Diodes Incorporated AP130-33YG-13

Overview

AP130-33YG-13 from Diodes Incorporated is a fixed 3.3V, 300mA low-dropout linear regulator in SOT89-3L package with 400mV dropout at full load, 50µA quiescent current, and ±2% output voltage accuracy-designed for battery-powered wireless modules requiring stable low-noise supply under variable load.

For engineers reviewing the AP130-33YG-13 datasheet, AP130-33YG-13 pinout, AP130-33YG-13 application, or AP130-33YG-13 equivalent, key selection criteria include dropout performance at 300mA, thermal resistance (θ_JA = 100°C/W), PSRR (58dB @100Hz), short-circuit fold-back protection, and green RoHS-compliant packaging.

Technical Context

The AP130-33YG-13 integrates a PMOS pass element with no base current draw, enabling ultra-low quiescent current across 0–300mA load range. Its internal bandgap reference and error amplifier deliver tight regulation (±2% V_OUT) and fast transient response to load steps.

Protection circuitry includes thermal shutdown triggered above +125°C junction temperature and current-limit fold-back that reduces short-circuit current to 150–300mA-preventing thermal runaway during sustained fault conditions without external components.

Key Specifications

Pinout & Package

SOT89-3L package: 3-pin surface-mount, thermally enhanced leadframe with exposed tab (pin 2 connected to GND internally); footprint matches JEDEC TO-243AA standard; recommended pad layout per AP02007.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar fixed-output LDO regulator applications.

Compared with MCP1700-3302E/TO and TPS7333QP, the AP130-33YG-13 delivers optimal balance of 300mA capability, 400mV dropout, and 50µA I_Q in a compact SOT89-3L package-making it ideal for space-constrained, battery-sensitive designs where moderate load current and thermal efficiency are prioritized.

Availability

AP130-33YG-13 is available at Aetrix Electronics and suitable for wireless sensor nodes, USB peripheral power supplies, and industrial I/O modules requiring stable component supply with guaranteed long-term availability and green RoHS compliance.

Supply support for AP130-33YG-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global semiconductor company specializing in discrete, analog, and mixed-signal solutions for power management, signal integrity, and connectivity applications.

The AP130 series belongs to Diodes' precision LDO portfolio targeting portable and battery-operated equipment-designed to maximize runtime while maintaining tight output regulation under dynamic load conditions.

FAQ

What is the minimum input voltage required for AP130-33YG-13 to maintain regulation at 300mA?

The AP130-33YG-13 requires VIN ≥ VOUT + VDROP = 3.3V + 0.4V = 3.7V to sustain 300mA output current while staying within ±2% regulation. Below 3.7V, output voltage drops linearly with input; datasheet specifies dropout measured at constant junction temperature using pulsed testing.

Can AP130-33YG-13 be used without an output capacitor?

No. A minimum 10µF ceramic capacitor is mandatory between OUT and GND to ensure stability across all operating conditions. Omitting it causes oscillation and potential damage. The capacitor must be placed within 2mm of the OUT pin with low-ESR (<100mΩ) and rated for ≥6.3V.

How does the current limit fold-back behavior protect the device during short circuits?

When VOUT falls below 1.05V (indicating short circuit), the AP130-33YG-13 reduces output current to 150–300mA instead of holding 300mA-limiting power dissipation to ≤1W even at VIN = 5.5V. This prevents thermal runaway and allows safe auto-recovery once fault is removed.

Is the SOT89-3L package of AP130-33YG-13 thermally compatible with reflow soldering per J-STD-020?

Yes. The SOT89-3L package is qualified for standard Pb-free reflow profiles (peak 260°C, 60s max above 217°C). The exposed tab must be soldered to ≥100mm² of 2oz copper on the PCB to achieve the specified θJA = 100°C/W; insufficient copper area increases junction temperature by up to 40°C.