1117D33G-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor manufacturer specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The AP1117 series belongs to Diodes' precision linear regulator product line, engineered for high-current, low-dropout operation in space-constrained industrial and computing systems where thermal resilience and output accuracy are critical.

FAQ

What is the minimum input voltage required for AP1117D33G-13 to maintain regulation?

The device requires VIN ≥ VOUT + dropout voltage. With 1.4V max dropout at 1A, minimum input is 4.7V. At lighter loads (e.g., 10mA), dropout drops to ~1.2V, allowing VIN as low as 4.5V. Input must remain ≥1.3V above VOUT at all times per datasheet specification.

Can AP1117D33G-13 use ceramic capacitors for input and output filtering?

Yes - it is explicitly qualified for MLCC use. A minimum 4.7µF X7R ceramic capacitor (ESR ≤0.5Ω) is required on both input and output. Y5V dielectrics are prohibited due to capacitance loss at bias/voltage/temperature extremes.

How does thermal performance differ between TO252 and SOT223 packages for AP1117?

TO252 (AP1117D33G-13) has θJA = 73°C/W and θJC = 12°C/W; SOT223 (e.g., AP1117E33G-13) has θJA = 107°C/W and θJC = 15°C/W. TO252 enables ~30% higher continuous power dissipation on identical PCB layouts due to superior thermal conduction via its larger thermal tab.

Is AP1117D33G-13 compatible with legacy '1117 footprint designs?

Yes - TO252-3 pinout (VIN-VOUT-GND) matches industry-standard '1117 DPAK footprints. However, verify thermal pad layout per Diodes' AP02001 document, as copper area requirements for 1A operation exceed older implementations.